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1.
Gelatin is one of the most important multifunctional biopolymers and is widely used as an essential ingredient in food, pharmaceutical, and cosmetics. Porcine gelatin is regarded as the leading source of gelatin globally then followed by bovine gelatin. Porcine sources are favored over other sources since they are less expensive. However, porcine gelatin is religiously prohibited to be consumed by Muslims and the Jewish community. It is predicted that the global demand for gelatin will increase significantly in the future. Therefore, a sustainable source of gelatin with efficient production and free of disease transmission must be developed. The highest quality of Bovidae-based gelatin (BG) was acquired through alkaline pretreatment, which displayed excellent physicochemical and rheological properties. The utilization of mammalian- and plant-based enzyme significantly increased the gelatin yield. The emulsifying and foaming properties of BG also showed good stability when incorporated into food and pharmaceutical products. Manipulation of extraction conditions has enabled the development of custom-made gelatin with desired properties. This review highlighted the various modifications of extraction and processing methods to improve the physicochemical and functional properties of Bovidae-based gelatin. An in-depth analysis of the crucial stage of collagen breakdown is also discussed, which involved acid, alkaline, and enzyme pretreatment, respectively. In addition, the unique characteristics and primary qualities of BG including protein content, amphoteric property, gel strength, emulsifying and viscosity properties, and foaming ability were presented. Finally, the applications and prospects of BG as the preferred gelatin source globally were outlined.  相似文献   
2.
A simple, cost-effective, and novel chemical sensor for ammonia (NH3) gas detection was developed from polyaniline (PANI)/quail eggshell (QES) composites. QES is a natural waste enriched in calcium carbonate. In this work, pure PANI was synthesized from chemical oxidation method and PANI/QES composites were prepared from physical mixing of QES with the synthesized PANI at different mass ratio. A series of complementary techniques including Fourier transform infrared and ultraviolet-visible spectrometers, scanning electron microscope with energy dispersive detection coupled with mapping, thermogravimetric analysis, and X-ray diffractometer were used to characterize the physicochemical and textural properties of the biocomposites. From the results, PANI/QES composite with a mass ratio of 1 exhibited the lowest NH3 detection limit of 5.24 ppm with a linear correlation coefficient (R2) of close to unity (0.9932) between the signal and NH3 gas concentration. As a whole, the PANI/QES biocomposites synthesized from this work exhibited excellent selectivity toward NH3 gas even in the presence of other gas impurities, such as acetone, ethanol, and hexane. For the sensor reusability, the PANI/QES biocomposites can be reused in the application of NH3 gas detection for at least 4 cycles.  相似文献   
3.
Temperature programmed reduction (TPR) analysis was applied to investigate the chemical reduction progression behavior of molybdenum oxide (MoO3) catalyst. The composition and morphology of the reduced phases were characterized by X-ray diffraction spectroscopy (XRD), X-ray photoelectron spectroscopy (XPS), and field emission scanning electron microscopy (FE-SEM). The reduction progression of MoO3 catalyst was attained with different reductant types and concentration (10% H2/N2, 10% and 20% CO/N2 (%, v/v)). Two different modes of reduction process were applied. The first approach of reduction involved non-isothermal mode reduction up to 700 °C, while the second approach of reduction involved the isothermal mode reduction for 60 min at 700 °C. Hydrogen temperature programmed reduction (H2-TPR) results showed the reduction progression of three-stage reduction of MoO3 (Mo6+ → Mo5+ → Mo4+ → Mo0) with Mo5+ and Mo4+. XRD analysis confirmed the formation of Mo4O11 phase as an intermediate phase followed by MoO2 phase. After 60 min of isothermal reduction, peaks of metallic molybdenum (Mo) appeared. Whereas, FESEM analysis showed porous crater-like structure on the surface cracks of MoO2 layer which led to the growth of Mo phase. Meanwhile, the reduction of MoO3 catalyst in 10% carbon monoxide (CO) showed the formation of unstable intermediate phase of Mo9O26 at the early stage of reduction. Furthermore, by increasing 20% CO led to the carburization of MoO2 phase, resulted in the formation of Mo2C rather than the formation of metallic Mo, as confirmed by XPS analysis. Therefore, the presented study shows that hydrogen gave better reducibility due to smaller molecular size, which contributed to high diffusion rate and achieved deeper penetration into the MoO3 catalyst compared to carbon monoxide reductant. Hence, the reduction of MoO3 in carbon monoxide atmosphere promoted the formation of Mo2C which was in agreement with the thermodynamic assessment.  相似文献   
4.
