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141.
D. Yadav 《Materials Science & Technology》2015,31(4):494-500
Copper particles were incorporated and retained in elemental state in an aluminium matrix by friction stir processing thereby producing a non-equilibrium particulate composite. The processed Al–Cup composite exhibited improved strength with significantly high ductility. The composite was stable up to a temperature of more than 300°C. Thermal exposure at 350°C for more than 10 min led to diffusion of Cu atoms into the Al matrix forming a core-shell type structure in the Cu particles and thus producing an Al–Cu core-shell composite. The shell consists of multiple layers, the thickness of which was controllable. 相似文献
142.
Chunyu Wang Volker Cimalla Genady Cherkashinin Henry Romanus Majdeddin Ali Oliver Ambacher 《Thin solid films》2007,515(5):2921-2925
We have grown indium oxide thin films on silicon substrates at low temperature by metal organic chemical vapor deposition. Polycrystalline film growth could only be obtained at temperatures below 400 °C. Above 400 °C, metallic indium deposition dominated. We have investigated the effect of substrate temperature and reactor pressure on the film growth and structural properties in the range of 250-350 °C and 5 ? 103-4 ? 104 Pa. The film grown at 300 °C exhibited a resistivity of about 3.6 × 10− 3 Ω cm and a maximal optical transmittance of more than 95% in the visible range. The film showed an optical band gap of about 3.6 eV. 相似文献
143.
The decreasing feature sizes in complementary metal-oxide semiconductor (CMOS) transistor technology will require the replacement of SiO2 with gate dielectrics that have a high dielectric constant (high-k) because as the SiO2 gate thickness is reduced below 1.4 nm, electron tunnelling effects and high leakage currents occur in SiO2, which present serious obstacles to future device reliability.In recent years significant progress has been made on the screening and selection of high-k gate dielectrics, understanding their physical properties, and their integration into CMOS technology.Now the family of hafnium oxide-based materials has emerged as the leading candidate for high-k gate dielectrics due to their excellent physical properties.It is also realized that the high-k oxides must be implemented in conjunction with metal gate electrodes to get sufficient potential for CMOS continue scaling.In the advanced nanoscale Si-based CMOS devices, the composition and thickness of interfacial layers in the gate stacks determine the critical performance of devices.Therefore, detailed atomicscale understandings of the microstructures and interfacial structures built in the advanced CMOS gate stacks,are highly required.In this paper, several high-resolution electron, ion, and photon-based techniques currently used to characterize the high-k gate dielectrics and interfaces at atomic-scale, are reviewed.Particularly, we critically review the research progress on the characterization of interface behavior and structural evolution in the high-k gate dielectrics by high-resolution transmission electron microscopy (HRTEM) and the related techniques based on scanning transmission electron microscopy (STEM), including high-angle annular darkfield (HAADF) imaging (also known as Z-contrast imaging), electron energy-loss spectroscopy (EELS), and energy dispersive X-ray spectroscopy (EDS), due to that HRTEM and STEM have become essential metrology tools for characterizing the dielectric gate stacks in the present and future generations of CMOS devices.In Section 1 of this review, the working principles of each technique are briefly introduced and their key features are outlined. In Section 2, microstructural characterizations of high-k gate dielectrics at atomic-scale by electron microscopy are critically reviewed by citing some recent results reported on high-k gate dielectrics.In Section 3, metal gate electrodes and the interfacial structures between high-k dielectrics and metal gates are discussed.The electron beam damage effects in high-k gate stacks are also evaluated, and their origins and prevention are described in Section 4.Finally, we end this review with personal perspectives towards the future challenges of atomic-scale material characterization in advanced CMOS gate stacks. 相似文献
144.
Eu(btc)metal organic frameworks(MOFs)were prepared by co-precipitation method via 1,2,4-benzenetricarboxylic acids(H3btc)connecting with Eu3+ions,and the morphology was controlled from compact spherical to irregular honeycomb by adjusting the pH of reaction solutions.The luminescence properties of Eu(btc)MOFs are found to be related to the surface morphology of products,and the compact spherical one performs stronger emission intensity.The sensing ability of Eu(btc)MOFs to 11 kinds of metal ions was investigated and a prominent quenching effect occurrs in Fe3+,or Ni2+solutions.Based on UV—vis absorption analysis,an“ion-fence”model presents the competition to absorb exciting light between Eu(btc)MOFs and adsorbed metal ions.Based on Stern-Volmer equation,the Eu(btc)detection is found with higher Ksv value and a lower detection limit.Meanwhile,a higher sensing efficiency is confirmed in the Eu(btc)MOFs with loose honeycomb due to aggravating porous surface offering much more sites for metal ions. 相似文献
145.
Haiyue Zu Kelvin Chau Temitope Olumide Olugbade Lulu Pan Chris Halling Dreyer Dick Ho-Kiu Chow Le Huang Lizhen Zheng Wenxue Tong Xu Li Ziyi Chen Xuan He Ri Zhang Jie Mi Ye Li Bingyang Dai Jiali Wang Jiankun Xu Kevin Liu Jian Lu Ling Qin 《材料科学技术学报》2021,63(4):145-160
In this study,perforated cannulated magnesium(Mg)hip stents were fabricated via modified Mg injection molding and conventional machining,respectively.Additionally,the stent canal was filled with paraffin to simulate injection of biomaterials.The microstructure,mechanical performance,corrosion behavior,and biocompatibility were comparably studied.Scanning electron microscopy(SEM)and energy dispersive spectroscopy(EDS)showed higher affinity of interstitial element such as oxygen and carbon as consequences of routine molding process.After immersion in SBF,machining stents showed reduced degradation rate and increased deposition of calcium phosphate compared to molding stents.Corrosion resistance was improved via paraffin-filling.Consistently,the hemolysis and in vitro osteoblast cell culture models showed favourable biocompatibility in machining stents compared to molding ones,which was improved by paraffin-filling treatment as well.These results implied that the feasibility of the prepared machining stents as the potential in vivo orthopaedic application where slower degradation is required,which could be enhanced by designing canal-filling injection of biomaterials as well. 相似文献
146.
Fujiwara Osamu 《电子科学学刊(英文版)》2008,25(3):384-388
Characteristic measurement of contact discharge currents are made through a hand-held metal rod from charged human body. Correlation coefficients are obtained, through Statistic Package for Social Science (SPSS), for various charge voltages, which is based on the effect test of electrode contact approach speeds on discharge current parameters of current peaks, maximum rising slope and spark lengths. Discharge parameters at charge voltage 300V are independent on approach speed. For charge voltages equal to and higher than 500V, the contact approach speed has strong positive correlation with discharge parameters of the peak current and the maximum rising slope, whereas has strong negative correlation with the spark length. 相似文献
147.
148.
149.
利用AMESim和MATLAB/Simulink联合仿真,建立某扫雷犁电液伺服系统的模型,在此基础上研究了GA—BP神经网络的辨识问题,对此非线性系统进行离线辨识实验,实验结果验证了该建模方法的有效性。 相似文献
150.