Microstructure and sliding wear behaviour of Tribaloy T-800 coatings deposited by laser cladding

This work has focused on the obtainment of Tribaloy T-800 coatings by laser cladding on plane 18/8 stainless steel specimens (AISI 304). The appropriate selection of cladding parameters allowed defect-free coatings to be obtained with minimal dilution. In order to evaluate their microstructure, cross-sections of the coatings were examined by optical microscopy and scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS). The elemental composition of the coatings was determined using an optical emission spectrometer with an excitation source (GDOES) and phase analysis was performed by X-ray diffraction (XRD). Several zones can be distinguished in the microstructure of the clad layer: a planar crystallization region at the interface with the substrate, followed by cellular and dendrite crystallization from the interface to the surface of the laser track and an overlap zone between tracks which is characterised by the coarsening of the structure and the formation of a lamellar eutectic phase. The mechanical properties were evaluated by hardness measurements and sliding wear tests (ball-on-disk and block-on-ring configurations) at room temperature and without lubrication. It was observed the great hardness (close to 850 HV_0.3) achieved for the Tribaloy 800 laser coatings, which presented a wear coefficient (k) between one and two orders of magnitude lower than the substrate. The analysis of the clad worn surfaces showed that there was a transition from an adhesive-oxidational mechanism to a more severe plastic deformation and crack formation wear process with increasing the applied load.     

Synthesis of SnAgCu nanoparticles with low melting point by the chemical reduction method

SnAgCu alloy with low melting point and good soldering property is a good candidate for the Sn/Pb eutectic. In this paper, SnAgCu nanoparticles were synthesized by a chemical reduction method. The particle size and the melting point are controlled by modifying the process parameters, including reaction temperature, surfactant concentration and dropping speed of precursor. The lowest melting onset temperature is observed at 199.1 °C, which is 18 °C lower than that of commercially available SnAgCu solder alloy. The tensile strength of the as-synthesized reaches 34.3 MPa, which reveals a good solderability property.     

Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints

A detailed experimental study on the fracture mechanism of Cu–Sn intermetallic compounds (IMCs) in the Pb-free solder was presented in this paper. The growth behaviors of the Cu₆Sn₅ and Cu₃Sn IMCs were inspected and the respective evolution pattern of their microstructures was investigated. Then, a detailed fractographic analysis on brittle fractured solder joints was conducted after the high speed ball pull test. The fracture locations in the Cu–Sn IMC layers during different periods of aging process were identified. The fracture modes of Cu₆Sn₅ and Cu₃Sn were determined as well. Afterwards, the fracture energies of different Cu–Sn IMC materials were directly compared using the Charpy impact test with a specially designed specimen. It was found that the grain boundary of Cu₃Sn is the weakest link in the Cu–Sn IMC system. Finally, based on these three parts of study, a mechanism to explain the thermal degradation of Cu–Sn IMCs was proposed.     

TiZrNiCu/Ti60润湿性及与TiBw-TC4钎焊研究

本文采用座滴法在真空下系统研究了硼含量对TiZrNiCu/Ti60润湿性的影响,且在940°C保温10分钟条件下实现了与的钎焊。通过SEM、XRD以及剪切实验研究了界面显微组织及剪切力学性能。添加B元素可以与Ti原位合成TiBw,从而细化界面的显微组织。当B含量为0.3 wt %时,TiBw-TC4 /TiZrNiCu-B/Ti60接头的最大剪切强度为177 MPa,比无B含量的接头强度高65%。然而,过量的B含量使TiZrNiCu-B在Ti60合金基体上产生大量的TiBw,导致润湿性恶化,在钎焊接头形成微孔和未焊合区域,从而使剪切强度下降。     

Sintering of high-entropy nanoparticles obtained by polyol process: A case study of (La0.2Y0.2Nd0.2Sm0.2Gd0.2)2Ce2O7-δ

High-entropy (HE) ceramics nanoparticles have received much attention due to their interesting properties. However, very limited studies have been conducted on their sintering. Here, we report the sintering behavior of HE A₂B₂O₇ type rare earth oxide nanoparticles obtained by polyol process. HE cerate (HECe) (La_0.2Y_0.2Nd_0.2Sm_0.2Gd_0.2)₂Ce₂O_7-δ is chosen as an exemplary case, which is considered as a good candidate for thermal insulation. HECe nanoparticles with size of 2.6–7.1 nm can be synthesized through polyol process followed by annealing in air at 300–700 °C. HECe nanoparticle compact can be densified by directly sintering at 1500 °C. The sintering temperature could be further decreased using a two-step sintering process, i.e., 1500 °C 5 min-1300 °C 5 h. Our results show that fine particle and abundant oxygen vacancies probably dominate the densification process. By controlling the sintering regime, we can tune the microstructure of HECe ceramics and thermal conductive properties accordingly.     

