化学镀Ni-P合金在氯化物溶液中的化学钝化

本文对化学镀Ni-P合金在3.5%NaCl溶液中的阳极行为进行了研究。运用动电位极化技术和电化学阻抗谱(EIS)技术对活化区和钝化区的测量结果表明:过电位与呈线性关系,但不同电位区,其斜率相差较大。在活化区,界面电容C随过电位的增大而减小,而在钝化区,C维持恒定。对表面膜的XPS分析证实:在活化区形成有磷酸盐膜,保护性差,不能有效地抑制溶解过程;而当表面吸附有H2PO2阴离子时,合金进入化学致钝的钝化区.     

Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

Ni−B film of 1 μm thickness was electrolessly deposited on an electroplated Cu bus electrode. The film, which encapsulates the Cu bus electrodes, prevents Cu oxidation and serves as a diffusion barrier against Cu contamination of the transparent dielectric layer in a plasma display during the firing process at 580 °C. The microstructure of theas-deposited barrier film was amorphous phase and crystallized to Ni and Ni₃B after annealing at 300 °C. The good barrier properties observed here can be explained by Ni₃B precipitates at the grain boundaries acting as a fast diffusion path via pre-annealing at 300 °C before the firing process at 580 °C.     

化学镀镍磷表面改性Cu-Zn-Al形状记忆合金的腐蚀行为

采用电化学方法研究了Cu-Zn-Al形状记忆合金(SMA)及其化学镀镍磷表面改性试样在Tyrode's人工体液中的腐蚀行为.结果表明，在Tyrode's人工体液中Cu-Zn-Al SMA发生脱锌腐蚀.化学镀镍磷Cu-Zn-Al SMA随NaCl浓度增加、pH值降低、环境温度升高，阳极活性电流密度增大，电化学溶解敏感性增强.X-射线衍射分析结果表明，Cu-Zn-Al SMA表面化学镀镍磷后，形成了非晶态镀层，其在Tyrode's人工体液中的耐蚀性显著提高；这是由于改性表面形成均匀、稳定的阻碍性镀层，有效地将基体金属和外界腐蚀介质隔绝而达到防护作用. 镀镍磷      

Electroless plating of carbon nanotubes and their millimeter-wave absorbing properties

A method of electroless plating was utilized to deposit Cu, Ni, Co, Ag on the surface of carbon nanotubes (CNTs) respectively, in order to prepare millimeter-wave absorbing materials. Field emission scanning electron microscope (FE-SEM) and energy dispersive spectrometer (EDS) were used to observe morphologies and chemical compositions of the samples respectively. Millimeter-wave radiometer imaging detection was employed to measure the absorbing properties of the samples. FE-SEM and EDS results demonstrate the effectiveness of successful metal deposition. The results of millimeter-wave radiometer imaging detection reveal that the millimeter-wave absorbing properties of electroless-silver plating are better than other kinds of samples.     

Fabrication and characterization of copper-diamond particles

The electroless copper deposition on both pure and Cr-coated diamond particles was studied to produce copper/diamond composites for electronic packaging materials. The particles were characterized and the mechanism of product formation was investigated through scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), and X-ray photoelectron spectra (XPS). The particle coating thickness was measured using optical micrographs. The diamond particles got uniform coating thickness of copper crystals layers. This method provided an excellent base for the fabrication of metal-based composites using cheap equipments, and was less time consuming, nature friendly and economical compared with other methods of diamond surface metallization.     

单分散复合导电微球制备研究进展

对电子封装中的热点技术——各向异性导电胶的关键成分导电微球的制备进展进行系统阐述，并对微球表面镀镍过程中的影响因素进行分析讨论，综述了导电微球制备的最新进展及应用前景。     

化学镀镍磷合金的研究进展与展望

化学镀大致可分为4类：多元合金化学镀、微粒与合金共沉积的化学复合镀、新型技术化学镀及双层或多层化学镀。综述了国内外在化学镀镍磷合金方面的最新研究进展，介绍了不同基体材料的镀前处理及主要的镀后处理方法，并对国内化学镀镍磷合金的未来发展做了进一步的展望。     

Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate

Electroless copper plating process of N, N, N′, N′-tetrakis (2-hydroxypropyl)ethylenediamine(THPED) chelating agent was researched comprehensively. The results indicate that plating rate decreases with the 3H2O has a bad effect on deposits quality, but 2, 2′-dipyridyl and PEG make deposits quality improve greatly. Low concentration of 2-mercaptobenzothiozole (2-MBT) increases plating rate and improves deposits quality, but decreases plating rate and worsens deposits quality when 2-MBT reaches 5 mg/L. The optimal conditions of this electroless MBT are 16.8 g/L, 16.0 mL/L, 13.3 g/L, 0.5 g/L, 5.0 mg/L and 2.0 mg/L, respectively, pH value is 12.75,bath temperature is 30 ℃. Plating rate reaches 9.54 μm/h plating for 30 min in the bath. The SEM images demonstrate that the surface of copper film is smooth and the crystal is fine.     

Ni-P基化学复合镀的研究与应用

综述了Ni-P基化学复合镀的研究概况,包括微米和纳米化学复合镀、镀层形成机理、工艺因素对镀层形成的影响、镀后热处理和镀层的组织结构性能,介绍了Ni-P基化学复合镀的应用情况,并对其发展进行了展望.     

用膜相渗透化学镀法制备NiCo/PTFE磁性复合膜

为促进金属粒子在膜孔中生成,采用膜相渗透和化学镀结合的方法,研究了化学镀NiCo/PTFE磁性复合膜的工艺.在正交试验结果基础上探讨了主盐离子浓度比、NaOH浓度、N2H4浓度、反应温度和反应时间对NiCo/PTFE复合膜中金属含量和磁性能的影响.本工艺最佳配方为:0.14 mol/L CoCl2·6H2O,0.06 mol/L NiCl2·6H2O,0.90 mol/L NaOH,0.45 mol/L C4H4O6KNa·4H2O,0.45 mol/L N2H4·H2O;最佳参数为:70～75℃,75 min.结果表明,相对于传统的双面金属化处理,引入膜相渗透的单面活化有助于镍钴金属粒子在膜孔内原位生成.