Data transformation is the core process in migrating database from relational database to NoSQL database such as column-oriented database. However, there is no standard guideline for data transformation from relational database to NoSQL database. A number of schema transformation techniques have been proposed to improve data transformation process and resulted better query processing time when compared to the relational database query processing time. However, these approaches produced redundant tables in the resulted schema that in turn consume large unnecessary storage size and produce high query processing time due to the generated schema with redundant column families in the transformed column-oriented database. In this paper, an efficient data transformation technique from relational database to column-oriented database is proposed. The proposed schema transformation technique is based on the combination of denormalization approach, data access pattern and multiple-nested schema. In order to validate the proposed work, the proposed technique is implemented by transforming data from MySQL database to HBase database. A benchmark transformation technique is also performed in which the query processing time and the storage size are compared. Based on the experimental results, the proposed transformation technique showed significant improvement in terms query processing time and storage space usage due to the reduced number of column families in the column-oriented database.  相似文献   
5.
This paper characterizes die damage resulting from various wafer thinning processes. Die fracture strength is measured using ball breaker test with respect to die surface finish. Further study on surface roughness and topography of each surface finish is obtained by atomic force microscopy (AFM) and scanning electron microscopy (SEM) techniques. Stress relief process with 25 μm removal is able to strengthen 100 μm wafer by 20.4% using chemical wet etch and 75 μm wafer by 36.4% with plasma etch. Relatively, plasma etching shows higher fracture strength and flexibility compared to chemical wet etch. This is due to topography of the finished surface of plasma etch is smoother and rounded, leading to a reduced stress concentration, hence improved fracture strength.  相似文献   
6.
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn–Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn–Al–Mg–Ga solder wire was used to attach Ti/Ni/Ag metallized Si die on Cu lead-frame in an automatic die attach machine. Die attachment was performed in a forming gas environment at temperature ranging from 370 to 400 °C. At the interface with Cu lead-frame, CuZn4, Cu5Zn8 and CuZn intermetallic compound (IMC) layers were formed. At the interface with Si, Al3Ni2 IMC formed when 200 nm Ag layer was used at the die back and AgZn and AgZn3 IMC layers when the Ag layer was 2,000 nm thick. Microstructure of the bulk solder consists of mainly two phases: one with a brighter contrast (about 80.9 wt% Zn) and the other one is a mixture of light (about 73.7 wt% Zn) and dark phases (about 45 wt% Al). Zn–Al–Mg–Ga solder wetted well on Cu lead-frame, covered entire die area and flowed in all directions under the Si die. Less than 10% voids were found in the die attach samples at die attach temperatures of 380 and 390 °C. Die shear strength was found within the acceptable limit (21.8–29.4 MPa) for all the die attach temperatures. Die shear strength of standard Pb–Sn solder was also measured for comparison and was found to be 29.3 MPa. In electrical test, maximum deviation of output voltage after 1,000 thermal cycles was found 12.1%.  相似文献   
7.
