Microstructure and transport properties of [0 0 1]-tilt bicrystal grain boundaries in iron pnictide superconductor,cobalt-doped BaFe2As2

Relationships between microstructure and transport properties of bicrystal grain boundary (BGB) junctions were studied in cobalt-doped BaFe₂As₂ (BaFe₂As₂:Co) epitaxial films grown on [0 0 1]-tilt bicrystal substrates of MgO and (La, Sr)(Al, Ta)O₃ with misorientation angles θ_GB = 3–45°. The θ_GB of BaFe₂As₂:Co BGBs were exactly transferred from those of the bicrystal substrates. No segregation of impurities was detected at the BGB junction interfaces, and the chemical compositions of the BGBs were uniform and the same as those in the bulk film regions. A transition from a strongly-coupled GB behavior to a weak-link behavior was observed in current density–voltage characteristics under self-field around θ_GB ～ 9°. The critical current density decreased from (1.2–1.6) × 10⁶ A/cm² of the intragrain transport to (0.7–1.1) × 10⁵ A/cm² of θ_GB = 45° because supercurrent becomes more governed by Josephson current with increasing θ_GB.     

Effect of hydration on electrical conductivity of DNA duplex: Green’s function study combined with DFT

The electrical conductivity of DNA duplex is affected by many factors such as DNA base sequence, hydration of DNA duplex, connecting configuration between DNA duplex and electrodes, thermal fluctuation of DNA duplex structure. We here investigate the electrical conducting properties of DNA duplexes sandwiched between Au electrodes by molecular simulations using nonequilibrium Green’s function method coupled with density functional theory. The results reveal the dependence of electrical conductivity on DNA base sequence as well as hydration, which are in qualitative agreement with experiment. The present results indicate the important role played by hydrating water molecules in the electrical conductivity through DNA duplexes.     

A mean-field micromechanical model of thermal-ratcheting behavior in short fiber-reinforced metal matrix composites

Thermal-ratcheting behavior in short fiber-reinforced metal matrix composites has been investigated. The internal stresses due to mismatch in thermal expansion coefficients between the fiber and matrix in the composites can introduce anomalous deformation under thermal-cycling conditions with or without external mechanical loads. This study has resulted in a more comprehensive understanding of such thermal-ratcheting behavior in short fiber-reinforced composites subject to a wide range of external uniaxial loads based on a mean-field micromechanical model considering the local mass transfer by diffusion along the fiber–matrix interface. The validity of the model has been verified through systematic experiments with directionally solidified Al–Al₃Ni eutectic composites.     

Evolution of long-period stacking ordered structures on annealing as-cast Mg85Y9Zn6 alloy ingot observed by synchrotron radiation small-angle scattering

1. Download : Download high-res image (84KB)
2. Download : Download full-size image

     

Automatic electron beam alignment adjustment system and automatic filament current adjustment system for electron beam welder

Recently, the electron beam welders with high acceleration voltage (more than 100 kV) and high electrical power (more than 15 kW) have been reviewed the role of the high-energy electron beam density again, due to space or aircraft development or automobile industry desired high productivity and high accurate welding for saving energy. NEC group have supplied these electron beam welders. This time, the automatic alignment adjustment system of the electron beam orbit and the automatic adjustment system of filament current were developed and put to a practical use. As a result, the great effectiveness for the stability of welding quality was apparent.     

Use of solid phase microextraction (SPME) for profiling the volatile metabolites produced by Glomerella cingulata

The profile of volatile organic compounds (VOCs) released from Glomerella cingulata using solid phase microextraction (SPME) with different fibers, Polydimethylsiloxane (PDMS), Polydimethylsiloxane/Divinylbenzene (PDMS/DVB), Carboxen/Polydimethylsiloxane (CAR/PDMS) and Divinylbenzene/Carboxen/Polydimethylsiloxane (DVB/CAR/PDMS), was investigated. C4-C6 aliphatic alcohols were the predominant fraction of VOCs isolated by CAR/PDMS fiber. Sesquiterpene hydrocarbons represented 20.3% of VOCs isolated by PDMS fiber. During the growth phase, Ochracin was produced in the large majority of VOCs. 3-Methylbutanol and phenylethyl alcohol were found in the log phase of it. Alcohols were found in cultures of higher age, while sesquiterpenes were found to be characteristic of initial growth stage of G. cingulata.     

Leak detection in pipe using transient flow and genetic algorithm

An inverse transient method with genetic algorithm (GA) was applied to leak detection in pipeline. Transient flow caused by valve operation was calculated using the characteristics method. The location and discharge of leak were determined so that the difference of the calculated pressure may be minimized from the reference pressure calculated under a given leak condition. Calculations were done for the leak at one and two locations in pipeline. Furthermore, the effect of noise in pressure data was discussed, and the leak locations and leak discharges can be predicted precisely even in the case of noisy data. This paper was presented at the 9^th Asian International Conference on Fluid Machinery (AICFM9), Jeju Korea, October 16–19, 2007.     

Void Metabolism

Since the Second World War, the urban fabric of Tokyo has been shaped by individual landownership and the proliferation of the detached house. For most Japanese architectural offices, domestic practice provides the mainstay of their work. This focus on the single private house, though, also limits the range of possibilities for urban interventions. Yoshiharu Tsukamoto of Atelier Bow-Wow explains how through its development of ‘Void Metabolism’, the studio has been able to turn its focus on the residential into a positive, breaking down the barriers between private and shared space in the city.     

The influence of solder composition on the impact strength of lead-free solder ball grid array joints

This study aims to investigate the shear and tensile impact strength of solder ball attachments. Tests were conducted on Ni-doped and non-Ni-doped Sn-0.7wt.% Cu, Sn-37wt.% Pb and Sn-3.0wt.% Ag-0.7wt.% Cu solder ball grid arrays (BGAs) placed on Cu substrates, which were as-reflowed and aged, over a wide range of displacement rates from 10 to 4000 mm/s in shear and from 1 to 400 mm/s in tensile tests. Ni additions to the Sn-0.7wt.% Cu solders has slowed the growth of the interface intermetallic compounds (IMCs) and made the IMC layer morphology smooth. As-reflowed Ni-doped Sn-0.7wt.% Cu BGA joints show superior properties at high speed shear and tensile impacts compared to the non-Ni-doped Sn-0.7wt.% Cu and Sn-3.0wt.% Ag-0.7wt.% Cu BGAs. Sn-3.0wt.% Ag-0.7wt.% Cu BGAs exhibit the least resistance in both shear and tensile tests among the four compositions of solders, which may result from the cracks in the IMC layers introduced during the reflow processes.     

Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface

This study examines the epitaxial growth of the intermetallic compound (IMC) of Cu₆Sn₅ (or (Cu,Ni)₆Sn₅) that forms at the interface between molten Sn-based lead-free solders and non-textured polycrystalline Cu substrates. Sn, Sn–Cu, Sn–Cu–Ni and Sn–Ag–Cu solders were investigated. The dominant growing planes in a hexagonal structure of this IMC on Cu substrates are (101) and (102). Addition of trace Ni into Sn–Cu solders leads to an increase in (101) growth and a decrease in (102) growth. The presence of Ag in Sn–Ag–Cu solders facilitates (102) growth and suppresses (101) growth. Such an epitaxial growth should have a large influence on the mechanical and electrical characteristics of the Sn-based solder/Cu joints.