铜萃取剂BK992和LIX984的性能研究

研究羟肟类铜萃取剂的结构与性能的关系。试验研究了铜萃取剂BK992和LIX984的对比萃取及混合萃取性能指标 ,试验表明BK992与LIX984的使用性能相当 ,两种铜萃取剂相互混合不影响使用性能指标。     

Copper bioavailability from breakfasts containing tea. Influence of the addition of milk

The influence of drinking tea on copper bioavailability is unclear, particularly when tea is consumed with food. A breakfast meal containing white bread, margarine, strawberry jam, cheese and tea, with or without milk, was digested in; vitro and the dialysis of copper investigated. Reference breakfasts were prepared with water and water with milk. Copper dialysability (percentage of copper dialysed) was markedly increased by tea. The influence of adding milk to tea was not significant. A second study was carried out in rats using the breakfasts containing tea and water. They were spiked with ⁶⁴Cu and given orally to the animals in a single dose. Whole-body ⁶⁴Cu retention was measured over a 4-day period after administration. In order to determine the true absorption of ⁶⁴Cu a control group of rats received the dose intraperitioneally. The results in vivo indicate a tendency to higher absorption and retention of ⁶⁴Cu with tea. Liver ⁶⁴Cu retention was significantly elevated by tea. Therefore, the presence of tea in a breakfast meal favours the formation of soluble low-molecular-weight ligands which can be absorbed and retained by rats. The concomitant increase in liver copper retetition may be associated with higher bioavailability and/or lower copper mobilisation.     

含微量元素铜焊锡丝的研制

在６０／４０的锡铅焊料中加入０．２％左右的铜，凝固后具有均匀细小的共晶组织，其熔点为１８３℃，焊点强度和扩展率均高于未加铜的６０／４０锡铅焊料，并且含铜的锡铅焊料在焊接时，对铜烙铁头和微细铜线了小的熔蚀性。     

不甩线圈的多星形移相变极

对于某些槽数和极数比的多星形移相变极电机,提出与前人不同的是在两种极数下均不甩去线圈的绕组方案,使绕组利用率高,且线圈及其联接都较简单.这种绕组方案在一种极数下并联支路略有不平衡,其所引起的电机定子铜耗的增加是极其有限的,不致影响电机的正常运行.     

Optimization of anodic oxidation and Cu–Cr oxide catalyst preparation on structured aluminum plates processed by electro discharge machining

This paper describes the optimization of three processes applied in fabrication of a microstructured reactor for complete oxidation of volatile organic compounds. The first process involves the optimization of the electro discharge machining (EDM) method to produce a set of microchannels with a high length to diameter ratio of 100, with a standard deviation from the average diameter below 0.2%, and with a surface roughness not higher than 2.0 μm. To satisfy these criteria, fabrication of microchannels must be carried out with two machining passes in the Al51st alloy. Then, the effect of several parameters on the anodization current efficiency with respect to oxide formation was studied. The best process conditions to get a 30 μm porous alumina layer in a 0.4 M oxalic acid electrolyte, were found to be a temperature of 1 °C, an anodic current density of 5 mA/cm², and 23 h oxidation time. At last, the resulting coatings were impregnated with an aqueous solution of copper dichromate followed by drying and calcination at 450 °C to produce active catalysts. The effect of a copper dichromate concentration, number of impregnation cycles (1 or 2), and different after-treatments on catalytic activity and stability in complete oxidation of n-butane were studied. The catalytic activity of the obtained coatings is superior to that of alumina supported pelletized catalysts even at much lower loadings of active metals.     

Improved shape evolution of copper interconnects prepared by jet-stream etching

In the preparation of copper interconnects in the conductor pattern of a printed circuit board (PCB), wet etching processes are commonly adopted for creating patterns of high-density interconnects. Currently available techniques of immersion and spray etching could lead to poorly shaped wires due to complex flow fields or the disturbing puddling effect. A modified technique of arrayed jet-stream etching was developed in this work, aiming at producing well-defined copper interconnects on a PCB in a significantly shorter time. The results were appealing in that copper interconnects of 35/140 μm (thickness/width) exhibiting etching factors of greater than 6 were obtained in 20 s, much better than the conventional ones with etching factors of 3 to 5 and etching times of at least 2 min. In addition, uniformly etched copper interconnects with less than 20 μm undercuts were observed on one etching line. One additional point to note is that no banking agents or inhibitors as commonly seen in conventional etching techniques were needed in this new processing method.     

Concomitant Crystallization of Copper(II) Sachharinato Complexes with 2-methylpyrazine as a Monomer and an One-dimensional Polymer: Syntheses,Crystal Structures,Spectroscopic and Thermal Properties

The reaction of [Cu(sac)₂(H₂O)₄] · 2H₂O with 2-methylpyrazine (mpyz) leads two complexes, concomitant crystallization of a mononuclear complex [Cu(sac)₂(mpyz)(H₂O)₂] (1) and a polymeric complex [Cu(sac)₂(μ-mpyz)]_n (2). Both complexes have been characterized by elemental analyses, magnetic measurements, FT-IR and ESR, TG-DTA and single-crystal X-ray diffraction analyses. Single-crystal X-ray analyses show that complex 1 consists of discrete molecules in which the copper(II) ions exhibits a square-pyramidal coordination geometry. The individual molecules of 1 are connected into a hydrogen-bonded chain structure, which is further assembled to form a three-dimensional network by π–π stacking interactions. Complex 2 is an 1D coordination polymer in which copper(II) centers are bridged by the mpyz ligand. The chains are further assembled to form two-dimensional frameworks by π–π and C–H···π stacking interactions.     

玻璃与金属封接用杜美丝

利用ＡＥＳ、ＷＤＳ和ｘ－射线衍射等方法，研究了杜美丝表面层、铁镍芯与覆铜层界面的微观结构与特性。结果表明：良好的表面层应由Ｃｕ２Ｏ和非晶态的硼砂构成；玻璃与杜美丝的润湿性决定于表面层的净化程度和构成及加热条件。     

新试剂SPAQ与铜的显色反应研究及应用

本文研究了新试剂5-(4-磺酸钠苯偶氮)-8-氨基喹啉(SPAQ)与铜的显色反应及其最佳条件.在CTMAB存在下,于pH9.5的硼砂介质中,SPAQ与铜形成2:1的紫红色配合物,其最大吸收峰位于584.6nm,摩尔吸光系数为7.8×10~4.铜量在0～20μg/25ml范围内符合比尔定律.方法灵敏、快速,不需萃取分离,可用于粗铅、粗锌及锌合金中的微量铜的测定,结果满意.