预处理短纤维对VMQ/EPDM共混导电橡胶某些性能的影响

研究了预处理短纤维用量对乙炔炭黑填充甲基乙烯基硅橡胶（ＶＭＱ）／ＥＰＤＭ共混硫化胶拉伸、撕裂、耐屈挠疲劳和导电性能的影响。实验结果表明，加入适量短纤维对ＶＭＱ／ＥＰＤＭ体系有一定的补强作用；纤维用量较大时，导电性能下降。加入４．０份左右的预处理短纤维，可使ＶＭＱ／ＥＰＤＭ共混导电橡胶获得良好的物理机械性能和导电性能     

Generating Web Traffic Based on User Behavioral Model

Generating web traffic is of great importance to analyze performance of new designed network, test new equipment, and verify new protocols, etc.. However, most existing traffic generation systems tend to simulate the overall characteristics of network traffic, while neglecting of the behavior of the individual users. Nevertheless, in principle, the emerged characteristics of overall traffic originate from the aggregation of individual users＇ access behavior. In this paper, we propose an innovative web traffic generating method based on user browsing behavior. Our method simulates the real users＇ accessing behavior, and visits the real web servers. Then, we design and develop a web traffic generating system. Because our system accesses the real websites, it can produce almost the real network traffic. The test results show that the traffic generated by our system has characteristics of burstiness and self-similarity, which are widely found and characterized in many real networks. In addition, our system can better reflect real user＇s web browsing behavior.     

Atmospheric Dependence on Dielectric Loss of 1/6Ba5Nb4O15· 5/6BaNb2O6 Ceramics

Samples of 1/6Ba₅Nb₄O₁₅·5/6BaNb₂O₆ along with the pure end members, Ba₅Nb₄O₁₅ and BaNb₂O₆, were sintered under low oxygen partial pressure. The degradation mechanisms of dielectric loss in this reducing atmosphere have been studied. We found that the degradation occurred primarily due to the formation of oxygen vacancies caused by the reduction of Nb⁵⁺. This was determined by measuring the electrical conductivity, and through X-ray photoelectron spectroscopy. More importantly, the dielectric loss of 1/6Ba₅Nb₄O₁₅·5/6BaNb₂O₆ samples with higher temperature stability was further decreased on sintering in a reducing atmosphere. This observation has been explained by considering the increased porosity and formation of a reduced second phase, Ba_0.65NbO₃.     

Selection of quaternary ammonium groups for optimizing properties of water‐soluble,photosensitive phenolic resins and study of their postcuring mechanism

This article deals with the selection of quaternary ammonium groups for synthesis of water‐soluble, photosensitive phenolic resins, containing acrylate and different quaternary ammonium salt groups (AQSPRs), via ring‐opening reactions of epoxy phenolic resin (EPR) with acrylic acid and with different tertiary amine‐protonic acid salts. Conversion of epoxy groups, solubility, photosensitive properties, and thermal decomposition of the different AQSPRs were compared. Modification of AQSPR with methanol solution of KOH to form phenolic resin containing both quaternary ammonium hydroxide groups and acrylate groups (AQHPR) was also studied. Characterization by IR spectrum, DSC, and thermal gravimetric analysis was carried out. The results showed that in the synthesis of AQSPRs containing different quaternary ammonium salt groups, the efficiency of ring‐opening reaction of epoxy phenolic resin with tertiary amine salt in terms of conversion of epoxy groups decreases in the following order: for the tertiary amine, N,N‐dimethyl benzylamine (DMBA) > triethylamine (TEA) > trimethylamine (TMA) > N,N‐dimethyl aniline (DMA) > triethanolamine (TENA) > tri(n‐butylamine) (TBA); for the protonic acid, HCl > HBr > HCOOH > HI > NaHSO₃ > Cl₃CCOOH > HClO₄ > HBF₄. All the AQSPRs except that from HClO₄ can be dissolved in water, methanol, DMF, or DMSO. The gel content formed during UV exposure decreases in the following order of acids used in forming quaternary ammonium salt groups: HCl > HCOOH > NaHSO₃ > Cl₃CCOOH; or decreases in the following order of tertiary amines or hydrohalic acids used in forming the quaternary ammonium groups: TMA. > TEA > DBMA; HCl > HBr > HI. During thermal decomposition of EPR with about half epoxy groups of EPR ring‐opened with tertiary amine salt at 160°C for 0.5 h, water‐insoluble product was formed. The insoluble content and the % decrease of epoxy groups or halide ions increase in the following order: TMA < TEA < DMBA; HCl < HBr < HI. The % decrease of epoxy groups for the insoluble residue is nearly equal to the % decrease of halide ions. A crosslinking reaction mechanism occurred in the thermal decomposition was thus proposed. During the modification of AQSPR with KOH, conversion of quaternary ammonium chloride groups can reach above 90%. The decomposition temperature of the quaternary ammonium groups was lowered from 204 to 120°C after modification of AQSPR with KOH. The photosensitive properties of the resin after modification became lower. It is better to react DMBA · HCl with EPR so as to obtain a product with higher conversion of epoxy groups, good water solubility, moderate photosensitivity, lower decomposition temperature, and better postcuring. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 2914–2922, 2004     

