首页 | 本学科首页   官方微博 | 高级检索  
文章检索
  按 检索   检索词:      
出版年份:   被引次数:   他引次数: 提示:输入*表示无穷大
  收费全文   7779篇
  免费   723篇
  国内免费   528篇
电工技术   355篇
综合类   406篇
化学工业   1776篇
金属工艺   912篇
机械仪表   163篇
建筑科学   95篇
矿业工程   115篇
能源动力   466篇
轻工业   171篇
水利工程   30篇
石油天然气   159篇
武器工业   36篇
无线电   1598篇
一般工业技术   1867篇
冶金工业   430篇
原子能技术   141篇
自动化技术   310篇
  2024年   29篇
  2023年   265篇
  2022年   251篇
  2021年   350篇
  2020年   324篇
  2019年   321篇
  2018年   298篇
  2017年   342篇
  2016年   323篇
  2015年   311篇
  2014年   406篇
  2013年   410篇
  2012年   461篇
  2011年   579篇
  2010年   375篇
  2009年   466篇
  2008年   365篇
  2007年   448篇
  2006年   402篇
  2005年   334篇
  2004年   296篇
  2003年   239篇
  2002年   242篇
  2001年   182篇
  2000年   170篇
  1999年   110篇
  1998年   121篇
  1997年   100篇
  1996年   71篇
  1995年   58篇
  1994年   88篇
  1993年   52篇
  1992年   42篇
  1991年   35篇
  1990年   28篇
  1989年   12篇
  1988年   16篇
  1987年   5篇
  1986年   10篇
  1985年   9篇
  1984年   10篇
  1983年   7篇
  1982年   12篇
  1981年   13篇
  1980年   5篇
  1979年   10篇
  1978年   6篇
  1977年   4篇
  1976年   4篇
  1967年   2篇
排序方式: 共有9030条查询结果,搜索用时 283 毫秒
51.
Halogen-induced charge transfer polymerization of pyrrole in aqueous media   总被引:1,自引:0,他引:1  
E.T. Kang  T.C. Tan  K.G. Neoh  Y.K. Ong 《Polymer》1986,27(12):1958-1962
Simultaneous polymerization and doping of pyrrole have been carried out in the presence of a halogenic electron acceptor, bromine (Br2) or iodine (I2), in aqueous dispersion or in a two-phase solvent system. The morphology of the polypyrrole (PPY) so produced is granular and porous. The electrical conductivity of the PPY-I2 charge transfer (CT) complex is of the order of 101 ohm−1 cm−1 while that of the PPY-Br2 complex is about one order of magnitude less. Both complexes are stable in the atmosphere. The physicochemical properties of the PPY-I2 and PPY-Br2 CT complexes prepared under various experimental conditions are examined in detail.  相似文献   
52.
本文对氧化非晶硅磷掺杂的工艺条件进行了研究,得出掺磷氢化非晶硅的电导率随衬底温度、气体流量、气体压力、射频功率、淀积时间的变化关系,为非晶硅的有效掺杂和器件研究提供了依据。  相似文献   
53.
Iodine doping of CdTe layers grown on (100) GaAs by metal-organic vapor phase epitaxy (MOVPE) was studied using diethyltelluride (DETe) and diisopropyltelluride (DiPTe) as tellurium precursors and ethyliodine (EI) as a dopant. Electron densities of doped layers increased gradually with decreasing the growth temperature from 425°C to 325°C. Doped layers grown with DETe had higher electron densities than those grown with DiPTe. When the hot-wall temperature was increased from 200°C to 250°C at the growth temperature of 325°C, doped layers grown with DETe showed an increase of the electron density from 3.7×1016 cm−3 to 2.6×1018 cm−3. On the other hand, such an increase of the electron density was not observed for layers grown with DiPTe. The mechanisms for different doping properties for DETe and DiPTe were studied on the basis of the growth characteristics for these precursors. Higher thermal stability of DETe than that of DiPTe was considered to cause the difference of doping properties. With increasing the hot-wall temperature from 200°C to 250°C, the effective ratio of Cd to Te species on the growth surface became larger for layers grown with DETe than those grown with DiPTe. This was considered to decrease the compensation of doped iodine and to increase the electron density of layers grown with DETe. The effective ratio of Cd to Te species on the growth surface also increased with decreasing growth temperature. This was considered to increase the electron density with decreasing growth temperature.  相似文献   
54.
