SiC_P/AZ61复合材料半固态触变成形的数值模拟

采用等温热处理法制备SiCP/AZ61复合材料半固态坯料。运用所建立的高固相SiCP/AZ61复合材料本构模型,对其触变成形过程进行数值模拟,得到成形过程中的应力和应变分布,并对比了触变成形和常规成形的成形特点。结果表明,SiCP/AZ61复合材料触变成形具有变形抗力小、应力分布均匀的特点。通过对比试验结果和模拟结果可知,两者吻合较好,所获结果可指导镁基复合材料触变成形工艺实践。     

Microstructural evolution during partial remelting of AM60B magnesium alloy refined by MgCO3

AM60B magnesium alloy was refined by MgCO₃ and its microstructural evolution was investigated during partial remelting. The results indicate that MgCO₃ is an effective grain refiner for AM60B alloy and can decrease the grain size from 329 μm of the unrefined alloy to 69 μm. A semisolid microstructure with small and spheroidal primary particles can be obtained after being partially remelted. The microstructure evolution can be divided into four steps: the initial rapid coarsening, structure separation, spheroidization and final coarsening. Correspondingly, these four steps result from the phase transformations of β→α, α+β→L and α→L, α→L and two reverse reactions of α→L and L→α, respectively. One spheroidal primary particle in the semisolid microstructure usually originates one dendrite in the as-cast microstructure. The variation of primary particle size with holding time does not obey the LSW law, D_t³?D₀³=Kt, after the semisolid system is in its solid-liquid equilibrium state. Longer heating duration makes the primary particles more globular, but it makes their size larger at the same time.     

Inconel 617 and Stellite 6 alloys for tooling in thixoforming of steels

Thermal fatigue and high temperature wear are the two principle failure mechanisms for thixoforming dies. Samples of Inconel 617 and Stellite 6 alloys were submitted to thermal cycling under conditions which approximate thixoforming of steels and to sliding wear tests at 750 °C. The experimental results thus obtained were compared with those of the X32CrMoV33 hot work tool steel. The Inconel 617 and Stellite 6 samples are much more resistant to oxidation and to softening than the hot work tool steel, providing a superior resistance to thermal fatigue cracking. The wear resistance of the Inconel 617 and Stellite 6 alloys at 750 °C is also markedly superior. The adhesive oxides growing slowly on Inconel 617 and Stellite 6 alloys sustain the wear action without spalling and are claimed to be responsible for the superior wear resistance of these alloys at 750 °C.     

半固态AlSi7Mg合金的触变力学模型研究

采用G1eeble—1500热模拟实验机研究了半固态A1Si7Mg合金的触变力学行为.通过回归分析建立了半固态A1Si7Mg合金在不同温度下的粘塑性本构关系模型；利用自行开发的半固态金属触变成形装置进行了实验研究，并采用建立的本构关系应用DEFORM^TM商用软件进行了模拟计算与实验条件相同的变形过程．由模拟计算与实验结果相比较可知，建立的本构关系模型是合理的，模拟结果与实验结果基本吻合．     

预变形SiCp/ZA27复合材料在半固态等温热处理过程中组织的扫描电镜观察

用扫描电镜观察了预变形SiCp/ZA27复合材料在460℃等温热处理过程中的组织变化。结果表明，该复合材料的微观组织在经过程中经历了四个阶段：初期的快速粗化阶段、组织分离阶段、晶粒球状化阶段和最后的粗化阶段。当预变形量为20%时，初生晶由原来的具有不同方向的织构胞和粗短枝晶依次转变为少晶界的均匀组织、相互独立的细小多边形晶粒、15min时的球状晶粒和之后粗化了的球状晶粒。组织分离完成之后，晶粒的尺寸和形状系统随时间逐渐增大。当变形量为5%时，要获得球状晶必须处理80min以上，且所得晶粒尺寸大。     

Microstructure of shear-induced thixoformed Al-4.5Cu-1.5Mg alloy via RAP and SSTT processes

In this research, the effect of the thixoforming temperature on the microstructure and mechanical properties was investigated in the thixoforming of the feedstock produced by the RAP(recrystallization and partial melting) and SSTT(semi-solid thermal transformation) processes for Al-4.5Cu-1.5Mg alloy. In the RAP process, the percentage reduction in area was approximately 35%. Thixoforming was done at 610, 620, and 630 °C. Globular microstructure was observed at all temperatures and conditions. The minimum average globule size was 39 μm, and it was obtained in the thixoforming of the feedstock produced by the RAP process in the section of 4 mm in diameter at 620 ° C after applying shear. Its corresponding compressive strength was-877.44 MPa. The maximum average globule size was 136 μm, and it was obtained in the thixoforming of the feedstock produced by the SSTT process in the section of 10 mm in diameter at 630 °C before applying shear. Its corresponding compressive strength was-769.18 MPa. The finest and most spherical globules, as well as the highest compressive strength were obtained at 620 °C in both RAP and SSTT states.     

SiCp/2024 复合材料半固态坯二次加热组织的研究

研究了用于触变成形的SiCp/2024复合材料的二次加热组织及其影响因素。结果表明，对SiCp/2024复合材料的二次加热中最佳工艺参数为：重熔温度在590－600℃之间，保温时间为5－10min.SiCp/2024复合材料在局部重熔过程中具有较高的稳定性，随温度的提高和保温时间的增加，球形固相颗粒尺寸增加很小。5％SiCp/2024复合材料在590℃时的晶粒粗化速率常数为27.45μm^3/s,15%SiCp/2024复合材料和25％SiCp/2024复合材料在590℃时的晶粒粗化速率常数分别为12.54μm^3/s和6.89μm^3/s，均小于基体合金的晶粒粗化速率常数59.56μm^3/s。     

粉末触变成形制备SiCp/2024p复合材料半固态组织的研究

提出粉末触变成形这一新技术。研究了SiC_p/2024_p压块在部分重熔中的组织演变,也讨论了加热温度和SiC含量(0%~20%)对半固态组织的影响。结果表明：5%SiC_p/2024_p压块在635℃加热0~60 min的组织演变分为三个阶段：初期2024_p中晶粒的快速粗化、初生相周围液膜的形成,最后经球化形成触变成形所需细小、圆整的半固态浆料,对应的相变为θ→α,θ + α→L和α→L及α→L。适当升高温度,益于获得理想的半固态组织。SiC_p减缓了组织演变速率。初生相的粗化速率很小,一个粉末演变成一个α-Al颗粒。