Effects of chromium on crack growth and oxidation in nickel aluminide

The influence of chromium additions on crack growth and oxidation have been examined in the nickel aluminide, Ni₃Al. Crack growth rates were measured in a chromium containing alloy as a function of stress intensity at temperatures between 600 and 760°C in air, together with rates of oxide film growth, and compared with previous measurements taken from Ni₃Al. The mechanisms of crack propagation and oxidation were investigated with a range of analytical techniques, including SEM, AES, XPS, SIMS, TEM and STEM. An addition of 8% chromium had a significantly beneficial effect on both crack growth resistance and oxidation resistance between 600 and 760°C. Low oxidation rates were associated with the formation of Cr₂O₃ together with Al₂O₃ at the metal/oxide interface, consistent with chromium acting initially as an oxygen getter, and promoting the formation of a protective Al₂O₃ layer, with little internal oxidation. It is proposed that chromium was also responsible for inhibiting oxygen access to and diffusion along grain boundaries at crack tips, modifying the mechanism of crack propagation from “step-wise cracking”, dominated by oxygen embrittlement (observed in the absence of chromium), to a more conventional creep crack growth process.     

Joining ZTA ceramic by using Dy2O3-Al2O3-SiO2 glass ceramic filler

In this paper, a novel Dy₂O₃-Al₂O₃-SiO₂ (DAS) glass ceramic was designed and prepared for joining zirconia toughened alumina (ZTA) ceramic. The crystallization, thermal expansion behavior and wetting behavior of the DAS glass filler were studied. The effect of cooling rate and joining temperature on the microstructure and flexural strength of joints was investigated. The results show that slow cooling rate (15 °C/min) leads to crystallization of brazing seam, which causes the formation of pores in the joints due to the large density difference between the glass and the crystalline phases. The dissolution of ZrO₂ from ZTA substrate into the filler during joining process improves the mismatch of the coefficient of thermal expansion (CTE) between the brazing seam and substrate. The maximum flexural strength of 535 MPa is obtained when the joining temperature and cooling rate are 1475 °C and 50 °C/min, respectively.     

Wetting behavior and brazing of titanium-coated SiC ceramics using Sn0.3Ag0.7Cu filler

By coating active titanium, Sn0.3Ag0.7Cu (SAC) filler wetted SiC effectively, as the contact angle decreased significantly from ~145° to ~10°. Ti₃SiC₂ and TiO_x (x ≤ 1) reaction layers were formed at the droplet/SiC interface, leading to the reduction of contact angle. Reliable brazing of SiC was achieved using titanium deposition at 900°C for 10 minutes, and the typical interfacial microstructure of Ti-coated SiC/SAC was SiC/TiO_x + Ti₃SiC₂/Sn(s,s). Comparing to direct brazing, Ti–Sn compounds in the brazing seam were effectively reduced and the mechanical property of joints was dramatically improved by titanium coating. The optimal average shear strength of SiC joints reached 25.3 MPa using titanium coating- assisted brazing, which was ∼62% higher than that of SiC brazed joints using SAC-Ti filler directly.     

磁控溅射铜靶材的刻蚀行为

主要研究了磁控溅射铜靶材刻蚀行为.通过改变同轴线圈中励磁电流的大小来调节铜靶表面磁场的分布,研究不同励磁电流及时间下刻蚀环的形貌,并研究了刻蚀形貌随时间的变化规律.采用轮廓仪测量靶材刻蚀环的轮廓.结果表明,采用不同励磁电流的靶材刻蚀形貌为高斯曲线状,刻蚀深度与励磁电流及刻蚀时间呈线性关系,刻蚀环的宽度随刻蚀时间的增加先增加,然后达到一个固定值34 mm,刻蚀环的中心位置距靶圆心的距离随励磁电流增加从26 mm减小到20 mm.     

原位生成WC/TaC复合激光熔覆层组织研究

利用激光熔覆技术,将氧化钽和石墨的混合粉末添加到Ni60包WC的镍基合金粉末中,成功制备了TaC/WC复合涂层。使用扫描电镜(SEM)、X射线衍射仪(XRD)等仪器分析了镍基合金复合涂层横断面的显微组织,并对其硬度进行研究分析。结果显示在基体与涂层之间形成了良好的冶金结合,复合涂层不仅含有γ-Ni树枝晶、W₂C、M₇C₃、以及大量的弥散分布的TaC颗粒。复合涂层的硬度可达HV965,是Ni60涂层的1.3倍,主要是因为TaC颗粒的分布促使其内部组织结构改变以及相变引起的硬度上升。