Avalanche multiplication in a compact bipolar transistor model forcircuit simulation

A simple weak avalanche model valid in a wide range of voltages and currents, is presented. The proposed model is derived by using the base-collector depletion capacitance for predicting the avalanche current. The model needs only one additional transistor parameter; the extraction method and temperature dependence of this parameter are discussed. The decrease in avalanche current for high collector current densities may originate from internal device heating, a voltage drop in the epilayer, or mobile carriers in the depleted part. From experimental results it is concluded that, below a critical hot-carrier current, the decrease in avalanche current due to mobile carriers is negligible     

Low-thermal expansion polycrystalline tantalum tungstate ceramics

The synthesis of thermal-shock-resistant materials from the system Ta₂O₅WO₃ was investigated. Ta₂WO₈ had a very low unit-cell thermal expansion coefficient (+0.5 X 10^–6° C^–1). Ta₃₀W₂O₈₁ also had a relatively low coefficient (+4.0 X 10^–6 ° C^–1) and a thermal durability over 1600° C. The thermal expansion curves of these polycrystalline ceramics were lowered because of microcracks caused by the large thermal expansion anisotropy of the crystal axes and were accompanied by hysteresis loops. The densification of Ta₂WO₈ ceramic was promoted by the addition of some metal oxides, and the strong ceramic of Ta₃₀W₂O₈₁ was obtained by controlling grain growth.     

Structure observations by high-resolution electron microscopy of Ni-B melt-spun alloys (B<30 at%)

The microstructure of a series of Ni-B alloys (15 at%3B phase (a=0.44 nm,b=0.52 nm,c=0.66 nm) is expected. High-resolution electron microscopy images of Ni-25 at% B rapidly quenched indicate that a two-phase structure is observed. A metastable phase is observed with a periodicity of 1.0 nm. HREM images and EELS analyses led us to propose the structure of this metastable phase. This phase (Ni₅B₂) is correlated with the monoclinic Hägg carbide Fe₅C₂. Depending on the velocity of the substrate and on the boron concentration, a variety of microstructures has been observed from a faulted to a semi-amorphous structure. The structures are related to the solidification behaviour and the heat flow in the undercooled melt. Particular attention was paid to the eutectic Ni-Ni₃B composition.     

Transparent monolithic zirconia gels: effects of acetylacetone content on gelation

Transparent yttria-stabilized zirconia monolithic gels were synthesized under controlled conditions for hydrolysis and chemical polymerization. The influence of acetylacetone on the previous chemical reactions was explored, and a plausible explanation was proposed concerning the outstanding role of this additive during the gelation process. Small-angle X-ray scattering was used to estimate the size of the polymeric species and to investigate the influence of acetylacetone on the structure of the gels prepared.     

Grain boundary resistivity in Y-TZP materials as a function of thermal history

Grain-boundary resistivity in yttria-containing tetragonal zirconia polycrystalline (Y-TZP) materials dominates the total resistivity. Impedance measurements combined with microstructural studies suggest that post-sintering heat treatments (in particular the cooling rate) influence the location of the grain-boundary phase which, in turn, has a significant effect on the grain-boundary resistivity. Higher cooling rates from the sintering temperature lead to reduction in the grain-boundary resistivity. In both alumina-containing and relatively pure tetragonal zirconia polycrystals, post-sintering heat treatments have a less conspicuous effect. The activation energy associated with the grain-boundary resistivity was independent of the post-sintering heat treatments but was 25 to 30 kJ mol^–1 higher than that for the oxygen-ion conduction within the grains at low temperatures.