一种改进的运动补偿三维小波视频编码方法

Choi等[1]提出的运动补偿三维子带编码方法是一种具有代表性的高效小波视频编码方法,其编码效率优于国际标准MPEG-2.但是该方法的运算复杂度高,编码时也没有充分利用小波图像的特点.为此,本文对该方法的两项关键技术进行了改进:采用像素域降采样运动估计技术以降低运算复杂度,采用改进的集分裂分层树(Set Partitioning in Hierarchical Trees,SPIHT)方法对三维时/空子带进行更高效的编码.实验结果表明,与原有的算法相比,本文的工作不仅降低了运算复杂度,也进一步提高了编码效率.     

One-, two-, and three-photon pumped lasing in a novel liquid dye salt system

We report the observation of one-, two-, and three-photon pumped lasing in the same medium, a novel liquid dye salt system when excited by pulsed 0.532-, 1.06-, and /spl sim/1.49-/spl mu/m coherent radiation pulses, respectively. Since the gain medium is a liquid and not a solution, it contains a significantly higher effective dye concentration and, therefore, is highly suitable for multiphoton pumped lasing and optical power limiting applications. The lasing spectra, temporal waveforms, near- and far-field intensity distributions, and output/input efficiency were measured under the conditions of one-, two-, and three-photon pump configurations.     

辐射敏感综合症--AT病研究进展

共济失调性毛细血管扩张综合症(AT)是一种单基因突变引起的遗传性疾病，表现为高辐射敏感性、进行性神经退变、免疫缺陷、早衰及易患癌症等。本文综述了AT病的研究概况，包括AT临床症状、AT基因的定位、结构与功能、辐射对AT细胞信号传导的影响、AT基因组不稳定性及基因治疗。     

固体润滑涂层的评价和使用

本文主要介绍了二硫化钼，石墨、聚四氟乙烯三种固体润滑涂层的特点以及润滑涂层摩擦磨损性能的评价手段和方法，以及台架试验和应用实例，提出了选用方法和步骤。     

精镗孔尺寸误差预测补偿技术的研究概况与趋势

提出了精镗孔尺寸误差预测补偿技术存在的主要问题，指出了今后所需研究的主要内容及关键技术。     

刚性圆板自由落体在水面上的冲击压力

本文对一个刚性圆板自由落体在水面上的冲击过程建立了比较精确的理论模型,并建立了相应的数值格式。计算结果与已有的实验结果符合良好,通过计算进一步给出了下落质量和下落高度对冲击压力峰值的影响。     

非接触型光外差轮廓仪

本文介绍一种纳米级非接触型高精度光外差轮廓仪,它是基于普通光路的光外差干涉仪。工件表面被两束有微小频差的激光束所照射,其中一束经聚焦后用作测量光探针来扫描工件表面,另一束则用作参考光束。两束光经表面反射后产生干涉。测量信号和参考信号的相位差与表面的微不平值成正比。仪器的横向分辨率为2μm,高度分辨率为1 nm,它不需要对试样作大范围的调整,且可用试样自身作参考面。信号经光电转换后由微型计算机进行处理,它能快速完成测量、计算、显示及打印出各种参数和曲线。     

Self-aligning planarization and passivation for integration applications in III-V semiconductor devices

This work reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage currents and planarization of the passivation material for metal interconnection and device integration. It is, however, challenging to planarize all devices at once. This technique offers wafer-scale passivation and planarization that is automatically leveled to the device top in the 1-3-/spl mu/m vicinity surrounding each device. In this method, a dielectric hard mask is used to define the device area. An undercut structure is intentionally created below the hard mask, which is retained during the subsequent polymer spinning and anisotropic polymer etch back. The spin-on polymer that fills in the undercut seals the sidewalls for all the devices across the wafer. After the polymer etch back, the dielectric mask is removed leaving the polymer surrounding each device level with its device top to atomic scale flatness. This integration method is robust and is insensitive to spin-on polymer thickness, polymer etch nonuniformity, and device height difference. It prevents the polymer under the hard mask from etch-induced damage and creates a polymer-free device surface for metallization upon removal of the dielectric mask. We applied this integration technique in fabricating an InP-based photonic switch that consists of a mesa photodiode and a quantum-well waveguide modulator using benzocyclobutene (BCB) polymer. We demonstrated functional integrated photonic switches with high process yield of >90%, high breakdown voltage of >25 V, and low ohmic contact resistance of /spl sim/10 /spl Omega/. To the best of our knowledge, such an integration of a surface-normal photodiode and a lumped electroabsorption modulator with the use of BCB is the first to be implemented on a single substrate.     

Structure evolution of conductive polymer composites revealed by solvent vapor induced time-dependent percolation

The authors of this paper synthesized a series of amphiphilic triblock copolymers of polystyrene-b-poly(ethylene glycol)-b-polystyrene (PS-PEG-PS) having different PEG/PS ratios with nearly identical molecular weights of the entire copolymers. The interfacial interactions in the composites consisting of carbon black and the copolymers can thus be tailored. When these conducting composites are exposed to certain solvent vapors, their electrical resistances greatly increase, showing the gas sensitivity. The present work indicated that this switching behavior is controlled by the structural relaxation of the composites because matrix swelling acts as the main mechanism. The response time has been correlated with absolute temperature by Arrhenius equation, and the estimated activation energy reflects mobility of the fillers involved in the solvent induced expansion of the surrounding polymer. Therefore, by using the gas sensibility of the conductive composites, the structure evolution of the composite materials in solid state and the effect of filler/matrix interfacial interaction on the relaxation property of the matrix polymer has been inspected. It was found that lower activation energy represents stronger interfacial interaction in case good solvent of the matrix was used for the test.     

Investigation of Infrared Photonic Crystal Slab with Defect Waveguides

This paper deals with the two dimensional (2-D) infrared photonic crystal slab with an air-bridge structure featuring defect waveguides in which the optical propagation properties were obtained by measurements of transmission spectra. 3-D finite-difference time-domain (FDTD) simulations have revealed the appearance of four defect propagation modes for the band structure and transmission spectra in the air-bridge slab. These defect modes were experimentally identified in the measured transmission spectra.