地层测试的压力"下滑恢复"响应分析

在油气井的试油测试资料中，压力恢复曲线有时会出现下滑现象，常被认为是施工失误所致。本文以实际资料为例，分析了“下滑恢复”的压力响应特征和影响因素，认为只在低渗透地层有可能产生“下滑恢复”现象，并提出了避免“下滑恢复”的施工建议。     

聚丙烯装置聚合区设备布置及管廊的配管设计

结合工程特点及工艺流程,阐述了300 kt/a聚丙烯装置的布置原则,管道、管架设计要点和方法,以及需要注意的问题。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

石化企业线性规划模型的自动生成

根据石化企业生产过程的实际情况，考虑原料供应量、装置加工能力、物料平衡和价格等情况．建芷反映企业生产情况的线性规划数学模型。分别阐述了模型的决策变量、目标函数和约束方程的自动生成的方法，并给出了模型文件的存储结构。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

High Power Fiber Bundle Array Coupled LDA Module

1 Introduction High power laser diode arrays (LDA) have many advan- tages such as small volume, long working life, high slope efficiency and high optical density, so they have many applications in medical treatment, material pro- cessing, and for the pumping source of solid laser and etc. But unfortunately, the LDA can not be easy to use directly in these fields because of their poor beam quality and extremely asymmetric divergent beams (!x≈ 5°～10°and !y≈20°～35°, for example), so it …     

有线电视系统干扰信号的产生及排除

通过对有线电视系统干扰信号产生原因的理论分析，提出在实际操作中的解决方案，以期达到使有线电视系统信号的输出更稳定、电视画面更清晰的目的。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

用AFM导电探针在n-Si(111)表面进行纳米加工的机理研究

本文介绍了在AFM针尖与氢钝化硅表面之间施加电场作用对硅表面进行修饰的纳米加工方法，重点讨论了加工机理。实验考虑了样品的表面状态，周围大气状况，所加电压的极性、大小和加压方式等影响纳米加工的因素。对机理的研究表明，针尖和样品之间发生的是场致电子发射而非热电子发射，电流热效应增强粒子的扩散能力，提高了电化学反应速度。最后给出了电场诱导阳极氧化扩散增强的加工机理。     

水量还原方法及合理性检查

文中详细地阐述了取河水、井水、水库水、跨流城引(排)水等不同情况进行还原的具体方法步骤。并对水量还原成果提出合理性检查措施。