Sintering Behavior and Dielectric Properties of Bi3NbO7 Ceramics Prepared by Mixed Oxides and High-Energy Ball-Milling Methods

The sintering behavior and dielectric properties of Bi₃NbO₇ ceramics prepared by the high-energy ball milling (HEM) method and conventional mixed oxides method with V₂O₅ addition were investigated. All the samples were sintered between 840° and 960°C. For the ceramics prepared by the mixed oxides method, the pure tetragonal Bi₃NbO₇ phase formed without any cubic phase. With changing sintering temperature, the dielectric constant ɛ_r lies between 79 and 92, while the Q × f values are between 300 and 640 GHz. The samples sintered at 870°C have the best microwave dielectric properties with ɛ_r=79, Q × f =640 GHz, and the temperature coefficients of resonant frequency τ_f between 0 and −20 ppm/°C. For the ceramics prepared by the HEM, a pure cubic phase was obtained. The ɛ_r changes between 78 and 80 and Q × f were between 200 and 290 GHz.     

Latent catalyst effects in halogen‐free epoxy molding compounds for semiconductor encapsulation

Latent catalyst effects were investigated to improve the physical properties of halogen‐free epoxy molding compounds (EMCs) for semiconductor encapsulation. In this study, biphenyl‐type resins were used as the epoxy and hardener resin for halogen‐free EMCs to obtain high flame‐retardant properties and high filler contents. Latent catalyst effects were examined with two kinds of EMC compositions, halogen‐free EMCs and conventional EMC compositions. We used triphenylphosphine‐benzoquinone salt (TPP‐BQ) as a latent catalyst. Spiral flow and gel time were measured to investigate the change in moldability with the latent catalyst. We measured package fail, moisture absorption, and delamination for reliability evaluation and flexural strength, flexural modulus, and adhesion for mechanical properties to examine latent catalyst effects. An improvement in moldability, reliability, and the mechanical properties were observed in two types of halogen‐free EMCs with TPP‐BQ as a latent catalyst. These phenomena were seen in conventional EMCs, including o‐cresol novolac epoxy resin. The cure kinetics of these systems were investigated by differential scanning calorimetry with an isothermal approach to explain these phenomena. The results indicate that the improvement in moldability in halogen‐free EMCs with TPP‐BQ was due to the low conversion rate of this system, and the increase in mechanical properties was attributed to the high conversion of curing reaction. © 2005 Wiley Periodicals, Inc. J Appl Polym Sci 96: 2287–2299, 2005     

微波辐射对甲苯磺酸催化合成乙酸环己酯

以冰醋酸和环己醇为原料 ,环已烷为带水剂 ,对甲苯磺酸作催化剂 ,采用微波辐射技术 ,在常压下直接合成乙酸环己酯。最适宜反应条件为 :n(环己醇 )∶n(乙酸 ) =1 5∶1 0 ,对甲苯磺酸用量 0 2 0 g ,带水剂用量 5mL ,微波功率 5 95W ,辐射时间 15min ,产率达 97%以上     

网络社会信息安全保障技术研究

网络社会作为一种新型社会形态,是现实社会在网络空间中的延伸和反映,是随着信息技术不断发展而形成的一种新的社会形态。新信息技术的快速发展和普及,使其面临的信息安全问题也愈加突出。在对当前网络社会信息安全面临的问题和常用的安全保障技术分析的基础上,提出对网络进行网格化,并以网格为基础构建防护、监控和响应集成一体式技术保障体系,该方法可以把各网络的安全技术融合为一个整体来保障网络社会的的信息安全,实现协同防控的目的。     

新IT基础架构探讨

在互联网时代,各行业需要在"商业模式"和"体验"方面的创新,这使得IT变成了核心引擎,需要新的IT基础架构。     

PE-UHMW挤出中空吹塑设备与工艺的研究

改型设计了改性超高相对分子质量聚乙烯的挤出中空吹塑设备，设计采用了专用的挤出螺杆、机筒、模头和模具，并研究改进了吹塑工艺及生产方法，从而克服了超高相对分子质量聚乙烯的加工难点，得到了合格的吹塑制品。