An infinite chain, {[Ni(tn)2]3[Fe(CN)4(μ-CN)2]2}n,a new catalyst for electrochemical-driven water splitting and photochemical-driven hydrogen evolution from water under blue light

A new catalyst for both water reduction and oxidation, based on an infinite chain, {[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n, is formed by the reaction of NiCl₂, 1,3-propanediamine (tn) and K₃ [Fe(CN)₆]. {[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n can electro-catalyze hydrogen evolution from a neutral aqueous buffer (pH 7.0) with a turnover frequency (TOF) of 1561 mol of hydrogen per mole of catalyst per hour (H₂/mol catalyst/h) at an overpotential (OP) of 837 mV {[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n also can electro-catalyze O₂ production from water with a TOF of ～45 mol O₂ (mol cat)^?1s^?1 at an OP of 591 mV. Under blue light (λ = 469 nm), together with CdS nanorods (CdS NRs) as a photosensitizer, and ascorbic acid (H₂A) as a sacrificial electron donor, {[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n can photo-catalyze hydrogen generation from an aqueous buffer (pH 4.0) with a turnover number (TON) of 11,450 mol H₂ per mole of catalyst (mol of H₂ (mol of cat)^?1) during 10 h irradiation. The average of apparent quantum yield (AQY) is as high as 40.96% during 10 h irradiation. Studies indicate that {[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n exists in two forms: a cyano-bridged chain ({[Ni(tn)₂]₃ [Fe(CN)₄ (μ-CN)₂]₂}_n) in solid, and a salt ([Ni(tn)₂]₃ [Fe(CN)₆]₂) in aqueous media; Catalytic reaction occurs on the nickel center of [Ni(tn)₂]²⁺, and the introduction of [Fe(CN)₆]^3- can improve the catalytic efficiency of [Ni(tn)₂]²⁺ for H₂ or O₂ generation. We hope these findings can afford a new method for the design of catalysts for both water reduction and oxidation.     

Research on the effects of surface modification of ceramic powder on cure performance during digital light processing (DLP)

Digital light processing (DLP) is one of the most important additive manufacture technologies to fabricate ceramic parts with complex geometries. Compared with pure photosensitive resin, the cure performance of ceramic suspensions is obviously different due to the optical property change after the addition of ceramic powders. In this paper, a unique oxidation process was used to modify the optical properties of nitride powders including AlN and Si₃N₄. The properties of oxidized ceramics were investigated and the cure performance of ceramic suspensions was then characterized. The effect of oxidation time on cure performance was evaluated. The results showed that for AlN, oxidation process leads to the smaller cure depth and smaller excess cure width as compared with non-oxidized AlN and for Si₃N₄, oxidation process leads to the larger cure depth and larger excess cure width as compared with non-oxidized Si₃N₄, indicating that both refractive index and light absorbance of ceramic powders have obvious effects on cure behaviors. Additionally, the cure behavior of oxidized ceramic suspension in this study shows that the relationship of cure depth vs. incident energy agrees well with Beer- Lambert model, but the excess cure width vs. incident energy is not consistent with quasi Beer-Lambert model due to the nature of digital micromirror device (DMD).     

Thermoplastic and low dielectric constants polyimides based on BPADA-BAPP

ABSTRACT

The thermoplastic and low dielectric constants polyimides were introduced. The polyimides were prepared by pyromellitic dianhydride (PMDA) or 4,4?-(4,4?-Isopropylidenediphenoxy)diphthalic anhydride (BPADA) as anhydride monomer and 4,4?-oxydianiline (ODA) or 2,2-bis(4-(4-aminephenoxy)phenyl)propane (BAPP) as amine monomer. The polyimides were well characterized by FT-IR, thermogravimetric analysis, dynamic thermomechanical analysis, dielectric measurement, and tensile test. The dielectric constants were 2.32–2.95 compared with 3.10 of ODA-PMDA polyimide, while partly polyimides were thermoplastic. The results indicated anhydride monomers, containing lateral methyl groups, made polyimides become thermoplastic. The results of molecular simulations via Materials Studio also proved this conclusion.     

Study of MW-scale biogas-fed SOFC-WGS-TSA-PEMFC hybrid power technology as distributed energy system: Thermodynamic,exergetic and thermo-economic evaluation

Advanced biogas power generation technology has been attracting attentions, which contributes to the waste disposal and the mitigation of greenhouse gas emissions. This work proposes and models a novel biogas-fed hybrid power generation system consisting of solid oxide fuel cell, water gas shift reaction, thermal swing adsorption and proton exchange membrane fuel cell (SOFC-WGS-TSA-PEMFC). The thermodynamic, exergetic, and thermo-economic analyses of this hybrid system for power generation were conducted to comprehensively evaluate its performance. It was found that the novel biogas-fed hybrid system has a gross energy conversion efficiency of 68.63% and exergy efficiency of 65.36%, indicating high efficiency for this kind of hybrid power technology. The market sensitivity analysis showed that the hybrid system also has a low sensitivity to market price fluctuation. Under the current subsidy level for the distributed biogas power plant, the levelized cost of energy can be lowered to 0.02942 $/kWh for a 1 MW scale system. Accordingly, the payback period and annual return on investment can reach 1.4 year and about 20%, respectively. These results reveal that the proposed hybrid system is promising and economically feasible as a distributed power plant, especially for the small power scale (no more than 2 MW).     

A New Role of M1 Type Dopant for Nd-Rich Nd-Fe-Co-B Nanocrystalline Ribbons

In this work, our attempts focused on Ge effects on magnetic-microstructural relationships in Nd-Fe-Co-B nanocrystalline ribbons. Based on Transmission Electron Microscopy (TEM) and three dimensional atom probe (3DAP) analysis, it was observed that Ge containing alloys have a new behavior that was not observed yet. The increase of Ge content up to 0.36at% caused the increase of B_r and (BH)_max due to increase of Co content of Nd₂Fe₁₄B phase. However, the magnetic properties deteriorated for Ge bearing samples beyond 0.36at% due to the decrease of volume fraction of Nd₂Fe₁₄B phase. The comparison of Ge and Ga (another M1 dopant) effects on coercivity was reported and microstructural studies (using TEM and 3DAP) were shown the Nd-rich phase morphology and its alloying elements distribution in the nanometer sized intergranular phase.     

基于CC2530的ZigBee数据采集系统设计

为了使工业生产中的技术人员不用亲自去现场或者恶劣的环境就可以实时采集现场设备的数据信息及状态参数,结合ZigBee技术适用于数据采集系统的特点,首先在ZigBee技术的理论基础上介绍了数据采集系统采集数据的原理,然后详细讨论了基于CC2530芯片的数据采集节点的硬件设计方法及组网设计中的协调器建立网络、节点加入和脱离网络的软件设计方法,最后给出了该设计方案在LED路灯电压数据采集实验中的应用实例。实验结果表明这种设计方案不仅能有效地采集设备的各项数据,而且使系统的扩展、维护变得更加方便。     

Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High-Frequency Flexible Circuit Board Application

The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm⁻¹, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application.