关于我国的粮食标准

本文总结了我国粮食标准的历史，将历次我国小麦标准和小麦粉标准的技术指标，分别集中列表，并据以估计我国优质小麦标准的良好发展前景。     

工艺因素对金属封装外引线弯曲疲劳的影响

考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。     

溶胶-凝胶法制备HAP骨水泥材料的研究

文章对用溶胶－凝胶法（简称SOL－GEL）烧结制备HAP骨水泥材料的工艺条件进行了研究，并探索了HAP粉剂与柠檬酸水溶液构成和凝结体系的可行性，结果显示出该材料作为医用骨水泥材料的可能性。     

The microstructure of Cu films deposited by the self-ion assisted technique

The microstructures of Cu films deposited by the self-ion assisted, partially ionized beam (PIB) deposition technique under two different accelerating potentials, 0 KeV and 6 KeV, are compared. The 6 KeV film shows a bimodal (111) fiber and (100) fiber texture with an abundance of twin boundaries and a relatively large average grain size with a typical lognormal distribution. The 0 KeV film consists of small, mostly (111) oriented grains with islands of abnormally large (100) grains. The controlling factors for the abnormal growth of the (100) grains are discussed in relation to the observed microstructures, showing that all factors necessary for abnormal (100) growth are present in the films.     

淹没水跃的数值模拟

本文通过求解时均N－S方程κ－ε紊流模型，数值模拟了淹没水跃由静止到最终稳定的全过程。采用隐式非正交同位网格有限体积法离散控制方程组，利用动网格技术跟踪自由表面，并由Orlanski开边界条件得到无反射的出口边界。文中给出了淹没水跃在不同时刻自由表面形状、内部流场结构和流速矢量的变化情况，并与试验资料进行了比较。结果表明，本文方法能够准确有效地描述淹没水跃这类复杂自由表面流动的紊动特性。     

Effects of solidification structure on fatigue crack initiation and fatigue strength in Al−Si−Mg cast alloys

Rotating-bending uniaxial fatigue tests and micro-fatigue crack initiation tests were carried out using a permanent mold cast (PMC) and semi-solid die cast (SDC) with Al−7%Si−0.35%Mg composition in order to examine the relationship between solidification structures and fatigue behaviors. The crack length was measured using a replication method. Fatigue strength was improved in SDC, which was almost consistent with the predicted fatigue strength using the size of Si particle cluster. Resistance to fatigue crack initiation and fatigue strength were improved in SDC owing to the finer Si cluster and to higher ultimate tensile strength. Fatigue crack in PMC was preferentially initiated at pores. For SDC, the fatigue crack was initiated at the Si particle/matrix interface, and then sucessively grew along eutectic cell boundaries.     

明渠断面水流流速与边界剪切应力横向分布模型

天然河流的横断面多为由主槽和漫滩组成的复式断面,水流在这种断面中比在单一断面中受到更多因素影响,流态也更加复杂。通过将明渠横断面上微元体在水流方向的N-S控制方程沿水深积分,得出描述垂线平均流速和边界剪切应力横向分布的模型,并通过对实验数据的验证,确定了模型的实用性。     

Grain Growth Behavior of 5Cr21Mn9Ni4N Steel Micro-Alloyed by Rare Earth

Grain growth behavior of 5Cr21Mn9Ni4NRE steel was experimentally studied at various solid solution treatment temperatures and holding for different times. The experimental results show that the 5Cr21Mn9Ni4NRE steel has the feature of sharp austenite grain coarsening after solid solution treatment at the temperature above 1150 ℃. RE added in the steel has the benefit to restrain grain growth and increase grain growth activation energy.     

Effects of hot-carrier stress on high performance polycrystalline silicon thin film transistor with a single perpendicular grain boundary

This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower.