Development of microwave multilayer plastic-based multichip modules

We present the design and development of multilayer plastic-based multichip modules (MCM) at microwave frequencies. A vertical feed-through interconnect, which consists of embedded copper wires in plastic, has been developed to transport RF/microwave and dc signals from the first to the second packaging level. The development of this vertical feed-through enables plastic modules to be configured in a surface mount topology that can be interfaced with low cost FR-4 boards using ball grid arrays (BGA). The experimental analysis results demonstrate that this vertical feed-through used with BGAs has ultra-low parasitics and achieves a return loss of greater than 20-dB at 4-GHz. In addition, we demonstrate a number of packaged active microwave circuits including a switch, a low noise amplifier (LNA) and a power amplifier using the plastic module technology at microwave frequencies     

Thermal analysis of AlGaN-GaN power HFETs

In this paper, we present a thermal analysis of AlGaN-GaN power heterojunction field-effect transistors (HFETs). We report the dc, small-signal, large-signal, and noise performances of AlGaN-GaN HFETs at high temperatures. The temperature coefficients measured for GaN HFETs are lower than that of GaAs pseudomorphic high electron-mobility transistors, confirming the potential of GaN for high-temperature applications. In addition, the impact of thermal effects on the device dc, small-signal, and large-signal characteristics is quantified using a set of pulsed and continuous wave measurement setups. Finally, a thermal model of a GaN field-effect transistor is implemented to determine design rules to optimize the heat flow and overcome self-heating. Arguments from a device, circuit, and packaging perspective are presented.     

Development and analysis of a folded shorted-patch antenna with reduced size

The length of a wall-shorted rectangular patch antenna can be reduced from /spl sim//spl lambda//sub 0//4 to /spl sim//spl lambda//sub 0//8 by a simple folding operation, which results in a stacked shorted-patch (S-P) structure with a resonant frequency that can be controlled by modifying the distance between the stacked (lower and upper) shorted-patches. A theoretical analysis based on a simple transmission-line model is presented and compared with numerical simulations, showing good agreement if the height of the folded patch is much smaller than the patch length. The physical insight of the variation of the resonant frequency for this reduced-size antenna can be understood by considering the antenna as a shorted patch loaded with a capacitor. An experimental verification is carried out for a 15 mm/spl times/15 mm/spl times/6 mm folded S-P antenna prototype designed for the 2.4 GHz ISM band that can achieve a 10-dB return loss bandwidth of 4% and results in a nearly omni-directional radiation pattern.     

Realization of multigigabit channel equalization and crosstalk cancellation integrated circuits

In this paper, we present integrated circuit solutions that enable high-speed data transmission over legacy systems such as short reach optics and electrical backplanes. These circuits compensate for the most critical signal impairments, intersymbol interference and crosstalk. The finite impulse response (FIR) filter is the cornerstone of our architecture, and in this study we present 5- and 10-Gsym/s FIR filters in 2-/spl mu/m GaAs HBTs and 0.18-/spl mu/m CMOS, respectively. The GaAs FIR filter is used in conjunction with spectrally efficient four-level pulse-amplitude modulation to demonstrate 10-Gb/s data throughput over 150 m of 500 MHz/spl middot/km multimode fiber. The same filter is also used to demonstrate equalization and crosstalk cancellation at 5 Gb/s on legacy backplane. The crosstalk canceller improves the bit error rate by five orders of magnitude. Furthermore, our CMOS FIR filter is tested and demonstrates backplane channel equalization at 10 Gb/s. Finally, building blocks for crosstalk cancellation at 10 Gb/s are implemented in a 0.18-/spl mu/m CMOS process. These circuits will enable 10-Gb/s data rates on legacy systems.     

