The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

The microstructure, tensile, and creep behavior of bulk Sn-3.5Ag solder were studied as a function of cooling rate. Controlled cooling rates were obtained by cooling specimens in different media: water, air, or furnace. The cooling rate significantly affected secondary dendrite arm size and spacing of the tin-rich phase, as well as the morphology of Ag₃Sn. Ag₃Sn was relatively spherical at the fastest cooling rate and had a needle-like morphology at the slowest cooling rate. Both the yield strength in tension and creep resistance of Sn-3.5Ag solder increased with increasing cooling rate while the strain-to-failure decreased. In this study, the mechanical behavior was correlated with the observed microstructure, creep-stress exponents, and fracture behavior, in order to understand the underlying damage mechanisms. For more information, contact N. Chawla, Arizona State University, Department of Chemical and Materials Engineering, P.O. Box 876006, Tempe, AZ, 85287-6006; (480) 965-2402; fax (480) 965-0037; e-mail nchawla@asu.edu.     

Creep deformation behavior of Sn-3.5Ag solder at small length scales

To adequately characterize the behavior of solder spheres in electronic packaging, their mechanical behavior needs to be studied at small-length scales. The creep behavior of single Sn-3.5Ag solder spheres on a copper substrate was studied between 25°C and 130°C using a microforce testing system. In the low-stress regime, the creep stress exponent changed from 6 at lower temperatures to 4 at higher temperatures, indicating creep by dislocation climb. The activation energy for creep was also found to be temperature dependent, and correlated with values for dislocation core diffusion and lattice diffusion in pure tin. A change in the stress exponent with increasing stress was also observed and explained in terms of a threshold stress for dislocation motion, due to the presence of obstacles in the form of Ag₃Sn particles. For more information, contact N. Chawla, Arizona State University, Department of Chemical and Materials Engineering, Ira A. Fulton School of Engineering, Tempe, AZ 85287-6006; e-mail nchawla@asu.edu.     

Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

The effect of cooling rate on microstructure and creep behavior of bulk, eutectic Sn-3.5Ag solders was studied. The cooling rate is an important processing variable that significantly affects the microstructure of the solder and therefore determines its mechanical behavior. Controlled cooling rates were obtained by cooling specimens in different media: water, air, and furnace, which resulted in cooling rates of 24°C/s, 0.5°C/s, and 0.08°C/s, respectively. The cooling rate decreased the secondary dendrite arm size and the spacing of the Sn-rich phase, as well as the morphology of Ag₃Sn. The Sn-dendrite arm size and spacing were smaller at fast cooling rates, while slower cooling rates yielded a nearly eutectic microstructure. The morphology of Ag₃Sn also changed from relatively spherical, at faster cooling rates, to needlelike for slower cooling. The effect of cooling rate on creep behavior was studied at 25°C, 60°C, 95°C, and 120°C. Faster cooling rates were found to increase the creep strength of the solder due to the refinement of the solder microstructure. Stress exponents, n, indicated that dislocation climb was the controlling mechanism. Activation energies, for all cooling rates, indicated that the dominant diffusional mechanism corresponded to dislocation pipe diffusion of Sn. Grain boundary sliding (GBS) measurements were conducted, using both scanning electron microscopy (SEM) and atomic force microscopy (AFM). It was observed that GBS had a very small contribution to the total creep strain.     

Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder

The tensile behavior and microstructure of bulk, Sn-3.5Ag solders as a function of cooling rate were studied. Cooling rate is an important processing parameter that affects the microstructure of the solder and, therefore, significantly influences mechanical behavior. Controlled cooling rates were obtained by cooling specimens in different media: water, air, and furnace. Cooling rate significantly affected secondary dendrite-arm size and spacing of the Sn-rich phase, as well as the aspect ratio of Ag₃Sn. The Sn-rich dendrite-arm size and spacing were smaller for water-cooled specimens than for air-cooled specimens. Furnace cooling yielded a nearly eutectic microstructure because the cooling rate approached equilibrium cooling. The morphology of Ag₃Sn also changed from spherical, at a fast cooling rate, to a needlelike morphology for slower cooling. The changes in the microstructure induced by the cooling rate significantly affected the mechanical behavior of the solder. Yield strength was found to increase with increasing cooling rate, although ultimate tensile strength and strain-to-failure seemed unaffected by cooling rate. Cooling rate did not seem to affect Young’s modulus, although a clear coorelation between modulus and porosity was obtained. The mechanical behavior was correlated with the observed microstructure, and fractographic analysis was employed to elucidate the underlying damage mechanisms.     

An analysis of strain in chip breaking using slip-line field theory with adhesion friction at chip/tool interface

A slip-line field model for orthogonal cutting with step-type chip breaker assuming adhesion friction at chip/tool interface is developed using Kudo's basic slip-line field. An alternative method is suggested for estimation of breaking strain in the chip. The model proposed predicts that with decrease in distance of chip breaker from the cutting edge of the tool, the breaking strain and shear strain in the secondary deformation zone increase while the total plastic strain decreases. The breaking of the chip is found to be solely dependent on the breaking strain, and not on ‘material damage’ or the specific cutting energy. The chip radius of curvature, cutting ratio, range of position of chip breaker for effective chip breaking are computed. The calculated results are found to be in general agreement with experimental measurements.     

Explosive shock-compression processing of titanium aluminide/titanium diboride composites

Explosive shock-compression processing is used to fabricate Ti₃Al and TiAl composites reinforced with TiB₂. The reinforcement ceramic phase is either added as TiB₂ particulates or as an elemental mixture of Ti + B or both TiB₂ + Ti + B. In the case of fine TiB₂ particulates added to TiAl and Ti₃Al powders, the shock energy is localized at the fine particles, which undergo extensive plastic deformation thereby assisting in bonding the coarse aluminide powders. With the addition of elemental titanium and boron powder mixtures, the passage of the shock wave triggers an exothermic combustion reaction between titanium and boron. The resulting ceramic-based reaction product provides a chemically compatible binder phase, and the heat generated assists in the consolidation process. In these composites the reinforcement phase has a microhardness value significantly greater than that of the intermetallic matrix. Furthermore, no obvious interface reaction is observed between the intermetallic matrix and the ceramic reinforcement.     

Experimental comparisons for bottom reflooding in tight LWHCR and standard LWR geometries

The NEPTUN test facility is currently being used for reflooding experiments in tight hexagonal geometry, representative of light water high conversion reactors (LWHCRs). Results of parametric studies, based on over sixty forced-feed bottom reflooding experiments carried out with the NEPTUN-III (p / d = 1.13) test bundle, show that flooding rate is the most important, single thermal-hydraulics parameter.Direct comparisons with earlier NEPTUN experiments in standard LWR geometry indicate — on the basis of pressure difference considerations — that much smaller flooding rates may be expected to occur in tight LWHCR cores. The corresponding NEPTUN-III experiments show long-lasting rod surface temperature excursions with relatively high maximum temperatures being reached, and some of the more detailed experimental data collected is used to explain this behaviour. In spite of the above, rewetting of the tight-LWHCR geometry bundle was found to occur in all experiments with reasonably LWHCR-representative values for the various thermal-hydraulics parameters.