Alkali-metal Na Adsorption and Promoted Oxidation on Si(100)2×1 Surface

The alkali-metal Na adsorption on Si(100)2×1 surface and its promoted oxidation and Si oxidegrowth have been investigated by means of thermal desorption,work function,Auger electronspectroscopy and photoemission electron spectroscopy.The experimental data showed that therewas a new state,interface electron state,near the Fermi level after the deposition of Na atoms.It wasfound that the presence of Na always caused an increase of the oxygen initial uptake whereas thepromotion of Si oxide growth was observed only at the coverage of Na greater than 0.5 ML.A newmechanism of Na-promoted Si oxide growth is suggested in this paper.     

A numerical model for the dissolution of spherical particles in binary alloys under mixed mode control

A general numerical model is described for the dissolution kinetics of spherical particles in binary systems for any combination of first order reactions at the particle-matrix interface and long distance diffusion within the matrix. The model is applicable to both finite and infinite media and handles both complete and partial particle dissolution. It is shown that interfacial reactions can have a strong effect on the dissolution kinetics, the solute concentration at the particle-matrix interface and the solute concentration profile in the matrix.     

杏北开发区套损成因机理新认识及套损综合防治技术

阐述了杏北开发区通过对异常高压层、合理注水压力以及嫩二段底部岩心和岩电特征,在油层和非油层部位套损成因机理研究方面取得了新的认识.确定了杏北开发区油层、非油层部位套损的成因、易发生套损的具体位置以及套管损坏的形态.同时,依据取得的认识,在嫩二段底部成片套损防治、异常高压层的普查及治理、注水压力调整等方面采取了配套做法及治理效果,为杏北开发区今后的套损防治工作探索了新的途径.     

反向凝固法生产H90-钢-H90复合带

研究H90-钢-H90反向凝固复合过程中复合层厚度的变化规律以及复合带的组织和性能，探讨界面结合机理。结果表明：随着浸渍时间的增加，复合层的厚度变化经历了凝固生长、平衡相持和回熔3个阶段，钢带的预热温度越低，获得的最大复合层厚度越厚；H90复合层的组织为等轴晶粒，复合界面处Cu和Fe发生了扩散，而Zn未发生明显扩散，扩散层较薄，约为4μm；复合带的界面结合牢固；不同复合层厚度的复合带，其力学性能略有差异，但均达到GB5213——85所规定的F级深冲钢板的力学性能要求。     

水轮机调速器现代调节技术及选型

对目前比较先进的微机调速器的两种系统结构进行了分析，并对微机调节的控制策略和调节参数的设置及系统配置等作了介绍，并提出了对凋速器技术性能的评价标准和调速器选型时的突出问题，可为实际应用提供参考。     

Putting it all together – Formal verification of the VAMP

In the verified architecture microprocessor (VAMP) project we have designed, functionally verified, and synthesized a processor with full DLX instruction set, delayed branch, Tomasulo scheduler, maskable nested precise interrupts, pipelined fully IEEE compatible dual precision floating point unit with variable latency, and separate instruction and data caches. The verification has been carried out in the theorem proving system PVS. The processor has been implemented on a Xilinx FPGA. A shorter version of this article with the title “Instantiating uninterpreted functional units and memory system: functional verification of the VAMP” appeared in [8]. The work reported here was done while all the authors were with Saarland University.     

A hybrid extended finite element/level set method for modeling phase transformations

A hybrid numerical method for modelling the evolution of sharp phase interfaces on fixed grids is presented. We focus attention on two‐dimensional solidification problems, where the temperature field evolves according to classical heat conduction in two subdomains separated by a moving freezing front. The enrichment strategies of the eXtended Finite Element Method (X‐FEM) are employed to represent the jump in the temperature gradient that governs the velocity of the phase boundary. A new approach with the X‐FEM is suggested for this class of problems whereby the partition of unity is constructed with C¹(Ω) polynomials and enriched with a C⁰(Ω) function. This approach leads to jumps in temperature gradient occurring only at the phase boundary, and is shown to significantly improve estimates for the front velocity. Temporal derivatives of the temperature field in the vicinity of the phase front are obtained with a projection that employs discontinuous enrichment. In conjunction with a finer finite difference grid, the Level Set method is used to represent the evolution of the phase interface. An iterative procedure is adopted to satisfy the constraints on the temperature field on the phase boundary. The robustness and utility of the method is demonstrated with several benchmark problems of phase transformation. Copyright © 2002 John Wiley & Sons, Ltd.     

Hybrid LES — Review and assessment

In the late eighties and up to the beginning of nineties computation of turbulent flows is mostly dominated by RANS (Reynolds Averaged Navier-Stokes Simulation) type modelling. During the last few years URANS (Unsteady RANS) and LES (Large Eddy Simulation) type of approaches have been attempted with some success. Yet, there have been many difficulties when LES is applied to practical engineering problems and to high Reynolds number flows as energy dissipating eddies become really small and mesh resolution required for a reasonably resolved LES approaches that of DNS (Direct Numerical Simulation). An alternative solution suggested was to combine RANS and LES, which in general referred to as Hybrid LES. There have been many proposals for combining RANS and LES in different ways. In this article, some of the issues involved in performing hybrid LES reported in the recent literature is briefly reviewed.     

Influence of Ni Interlayers on the Mechanical Properties of Ti6Al4V/(WC-Co) Friction Welds

Ni interlayers were introduced prior to dissimilar friction welding of Ti6Al4V base material to three cemented carbide substrates. The fracture strength of Ti6Al4V/(WC-6 wt% Co) welds were poor and were markedly improved when 20-µm thick Ni interlayers were introduced prior to dissimilar friction welding. These results were only produced when the (WC-6 wt% Co) cermet was electroplated prior to friction welding. When the Ti6Al4V alloy was electroplated prior to friction welding, fractured WC particles and cracking were observed in the (WC-Co) carbide substrate. The fracture strengths of Ti6Al4V/(WC-11 wt% Co) and Ti6Al4V/(WC-24 wt% Co) welds were not improved when 20-µm thick Ni interlayers were introduced prior to friction welding. During mechanical testing, the Ni layer retained at the dissimilar joint interface created a region of weakness.     

单片机软件模拟SPI接口的解决方案

SPI接口是一种同步串行通讯接口，具备SPI接口的外围芯片十分丰富，应用非常广泛。但是，具备SPI接口的单片机种类较少。介绍了一种基于单片机的模拟SPI接口的方法，使没有SPI接口的单片机扩展带有SPI接口的外围芯片成为现实。