Low temperature solid–liquid interdiffusion wafer and die bonding based on PVD thin Sn/Cu films

Microsystem Technologies - Cu–Sn intermetallic diffusion has been studied with thin Sn and Cu films deposited by physical vapor deposition. It was found that annealing time is critical to the...     

Copper sulfides obtained by spray pyrolysis — Possible absorbers in solid-state solar cells

Copper sulfide (Cu_xS, x = 1.8-2) thin films were deposited at 285 °C by spray pyrolysis from aqueous and alcoholic solutions of copper (II) chloride and thiourea with different Cu:S molar ratio. The XRD analysis showed that deposited films are chemically close to chalcocite (Cu₂S) or to mixtures of copper-rich phases (Cu₂S, Cu_1.8S, Cu_1.9375S) in which chalcocite or digenite (Cu_1.8S) is predominant. The films containing the single phase Cu₂S are denser and more homogenous than the films formed by two or more phases. The current-voltage (I-V) dark curves showed the diode behavior of the films, depending on the film thickness.     

Monolithically integrated two-dimensional arrays of surface-emitting photonic-crystal terahertz lasers

We demonstrate two-dimensional arrays of surface-emitting THz frequency photonic-crystal quantum cascade lasers covering a broad spectral range. The arrays are made of 16 unit elements, each of them spectrally single mode and featuring a narrow divergence emission pattern. The array emission frequencies cover a range of ≈0.2 THz around an emission frequency of ≈2.75 THz. Large size and small size devices have been developed. The former devices operate up to a maximum temperature of ≈90K with 2 to 3 mW output power in continuous wave regime.     

Phenolic extracts of cachaça aged in different woods and quantifying antioxidant activity and antifungal properties

The antioxidant and antifungal activities of the phenolic compounds in different alcoholic extracts of aged cachaça were evaluated. The physico‐chemical analyses were performed in the Laboratório de Qualidade de Aguardente of the Universidade Federal de Lavras according to the methods of the Ministério Agricultura Pecuária e abastecimento. Total phenol content was determined by the Folin–Ciocalteu method, quantification of these compounds was performed by HPLC and antioxidant activities were determined by methods involving inhibition of the DPPH (1,1‐diphenyl‐2 picrylhydrazyl) radical, the β‐carotene/linoleic acid system, ABTS (2,2 azinobis‐[3‐ethyl‐6‐benzothiazolinesulfonic acid]) radical, reducing power and thiobarbituric acid. Determination of antifungal activity was accomplished through the technique of dissemination in discs using Aspergillus carbonarius, Aspergillus niger, Aspergillus flavus, Penicillium commune and Penicillium cladosporoides fungi at the Laboratório de Micologia de Alimentos. The values obtained for the phenolic compounds ranged from 0.41 to 9.69 mg L^?1; syringaldehyde, vanillic acid and gallic acid were predominant. A satisfactory antioxidant activity was observed in all of the tests with the alcoholic extracts. A moderate activity against P. commune and P. cladosporoides, but no inhibition of the growth of A. carbonarius, A. niger or A. flavus was observed. Copyright © 2016 The Institute of Brewing & Distilling     

Steel strips in the context of near net shape casting production

Following the replacement of ingots by continuously cast slabs the next logical step towards near net shape casting has been the development of thin slab casting machines. These are now beginning to match the quality and productivity levels possible with conventional machines. The next step in this evolution towards lower cost operation is high speed thin strip casting machines. The merits of twin roll casters versus belt casting machines for friction free casting of low carbon steels, suggest that a belt caster will be needed for achieving high productivities and associated cooling lengths required for the production of hot strip in the 5–20 mm thickness range.     

MEMS packaging process by film transfer using an anti-adhesive layer

A low cost and low temperature thin film packaging process based on the transfer of an electroplated Nickel 3D cap is proposed. This process is based on adhesion control of a thick molded cap Ni film on the carrier wafer by using a plasma deposited fluorocarbon film, on mechanical debonding and on adhesive bonding of the microcaps on the host wafer with BCB sealing rings. Mechanical characterizations show that the transferred microcaps have a high stiffness, a low stress and a high adhesion. Because this process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable for the encapsulation of micro and nano devices, circuits and systems elaborated on a large range of substrate materials.