流变仪在覆铜板工序中的应用

本文简要叙述利用流变仪对覆铜箔层压板生产工序中的胶液和半固化片参数进行控制,从而更好地保证胶液和 半固化片性状的一致性,以有利于控制板材流胶和品质。     

Valorisation of waste fractions from autohydrolysis of selected lignocellulosic materials

Non‐isothermal processing of lignocellulosic materials in aqueous media (autohydrolysis reaction) under mild conditions leads to solutions containing valuable chemicals (oligosaccharides, sugars and acetic acid) and other, undesired, compounds (belonging to the extractive and acid‐soluble lignin fractions) which have to be removed in further purification treatments. Liquors obtained by non‐isothermal autohydrolysis of Eucalyptus globulus wood and corncobs under a variety of operational conditions were extracted with ethyl acetate in order to remove non‐saccharide components, and the suitability of the fraction dissolved in the organic phase was assayed for possible utilisation as an antioxidant. The yield and antioxidant activity of ethyl acetate extracts (measured by the α,α‐diphenyl‐β‐picrylhydrazyl (DPPH) radical scavenging capacity) showed a strong dependence on the autohydrolysis conditions. The antioxidant activity of extracts obtained under selected operational conditions compared well with synthetic antioxidants. © 2003 Society of Chemical Industry     

Cu-Mg/Al_2O_3催化乙醇和乙二胺合成N-乙基乙二胺

在固定床反应器内,乙醇和乙二胺经分子间催化胺化反应合成了N-乙基乙二胺(NEED),考察了一系列铜系催化剂的活性,并筛选出催化性能较好的Cu-Mg/A l2O3催化剂;通过X射线衍射和透射扫描电子显微镜方法表征了助剂Mg对Cu/A l2O3催化剂的改性作用;考察了助催化剂Mg含量、反应温度、反应压力、进料量和乙二胺含量等对Cu-Mg/A l2O3催化剂性能的影响。实验结果表明,Cu-Mg/A l2O3催化剂具有很好的活性和选择性;在200℃、3.0MPa、质量分数20%的乙二胺乙醇溶液、进料量1.0mL/m in的条件下,乙二胺的转化率为71.56%,产物NEED的选择性和收率分别为92.62%和69.86%;经过20 d的连续使用表明,Cu-Mg/A l2O3催化剂具有良好的稳定性。     

KOAc/NaY催化合成邻甲基苯甲醚

以KOA c/NaY为催化剂,在连续流动固定床反应器内,邻甲基苯酚(OC)与碳酸二甲酯(DMC)经过气固相催化反应合成了邻甲基苯甲醚(OM)。考察了内、外扩散对KOA c/NaY催化剂活性的影响。实验结果表明,当气流线速度大于30cm/m in时可消除外扩散对合成反应的影响;当KOA c/NaY催化剂的平均粒径在0.30~0.75mm(20~80目的颗粒)时能消除内扩散对合成反应的影响。在消除内、外扩散效应后,还考察了反应温度、原料配比、空速对合成反应的影响,得到较佳的反应条件:催化剂5mL,反应温度548K,反应压力0.6M Pa,空速0.6h-1,n(DMC)∶n(OC)=1,在线评价时间7h。在此条件下,OC的转化率高达85.7%,OM的选择性大于99%。     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.     

铜线材酸性高速电镀致密光亮锡、锡铜合金

为了寻找低成本、低腐蚀、低污染高速电镀锡、锡铜合金工艺 ,在含光亮剂、柔软剂DL0 1、0 2、0 3的硫酸槽中在不同的电流密度、不同的搅拌速度下 ,在Φ0 .5mm的铜线上电镀Sn和Sn Cu合金镀层。DL0 1、0 2的主要成分是无芳香族的希夫碱 ,DL0 3的主要成分是醇醛缩合物。结果表明 ,在含有DL0 1、0 2、0 3和 35g/LSnSO4 ,137g/LH2 SO4 的镀液中 ,在Jc=10～ 90A/dm2 ,v=16 0～ 314m/min时 ,所得镀层致密、柔软、光亮。在含CuSO4 ·5H2 O 0 .5 ,3.5g/L的硫酸镀槽中 ,在Jc=9,18A/dm2 ,v=16 0m/min时获得了致密、柔软、光亮的Sn (0 .3%～ 0 .6 % )Cu合金镀层。     

Y-89在新桥矿选铜厂的应用实践

新桥矿选铜厂1999年使用捕收剂Y－89后，选铜回收率提高了4．82％，获得了显著的经济效益。     

环境友好阻燃环氧树脂覆铜板研究进展

论述了环境友好阻燃环氧树脂覆铜板研究开发的意义。提出通过开发并使用含氮、磷或硅的非卤阻燃型环氧树脂,含磷、氮或磷-氮的功能性阻燃固化剂和在体系中添加有机磷阻燃剂、氢氧化铝等无机阻燃剂等途径来开发环境友好阻燃环氧树脂覆铜板。并对我国在今后该领域的研究作了展望。     

由乙腈一步法制备乙酸丁酯的研究

以丁醇和制备丙烯腈的副产物乙腈为原料 ,采用一步法合成了乙酸丁酯。通过正交实验得到了影响反应的 4种因素。确定了最佳的工艺条件为 :催化剂的量为样品质量的 40 % ;n(CH3CN)∶ n(C4 H9OH) =1∶ 1 .0 5 ;反应温度为 1 0 5℃ ;反应时间为 8h。在此反应条件下 ,乙酸丁酯的收率为 88.8% ,纯度可达 99.5 %。并用气相色谱及红外光谱对产品的纯度进行了表征     

钛铜复合棒及其标准化

概述了钛铜复合棒研制开发及发展历程,并介绍了钛铜复合棒的主要性能,以及钛铜复合棒的标准化情况。