1422轧机滑块式万向接轴的故障及处理

以热轧板厂粗轧主传动滑块式万向接轴为例，分析了该接轴及接轴平衡机构的常见故障及其排除方法，提出了日常维护措施。     

SWRH82B冶炼过程中几个工艺问题的探讨

通过对天津钢铁有限公司在SWRH82B钢冶炼过程中工艺数据的整理分析,就转炉冶炼终点如何实现高碳低磷和优化工序操作提出一些改进措施。     

电熔氧化镁炉弧压系数与弧流系数的测定

在实际测试的基础上，给出了电熔镁炉的弧压系数和弧流系数，为进一步研究电熔镁炉提供依据。     

铜萃取剂BK992和LIX984的性能研究

研究羟肟类铜萃取剂的结构与性能的关系。试验研究了铜萃取剂BK992和LIX984的对比萃取及混合萃取性能指标 ,试验表明BK992与LIX984的使用性能相当 ,两种铜萃取剂相互混合不影响使用性能指标。     

Copper bioavailability from breakfasts containing tea. Influence of the addition of milk

The influence of drinking tea on copper bioavailability is unclear, particularly when tea is consumed with food. A breakfast meal containing white bread, margarine, strawberry jam, cheese and tea, with or without milk, was digested in; vitro and the dialysis of copper investigated. Reference breakfasts were prepared with water and water with milk. Copper dialysability (percentage of copper dialysed) was markedly increased by tea. The influence of adding milk to tea was not significant. A second study was carried out in rats using the breakfasts containing tea and water. They were spiked with ⁶⁴Cu and given orally to the animals in a single dose. Whole-body ⁶⁴Cu retention was measured over a 4-day period after administration. In order to determine the true absorption of ⁶⁴Cu a control group of rats received the dose intraperitioneally. The results in vivo indicate a tendency to higher absorption and retention of ⁶⁴Cu with tea. Liver ⁶⁴Cu retention was significantly elevated by tea. Therefore, the presence of tea in a breakfast meal favours the formation of soluble low-molecular-weight ligands which can be absorbed and retained by rats. The concomitant increase in liver copper retetition may be associated with higher bioavailability and/or lower copper mobilisation.     

钒冶炼焙烧添加剂选择研究

对小型钒冶炼厂焙烧工艺所用添加剂进行改进的可能性进行了探讨，研究了几种常用添加剂的焙烧条件，分析比较了其性能，提出用ＮａＣｌ－Ｎａ２ＣＯ３作焙烧添加剂替代ＮａＣｌ可大幅度减少大气污染，提高冶钒转化率；且不改变工艺流程，无需设备投资，具有较好的经济效益和环境效益。     

含微量元素铜焊锡丝的研制

在６０／４０的锡铅焊料中加入０．２％左右的铜，凝固后具有均匀细小的共晶组织，其熔点为１８３℃，焊点强度和扩展率均高于未加铜的６０／４０锡铅焊料，并且含铜的锡铅焊料在焊接时，对铜烙铁头和微细铜线了小的熔蚀性。     

不甩线圈的多星形移相变极

对于某些槽数和极数比的多星形移相变极电机,提出与前人不同的是在两种极数下均不甩去线圈的绕组方案,使绕组利用率高,且线圈及其联接都较简单.这种绕组方案在一种极数下并联支路略有不平衡,其所引起的电机定子铜耗的增加是极其有限的,不致影响电机的正常运行.     

Optimization of anodic oxidation and Cu–Cr oxide catalyst preparation on structured aluminum plates processed by electro discharge machining

This paper describes the optimization of three processes applied in fabrication of a microstructured reactor for complete oxidation of volatile organic compounds. The first process involves the optimization of the electro discharge machining (EDM) method to produce a set of microchannels with a high length to diameter ratio of 100, with a standard deviation from the average diameter below 0.2%, and with a surface roughness not higher than 2.0 μm. To satisfy these criteria, fabrication of microchannels must be carried out with two machining passes in the Al51st alloy. Then, the effect of several parameters on the anodization current efficiency with respect to oxide formation was studied. The best process conditions to get a 30 μm porous alumina layer in a 0.4 M oxalic acid electrolyte, were found to be a temperature of 1 °C, an anodic current density of 5 mA/cm², and 23 h oxidation time. At last, the resulting coatings were impregnated with an aqueous solution of copper dichromate followed by drying and calcination at 450 °C to produce active catalysts. The effect of a copper dichromate concentration, number of impregnation cycles (1 or 2), and different after-treatments on catalytic activity and stability in complete oxidation of n-butane were studied. The catalytic activity of the obtained coatings is superior to that of alumina supported pelletized catalysts even at much lower loadings of active metals.     

Improved shape evolution of copper interconnects prepared by jet-stream etching

In the preparation of copper interconnects in the conductor pattern of a printed circuit board (PCB), wet etching processes are commonly adopted for creating patterns of high-density interconnects. Currently available techniques of immersion and spray etching could lead to poorly shaped wires due to complex flow fields or the disturbing puddling effect. A modified technique of arrayed jet-stream etching was developed in this work, aiming at producing well-defined copper interconnects on a PCB in a significantly shorter time. The results were appealing in that copper interconnects of 35/140 μm (thickness/width) exhibiting etching factors of greater than 6 were obtained in 20 s, much better than the conventional ones with etching factors of 3 to 5 and etching times of at least 2 min. In addition, uniformly etched copper interconnects with less than 20 μm undercuts were observed on one etching line. One additional point to note is that no banking agents or inhibitors as commonly seen in conventional etching techniques were needed in this new processing method.