Broadband loop antenna for DCS-1800/IMT-2000 mobile phone handsets

A rectangular loop antenna is proposed for DCS-1800 and IMT-2000 mobile phone handsets. By introducing a small gap in the wire loop, an impedance bandwidth of 24% can be achieved. The antenna mounted on a metal box is simulated using the FDTD method. It is found that the introduction of a small gap also results in a radiation pattern with desirable polarization independence and a reduced gain in the direction of the user's head. The simulated and measured results are presented.     

A High-Power CMOS Switch Using A Novel Adaptive Voltage Swing Distribution Method in Multistack FETs

A high-power CMOS switch using a novel adaptive voltage swing distribution method in a multistack field-effect transistor (FET) scheme is proposed. The proposed adaptive voltage swing distribution method in multistack FETs is very effective in preventing unwanted channel formation with low control voltage supply in OFF-state FETs. This, in turn, increases power-handling capability when a large-signal voltage swing is applied. In the proposed CMOS switch, the behavior of the voltage swing in OFF-state multistack FETs shows a difference with respect to the level of input voltage swing. The characteristics of voltage swing distribution and leakage channel formation in the CMOS switch is fully analyzed with incorporation of the novel adaptive voltage swing distribution method into a three-stacked nMOS Rx switch in a standard 0.18-mum triple-well CMOS process. In addition, linearity of the proposed technique is verified through the measurement data of the single-pole double-throw switches that employ the proposed technique in the Rx switch. Two different types of configurations are implemented and characterized at the Rx switches, which consist of four-stacked nMOS devices, to demonstrate the method of minimizing voltage stress issues on one of the multistacked FETs. Layout consideration was also taken to prevent interference between leakage signals at the substrate. The measured performance of the proposed design shows an input 0.3-dB compression point of 33.5 dBm at 1.9 GHz. To the best of our knowledge, this is the highest power-handling capability of a CMOS switch in a standard CMOS process ever reported. The insertion losses of the Tx and Rx switches are 1.6 and 1.9 dB, respectively, at 1.9 GHz. The isolation of the Tx and Rx switches is around 20 and 30 dB, respectively, at 1.9 GHz.     

Characteristics of GaAs/AlGaAs-doped channel MISFET's at cryogenictemperatures

High-frequency measurements at cryogenic temperatures to 125 K of 0.3-μm gate length GaAs-Al_0.3Ga_0.7As metal-insulator-semiconductor field-effect transistors (MISFETs) with a doped channel are discussed. Experimental results demonstrate significant improvement in performance including an increase in the maximum frequency of oscillation from 70 to 81 GHz and an increase in the unity current gain cutoff frequency from 46 to 57 GHz. Independently determined decreases in electron mobility and increases in electron velocity under similar conditions lead to the conclusion that carrier velocity and not mobility controls transport in these devices. These results show the high-speed potential of doped channel MISFETs at both room temperature and cryogenic temperatures     

Enhanced modulation bandwidth (20 GHz) ofIn0.4Ga0.6As-GaAs self-organized quantum-dotlasers at cryogenic temperatures: role of carrier relaxation anddifferential gain

Measurements of the threshold current, slope efficiency and optical modulation characteristics of self-assembled InGaAs-GaAs quantum-dot lasers have been made in the temperature range of 20-200 K in order to understand the carrier dynamics in these devices. The dc characteristics of these devices showed a region of almost temperature independent threshold current up to 85 K (T₀=670 K) with a maximum slope efficiency at 150 K. The maximum measured bandwidth increased from 5 GHz at room temperature to 20 GHz at 80 K. This is consistent with the bandwidth being limited by carrier relaxation time through electron-hole scattering     

Microwave frequency operation of the heterostructure hot-electrondiode

The generation of microwave frequencies by the heterostructure hot-electron diode (H²ED) is discussed. At 77 K, self-oscillation has been produced over a broad frequency range from direct current to 10.5 GHz, limited by the parasitic series resistance and capacitance. Considerations of the bias polarity required to produce oscillations and of their high-frequency response support a model of switching from tunneling to thermionic emission