A Novel Cu–GNPs Nanocomposite with Improved Thermal and Mechanical Properties

Classical powder metallurgy followed by either hot isostatic pressing(HIPing) or repressing–annealing process was used to produce Cu–graphene nanoplatelets(GNPs) nanocomposites in this work. A wet mixing method was used to disperse the graphene within the matrix. The results show that a uniform dispersion of GNPs at low graphene contents could be achieved, whereas agglomeration of graphene was revealed at higher graphene contents. Density evaluations showed that the relative density of pure copper and copper composites increased by using the post-processing techniques.However, it should be noticed that the efficiency of HIPing was remarkably higher than repressing–annealing process, and through the HIPing, fully dense samples were achieved. The Vickers hardness results showed that the reconsolidation steps can improve the mechanical strength of the specimens up to 50% owing to the progressive porosity elimination after reconsolidation. The thermal conductivity results of pure copper and composites at high temperatures showed that the postprocessing techniques could enhance the conductivity of materials significantly.     

Nonlinear static and dynamic behavior of three-lobe non-circular gas lubricated micro bearings at high operating temperatures and/or high rotational speeds

Microsystem Technologies - When micro-bearings are operated at high temperatures or high rotation speeds such that gas rarefaction occurs, the conventional Reynolds model is not accurate enough to...     

A Novel Nanoscale SOI MOSFET by Using a P-N Junction and an Electrically Hole Free Region to Improve the Electrical Characteristics

Silicon - In this paper, a SOI MOSFET is proposed using a P-N structure and an electrically hole-free region (EHFR-SOI). In this structure, to improve the electrical characteristics such as short...