秸秆微晶纤维素用作片剂崩解剂的初步评价

对实验室自制秸秆微晶纤维素用作片剂崩解剂进行了初步评价。参照《中国药典》(2010版)中微晶纤维素的有关规定,评估自制秸秆微晶纤维素的质量;以阿司匹林为模型药物,以市售微晶纤维素(PH-101)为对照,测定秸秆微晶纤维素的溶胀性、崩解性。结果表明,自制的秸秆微晶纤维素质量符合《中国药典》有关规定,且溶胀性和崩解性优于市售微晶纤维素(PH-101),可用作片剂崩解剂。在秸秆微晶纤维素含量为20%时,崩解速度最快。     

Computational Fluid Dynamics Study on a Top-Blown Smelting Process with Lance Failure in an Isa Furnace

JOM - The Isa/Ausmelt smelting technology with a top submerged lance (TSL) has been extensively used in copper smelting processes. However, the TSL is extremely vulnerable to damage and failure...     

炼油达标污水回用处理试验研究

采用曝气生物滤池、多介质过滤、超滤、反渗透工艺,对炼油达标外排污水进行回用处理中试试验。结果表明,曝气生物滤池对油、COD和浊度去除效果良好,超滤、反渗透膜化学清洗周期达到 2个月以上,脱盐率稳定在98％以上,产水品质达到回用要求。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

高压气体流量测量中流量计的选择和应用

结合高压气体流量测量的实际使用情况,根据使用对象和范围,对几种适合工作要求的流量计的特点进行了分析比较,重点介绍了热式质量流量计和Coriolis力质量流量计的原理,以及它们在研制工作中的应用情况和需要注意的问题.     

互联网通信技术的应用研究

介绍了互联网通信技术的特点、应用和发展,提出了一些新的方法,解决了互联网通信过程中的信息访问资源浪费、信息阻塞和信道负担增加的问题。     

Generalized multiuser orthogonal space-division multiplexing

This paper addresses the problem of performing orthogonal space-division multiplexing (OSDM) for downlink, point-to-multipoint communications when multiple antennas are utilized at the base station (BS) and (optionally) all mobile stations (MS). Based on a closed-form antenna weight solution for single-user multiple-input multiple-output communications in the presence of other receiver points, we devise an iterative algorithm that finds the multiuser antenna weights for OSDM in downlink or broadcast channels. Upon convergence, each mobile user will receive only the desired activated spatial modes with no cochannel interference. Necessary and sufficient conditions for the existence of OSDM among the number of mobile users, the number of transmit antennas at the BS, and the number of receive antennas at the MS, are also derived. The assumption for the proposed method is that the BS knows the channels for all MS's and that the channel dynamics are quasi-stationary.