This study reveals the micro-structural details on the metal substrate surface prepared by grit blasting, and then proposes a simple resin pre-coating method aiming at full wetting of the substrate surface for stronger adhesive bonding. The resin pre-coating solution consisting of around 90% acetone and around 10% resin without hardener is used as a primer, which can be sprayed or blushed onto the grit-blasted metal substrate. The acetone solution can carry resin deep into micro-cavities created by grit blasting and effectively coat and wet micro-debris so that micro-voids or gaps between the adhesive joint and metal substrate can be removed. Since the resin pre-coating does not contain hardener and remains wet, the wettability of the substrate is also improved. The normal epoxy adhesive with hardener can then be applied onto the substrate surface. Despite having the primer-like function, the proposed resin pre-coating method still maintains the simplicity of one epoxy resin system. Based on the current study, a resin and acetone solution without hardener does not seem to have adverse effects on the final bonding strengths of adhesive joints, although acetone is known to have detrimental effects on resin and hardener adhesive systems. Four different surface conditions are examined, each having 14 specimens: (1) Grit-Blasted (GB) surface, (2) GB-surface with ultrasonic cleaning, (3) GB-surface with resin Pre-Coating (PC) only, and (4) GB-surface with both ultrasonic cleaning and PC. 25% improvement in the shear strength has been achieved by the resin pre-coating method, even without ultrasonic cleaning, in comparison with 8% improvement after ultrasonic cleaning. These results show GB-surface with PC is beneficial to adhesive bonding, which can be adopted for structural applications even if thorough substrate surface cleaning on site is not possible. The improved wettability of metal substrates after resin pre-coating contributes to the maximum possible utilization of the contact areas over the roughened substrate surfaces and thus leads to the enhanced adhesive bond strength.  相似文献   
8.
《Minerals Engineering》2006,19(5):463-470
The possible use of palygorskite clay, mined in the Dwaalboom area of the Northern Province of South Africa, as an adsorbent for the removal of metal ions such as lead, nickel, chromium and copper from aqueous solution, was investigated. In this work, adsorption of these metals onto palygorskite has been studied by using a batch method at room temperature. The results of adsorption were fitted to both the Langmuir and Freundlich models. Satisfactory agreement between experimental data and the model-predicted values was expressed by the correlation coefficient (R2). The Langmuir model represented the sorption process better than the Freundlich one, with correlation coefficient (R2) values ranging from 0.953 to 0.994. The adsorption capacity (Q0) calculated from the Langmuir isotherm was 62.1 mg Pb(II) g−1, 33.4 mg Ni(II) g−1, 58.5 mg Cr(VI) g−1 and 30.7 mg Cu(II) g−1 at a pH of 7.0 at 25 ± 1 °C for a clay particle size of 125 μm. Kinetic investigations were performed to investigate the rate of adsorption of metal ions. The Lagergren’s first-order rate constants were calculated for different initial concentrations of metal ions. In batch mode adsorption studies, removal increased with an increase of contact time, adsorbent amount and solution pH. Adsorption of metals from the single-metal solutions was in the order: Pb > Cr > Ni > Cu. Data from this study proved that metal cations from aqueous solution can be adsorbed successfully in significant amounts by palygorskite. This opens up new possibilities and potential commercial uses in the palygorskite market.  相似文献   
9.
In order to classify unknown gelatin into their species of origin, a simple and rapid method for the qualitative determination was developed using Fourier transform infrared (FTIR) in combination with attenuated total reflectance (ATR) and discriminant analysis. The spectra were analysed using a chemometric method, principal component analysis (PCA), to classify and characterise gelatin compounds using regions of the FTIR spectra in the range of 3290–3280 cm?1 and 1660–1200 cm?1 as calibration models. Results from PCA, which were subsequently represented by the Cooman’s plot showed a clear distinction between gelatin samples of bovine and porcine origins. This qualitative approach, besides providing a rapid determination of the source of gelatin, may also be established based on a second derivative study of the FTIR spectrum to alleviate any doubt of the gelatin source for applications in the food and pharmaceutical industries.  相似文献   
10.
Bond pad cratering study by reliability tests   总被引:1,自引:0,他引:1  
Silicon cratering is one of the major obstacles to turn thermosonic copper wire bonding technology into a mass-production mode. The effects of reliability tests, i.e. aging test, temperature cycle test, and autoclave test on silicon craters of copper and gold wire-bonded Si substrate are discussed in this paper. Prior to reliability tests, wire-bonded specimens were examined by initial bond etch test. Results showed that there was no crack or silicon cratering observed in the selected samples. It was found that reliability tests, unlike improper bonding parameters, did not induce silicon craters at the Si substrate. However, reliability tests degraded the Si substrate and bonded interfaces, which were exposed later during destructive tests, i.e. wire pull test and ball shear test.  相似文献   
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