MEMS封装技术研究进展

介绍了MEMS封装技术的特点、材料以及新技术,包括单片全集成MEMS封装、多芯片组件(MCM)封装、倒装芯片封装、准密封封装和模块式MEMS封装等。文中还介绍了MEMS产品封装实例。     

声诱饵仿真试验系统

介绍了声诱饵仿真试验系统的组成、工作原理、对接装置结构等,建立了对接装置声耦合状态下的数学模型,对近场声压分布进行了仿真计算,得出了匹配材料厚度、发射和接收换能器的选取原则。     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.     

正确选用热力管网保温材料的几个问题

介绍了做好热力管网保温应具备的有关知识和数据，以及宝钢蒸汽主干管网在采用四种保温材料下的经济保温层厚度和相对的节能效益，认为目前适于宝钢公司热源温度在６００℃以下较好的保温材料有新型矿渣棉制品和泡沫石棉板。     

Low temperature delamination of plastic encapsulated microcircuits

Plastic encapsulated microcircuits (PEMs) are increasingly being used in applications requiring operation at temperatures lower than the manufacturer’s recommended minimum temperature, which is 0°C for commercial grade components and −40°C for industrial and automotive grade components. To characterize the susceptibility of PEMs to delamination at these extreme low temperatures, packages with different geometries, encapsulated in both biphenyl and novolac molding compounds, were subjected to up to 500 thermal cycles with minimum temperatures in the range −40 to −65°C in both the moisture saturated and baked conditions. Scanning acoustic microscopy revealed there was a negligible increase in delamination at the die-to-encapsulant interface after thermal cycling for the 84 lead PQFPs encapsulated in novolac and for both 84 lead PQFPs and 14 lead PDIPs encapsulated in biphenyl molding compound. Only the 14 lead novolac PDIPs exhibited increased delamination. Moisture exposure had a significant effect on the creation of additional delamination.     

基于工作站和EUCLID－IS的计算机组装结构CAD系统研究

随着集成电路技术的发展及计算机性能的不断提高，计算机组装结构设计在计算机，总体设计中的地位越来越重要，它直接影响到计算机性能的提高。本文针对一个基于工作站和ＥＵＣＬＩＤ－ＩＳ软件的电子计算机组结构ＣＡＤ系统，从软、硬件平台，系统功能及实现等方面进行了讨论，旨在为电子计算机组装结构设计提供一种强有力的、方便的设计工具，有利于增强国产计算机的市场竞争能力。     

基于工作站和EUCLID-IS的计算机组装结构CAD系统研究

随着集成电路技术的发展及计算机性能的不断提高，计算机组装结构设计在计算机，总体设计中的地位越来越重要，它直接影响到计算机性能的提高。本文针对一个基于工作站和ＥＵＣＬＩＤ－ＩＳ软件的电子计算机组结构ＣＡＤ系统，从软、硬件平台，系统功能及实现等方面进行了讨论，旨在为电子计算机组装结构设计提供一种强有力的、方便的设计工具，有利于增强国产计算机的市场竞争能力。     

锂铁氧体纳米晶的磁性能研究

我们用ＰＥＧ凝胶法合成出的ＬｉＦｅ＿５Ｏ＿３纳米晶，用ＸＲＤ和ＴＥＭ观测其粒径和形貌。用振动样品磁强计考察其比饱和磁化强度σ＿ｓ，随粒径口变化，得到样品的σ＿ｓ随Ｄ的减小而下降。     

湿硫化氢环境下的球罐腐蚀状况分析

在湿硫化氢环境下 ,尤其储存介质中的硫化氢含量超标时 ,很容易对储存容器壳体 (含焊缝和母材 )造成硫化氢应力腐蚀或氢鼓包。作者较仔细分析了 1 0 0 0m3 丙烯球罐产生硫化氢应力腐蚀开裂和40 0m3 LPG球罐产生氢鼓包的原因。提出了此类设备在设计选材、设备制造、施工安装和使用维护等环节应注意的问题。     

天然多糖类/蛋白质复合材料的研究进展

在参考了 31篇文献的基础上 ,详述了天然多糖类与蛋白质复合材料的研究进展