Effects of Surface Modifications on the Peel Strength of Copper Based Polymer/Metal Interfaces with Characteristic Morphologies

This paper summarizes a study on the effect of changes in surface chemistry on the peel strength of copper/polymer interfaces. Two different surface topographics were created and evaluated, one produced by cleaning and etching in sodium persulfate, the other by etching then mechanically roughening using 180 grit sandpaper. Both surfaces were then oxidized in an alkaline/oxidizing treatment to form cupric oxide. Ion implantation and benzotriazole priming modified the surface chemistry of the cupric oxide samples. After lamination to form an epoxy/copper interface, peel strength measurements were taken. The results showed that ion implantation degraded the peel strength while priming with benzotriazole improved the peel strength compared with the unmodified cupric oxide. In a separate comparison study, peel strength measurements were taken on interfaces formed from copper oxides with the same oxide structure but with widely different gross morphologies, “As laminated” adhesive strength was virtually the same. The bonded interfaces were aged at elevated temperature and the peel strength obeyed first order degradation kinetics. Two terms can be determined from the degradation studies, the first is the long term peel strength, A(∞), and the other is Ω, the degradation rate with units of time^-1. A value of A(∞) was 3.0 lbs/in for etched copper interfaces while A(∞) was 0.5 lbs/in for the sanded interfaces.     

电解铜箔制造技术探讨

阐述电解铜箔生产工艺过程中，原材料和各种工艺条件对电解铜箔生产的影响。实践表明，选择合理的工艺条件是生产优质电解铜箔的先决条件，添加剂则可以改变铜箔的物理性能，提高延伸率，降低粗糙度，满足市场的各种使用需要。     

Oxidation behavior of a Ni3Al PM alloy

The oxidation behavior of a Ni₃Al powder-metallurgical (PM) alloy doped with boron was investigated by means of discontinuous isothermal tests in the temperature range of 535° to 1020°C for exposures of up to 150 hr. The oxidation kinetics were characterized by a sharp decrease in the oxidation rate at about 730°C which is associated with a change in the oxidation mechanism. Below 730°C, the scale exhibited an outer NiO layer and an internal-oxidation zone consisting of a fine dispersion of alumina in a diluted Ni-Al solid solution. Between these two layers a very thin layer of nickel could be observed. Above 730°C, a three-layered scale was observed consisting of an outer NiO layer, an intermediate layer that depending on temperature consisted of a mixture of nickel and aluminum oxides or NiAl₂O₄, and an inner layer of Al₂O₃, which accounts for the higher oxidation resistance. Oxidation at the higher temperatures resulted in extensive void formation at the scale/metal interface which led to poorly adherent scales. It is worth noting that at the early oxidation stage the scale was characterized by planar interfaces. Roughening of the air/scale and, specially, the scale/metal interfaces after long exposures at the low-temperature range or after short times at higher temperatures could be related to the formation of the inner Al₂O₃ layer at the grain boundaries which favor oxygen penetration through the grain interior.     

PRETREATMENT FOR METALLIZATION OF PZT CERAMIC SURFACES

This paper describes the pretreatment process for metal[ization of PZT ceramics surfaces by electrolytic Ni plating which includes cleaning, roughening, sensitization and activation. The experimental procedure, results and influeneing factors for these processes are investigated and discussed.     

Characteristics of an Oxygen Barrier Based on Bi-layered Ir

For high-density ferroelectric random access memory devices (FeRAMs) with capacitor over plug (COP) structure, oxygen diffusion barriers based on bi-layered Ir have been investigated. This paper describes the detailed characteristics of the barriers. A bi-layered Ir barrier was fabricated by repeating the deposition and RTO treatment of an Ir metal film, which was very effective to obtain excellent barrier properties against oxygen diffusion. Surface roughening was shown after RTO, but can be suppressed by lowering the RTO temperature. The roughening is caused by the formation of a gaseous phase of IrOx during RTO, and not by the formation of Ir hillocks. The stress of the bi-layered Ir barrier is tensile after RTO, which makes further stacking of more layers on the barrier with good adhesion possible. Performance of this barrier was checked using the post annealing in ¹⁸O isotope ambient at 650°C for 2 hours. SIMS profile showed the barrier prevented the diffusion of ¹⁸O, effectively. The above results strongly suggest that the bi-layered Ir barrier can be applied to the COP structure for high-density FeRAMs.     

光学轮廓仪在纸张粗化程度测定中的应用

采用光学轮廓仪和探针台阶仪测定了纯化学浆纸和含高得率浆纸粗化过程中的表面均方根粗糙度（Rq）变化，并对Rq值进行了频谱分析。结果表明：与探针扫描测定法相比，光学法测定很适合用来检测纸张表面遇水后发生的微小变化。此外，频谱分析的结果显示1．28—2．56mm的纤维组分是造成含高得率浆纸粗化的主要原因。     

Y型加糙体水力阻力试验研究

 大多数河工模型都需要加糙才能满足河工模型的阻力相似，因此模型加糙效果的好坏直接关系着河工模型模拟的效果和精度。通过水槽试验对Y型加糙体阻力特性进行了深入研究。研究结果表明：其糙率具有一个较大的调整范围，且随着加糙间距的增加水力阻力减小，减小的幅度越来越小，最后基本不变；雷诺数在3 500左右水流进入阻力平方区，进入阻力平方区后，随着相对淹没度的增大水力阻力减小，最后达一定值。     

铜面粗化剂RA-100的研制

介绍有机铜体系的铜面粗化剂RA-100的工作原理、工艺及其性能。     

聚碳酸酯化学镀镍工艺初探

对聚碳酸酯(PC)化学镀镍的除油工序进行了改进,并对影响PC化学镀镍的因素,如前处理工艺条件的选择、温度、pH值进行了讨论.结果表明,经强化处理的PC易起镀;若在温度55℃,pH值9.5,装载量为1.0 dm2/L时施镀,镀速为9.8μμm/h,镀层光亮,无裂纹,镀液稳定.     

不饱和聚酯树脂的粗化工艺

介绍了不饱和聚酯树脂的粗化工艺流程及各工艺规范通过正交试验确定了最佳粗化工艺条件：粗化液的体积分数为400ml／L温度为80～85℃,粗化时间为20min。讨论了粗化液用量、粗化温度和时间对粗化效果和镀层质量的影响经检测表明,该金属镀层与基体结合力良好目前该工艺已应用于生产中。