N-type Hg1−xCdxTe layers with x values of 0.3 and 0.7 have been grown by molecular beam epitaxy using iodine in the form of CdI2 as a dopant. Carrier concentrations up to 1.1 × 1018 cm−3 have been achieved for x = 0.7 and up to 7.6 × 1017 cm−3 for x=0.3. The best low temperature mobilities are 460 cm2/(Vs) and 1.2 × 105 cm2/(Vs) for x=0.7 and x=0.3, respectively. Using CdI2 as the dopant modulation doped HgTe quantum well structures have been grown. These structures display very pronounced Shubnikov-de Haas oscillations and quantum Hall plateaus. Electron densities in the 2D electron gas in the HgTe quantum well could be varied from 1.9 × 1011 cm−2 up to 1.4 × 1012 cm−2 by adjusting the thicknesses of the spacer and doped layer. Typical mobilities of the 2D electron gas are of the order of 5.0 × 104 cm2/(Vs) with the highest value being 7.8 × 104 cm2/(Vs).  相似文献   
55.
钛基Ru-La-Ti涂层阳极的电催化性能   总被引:6,自引:1,他引:5  
利用热分解法制备了不同La含量的钛基Ru-La-Ti涂层阳极,并研究了所制备涂层的电催化性能。结果表明,在Ru-Ti涂层阳极中掺杂稀土元素La可以提高涂层阳极的电催化活性,且La的掺杂量存在一个最佳范围(La的摩尔分数O.2)。涂层阳极电催化活性提高的原因在于La的引入可以提高涂层的有效活性表面积。  相似文献   
56.
Cobalt was used to modify the surface of spinel LiMn2O4 by a solution technique to produce Co^3 -modified surface material (COMSM). Cobalt was only doped into the surface of LiMn2O4 spinel. XPS(X-ray photoelectron spectroscopy) analysis confirms the valence state of Co^3 . COMSM has stable spinel structure and can prevent active materials from the corrosion of electrolyte. The ICP(inductively coupled plasma) determination of the spinel dissolution in electrolyte showed the content of Mn dissolved from COMSM was smaller than that from the pure spinel. AC impedance patterns show that the charge-transfer resistance (Rct) for COMSM is smaller than that for pure spinel. The particles of COMSM are bigger in size than those of pure spinel according to the micrographs of SEM(scanning electron microscopy). The determinations of the electrochemical characterization show that COMSM has both good cycling performance and high initial capacity of 124.1 mA/h at an average capacity loss of 0.19 mAh/g per cycle.  相似文献   
57.
CdTe films were prepared by physical vapour deposition on a substrate at room temperature (RT) as well as on a cold (LT) one using low deposition rate. The thickness-dependence of stoichiometry revealed an abrupt decrease in the Cd/Te ratio as the thickness increases. Change of thickness did not affect the type of observed (111) crystallographic texture, only the degree of preferred orientation is enhanced as the film grows. The internal strain was negligible while the crystallite size increased rapidly at small thickness (up to 400 nm), and less thickness dependence was observed with further film growth. However, thickness dependence of lattice parameters showed a minimum and a maximum at approximately 300 nm in the case of RT and LT, respectively. The observed change in conductivity from n- to p-type and its vital correlation with the stoichiometry and structural characteristics were presented. Based on thickness dependence of stoichiometry and lattice parameters as well as the conductivity type, formation and annihilation of lattice defects were considered.  相似文献   
58.
Studies were made on the thermally stimulated discharge currents (TSDCs) in pure (undoped) and Fe-doped polystyrene films as a function of polarizing field, polarizing temperature and dopant concentration. While undoped films exhibited a single peak, doped films showed two peaks one at low temperatures and another at high temperatures. The low temperature peak, which exhibits a shift towards lower temperatures with increasing dopant concentration, is attributed to the relaxation of the main chain, while the high temperature peak, which shows a tendency to shift towards higher temperatures with dopant concentration, is due to space charge polarization. The TSDCs were higher for low dopant concentrations than their undoped counterparts, while for high concentrations of the dopant, the TSDCs decreased. Formation of charge transfer complexes at low dopant concentrations and molecular aggregates at higher dopant concentrations are suggested as the possible reasons for this behaviour.  相似文献   
59.
Reply to Finley's (1987; see record 1988-00015-001) critique of rational-emotive philosophy, which claims that Ellis's (1981) response to Sharkey's (1981) criticisms of rational-emotive psychology reveals logical and philosophical confusion. (PsycINFO Database Record (c) 2010 APA, all rights reserved)  相似文献   
60.
硅外延片中的杂质控制   总被引:2,自引:0,他引:2  
有5类掺杂源影响硅的外延片中的杂质分布。主掺杂质控制外延层的杂质浓度,决定外延层的电阻率。固态外扩散、气相自掺杂和系统自掺杂影响衬底界面附近的外延层杂质浓度的深度分布。该文介绍了此3类掺杂源的掺杂过程和抑制方法。金属杂质在外延层中对器件有害,防止沾污和使用吸杂技术能降低金属杂质在外延层中的浓度。  相似文献   
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号