氧化铝增强的PdSe2/Si异质结光电探测器

为了降低暗电流,通过原子层沉积(ALD)生长了一层氧化铝(Al₂O₃)隧穿层,制备了PdSe₂/Al₂O₃/Si异质结光电探测器.通过优化Al₂O₃层的厚度,使得该探测器实现了高速和宽光谱响应.研究结果表明,在波长为808 nm的光照射和-2 V偏压下,所制备的光电探测器与未生长Al₂O₃的器件相比,暗电流降低了约3个数量级,器件的光响应度达到了约为0.31 A/W,对应的比探测率约为2.5×10¹² Jones,器件在零偏压下表现出明显的自驱动效应.经过循环测试1 200次后,器件保持良好的光响应.器件响应的上升时间和下降时间分别为7.1和15.6μs.结果表明,在二维层状半导体材料与Si之间引入Al₂O₃隧穿层,可以有效地降低器件的暗电流,有利于高性能的Si基光电探测器的制备.     

金属腔量子阱红外探测器共振波长的角度依赖性

测量了金属腔量子阱红外探测器在斜入射条件下的光电流谱,斜入射条件分为入射面垂直于器件长轴和平行于器件长轴两种情形.从实验和理论上研究了金属腔共振模对入射角度的依赖性.实验结果表明:入射面垂直于器件长轴时,腔模共振波长不随入射角度变化;入射面平行于器件长轴时,腔模共振波长随入射角度变大而向短波移动.测试结果和推导出的共振...     

Monolithic and Flexible ZnS/SnO2 Ultraviolet Photodetectors with Lateral Graphene Electrodes

A continuing trend of miniaturized and flexible electronics/optoelectronic calls for novel device architectures made by compatible fabrication techniques. However, traditional layer‐to‐layer structures cannot satisfy such a need. Herein, a novel monolithic optoelectronic device fabricated by a mask‐free laser direct writing method is demonstrated in which in situ laser induced graphene‐like materials are employed as lateral electrodes for flexible ZnS/SnO₂ ultraviolet photodetectors. Specifically, a ZnS/SnO₂ thin film comprised of heterogeneous ZnS/SnO₂ nanoparticles is first coated on polyimide (PI) sheets by a solution process. Then, CO₂ laser irradiation ablates designed areas of the ZnS/SnO₂ thin film and converts the underneath PI into highly conductive graphene as the lateral electrodes for the monolithic photodetectors. This in situ growth method provides good interfaces between the graphene electrodes and the semiconducting ZnS/SnO₂ resulting in high optoelectronic performance. The lateral electrode structure reduces total thickness of the devices, thus minimizing the strain and improving flexibility of the photodetectors. The demonstrated lithography‐free monolithic fabrication is a simple and cost‐effective method, showing a great potential for developement into roll‐to‐roll manufacturing of flexible electronics.     

PIN光电管在激光外差玻璃测厚系统中的应用

为了检测激光外差玻璃厚度测量系统中的弱光信号,介绍了激光外差玻璃测厚系统原理,并用MATLAB对其进行了仿真,分析了PIN管光电检测电路噪声产生因素,提出了减小噪声、提高信噪比的方法,采用PIN管设计的光电检测电路,为激光外差玻璃测厚系统提供了一种单元模块电路.     

1~26.5GHz GaAs PIN单刀单掷开关单片

采用GaAs PIN二极管,完成1~26.5 GHz的单刀单掷开关单片的设计、制作。SPST开关单片带内插损小于0.5 dB,驻波优于1.1,隔离度大于27 dB,在10~26.5 GHz,隔离度大于37 dB。开关单片采用MOCVD生长的GaAs纵向PIN二极管材料结构,76 mm GaAs圆片工艺加工制作。     

4H-SiC金属-半导体-金属结构紫外探测器的模拟与分析

用MEDICI软件对金属-半导体-金属(MSM)结构4H-SiC紫外(UV)探测器的I-V特性以及光谱响应等特性进行了模拟与分析,并探讨了金属电极的宽度、电极间距以及外延层厚度对探测器响应度的影响.结果表明,室温下该探测器的暗电流线性密度达到10-13A/μm,且在不同电压下光电流至少比暗电流大两个数量级;探测器的光谱响应范围为200~400 nm,在347 nm处响应度达到极大值;增大指宽或者减小指间距可以提高探测器的响应度;当波长小于峰值波长时外延层厚度对探测器的响应度基本没影响,而当波长大于峰值波长时随着外延层厚度的增大探测器的响应度有所增大.     

Ultraviolet-visible metal-semiconductor-metal photodetectors fabricated from InxGa1−xN (0≤x≤0.13)

Metal-semiconductor-metal (MSM) photodetectors have been fabricated on In_xGa_1−xN epitaxial films grown by metalorganic chemical vapor deposition within the composition range 0≤x≤0.13. The dark current and spectral response were measured for devices with a varying In mole fraction x. The devices, which had nominal finger widths and finger spacing of 5 μm, were biased with modest voltages in the range 2≤V_bias≤5 V. In general, turn-on wave-length and dark current increased with increasing x. Turn-on wavelengths ranged from λ=370 nm to 430 nm and dark current densities ranged from I_dark=2×10⁻² A/cm² (V_bias=5 V, x≈0.05) to 9×10⁴ A/cm² (V_bias=2 V, x≈0.13) depending on the In content, x, of the device active area.     

UTC-PD和RTD单片集成的器件模拟研究

单行载流子光电二极管与共振隧穿二极管单片集成器件是一种新型高速光电探测器,也是高速光电单稳双稳转换逻辑电路的一个基本单元。用Atlas软件对该集成电路单元进行了直流和交流特性的模拟研究,模拟得到的3dB带宽最高可达9THz。模拟发现,光照强度、吸收层厚度、掺杂浓度、收集层浓度是影响器件3dB带宽的主要因素。研究了器件材料参数、结构参数与器件3dB带宽之间的关系,并得到在现行工艺下优化后的单行载流子光电二极管和共振隧穿二极管单片集成器件的工艺参数,模拟出3dB带宽为1.03THz。同时,对器件模拟和半导体工艺间的误差进行了分析和估计。这一工作为单行载流子光电二极管和共振隧穿二极管单片集成器件的设计和研制提供了工艺参数基础。