橡胶卷材挤出连续硫化生产线的结构特色与工作原理

介绍了橡胶防水防腐卷材挤出连续硫化生产线的结构、特点和工作原理;指出在目前国内同类设备中,该生产设备具有先进性,并可替代引进设备。     

基于虚拟分割机制的多服务交换路由器的研究

本文提出了一处基于虚拟分割机制的可编程多服务器由器实现结构：PVSMR，并对它的三个层面的主要构成及其关键技术进行了深入研究。PVSMR基于一种有效而灵活的资源虚拟分割算法，它能够提供与多类应用相适应的、灵活的报文处理和转发控制能力。     

淤泥质土状亚粘土的一些特征

珠江三角洲软土地区存在一种灰色亚粘土，其工程性能与淤泥、淤泥质土相似，但两者的物理力学性质却有明显的不同，这是一种在规范土名定义上处于过渡或边缘状态的粘性土，不是严格定义上的淤泥质土，也不是正常沉积的一般粘性土，土的强度和工程性质与淤泥质土类似，应该近沿海地区淤泥和淤泥质土对待，不应看成一般粘性土。     

Design for Consecutive Testability of System-on-a-Chip with Built-In Self Testable Cores

This paper introduces a new concept of testability called consecutive testability and proposes a design-for-testability method for making a given SoC consecutively testable based on integer linear programming problem. For a consecutively testable SoC, testing can be performed as follows. Test patterns of a core are propagated to the core inputs from test pattern sources (implemented either off-chip or on-chip) consecutively at the speed of system clock. Similarly the test responses are propagated to test response sinks (implemented either off-chip or on-chip) from the core outputs consecutively at the speed of system clock. The propagation of test patterns and responses is achieved by using interconnects and consecutive transparency properties of surrounding cores. All interconnects can be tested in a similar fashion. Therefore, it is possible to test not only logic faults but also timing faults that require consecutive application of test patterns at the speed of system clock since the consecutively testable SoC can achieve consecutive application of any test sequence at the speed of system clock.     

CAS-BUS: A Test Access Mechanism and a Toolbox Environment for Core-Based System Chip Testing

As System on a Chip (SoC) testing faces new challenges, some new test architectures must be developed. This paper describes a Test Access Mechanism (TAM) named CAS-BUS that solves some of the new problems the test industry has to deal with. This TAM is scalable, flexible and dynamically reconfigurable. The CAS-BUS architecture is compatible with the IEEE P1500 standard proposal in its current state of development, and is controlled by Boundary Scan features.This basic CAS-BUS architecture has been extended with two independent variants. The first extension has been designed in order to manage SoC made up with both wrapped cores and non wrapped cores with Boundray Scan features. The second deals with a test pin expansion method in order to solve the I/O bandwidth problem. The proposed solution is based on a new compression/decompression mechanism which provides significant results in case of non correlated test patterns processing. This solution avoids TAM performance degradation.These test architectures are based on the CAS-BUS TAM and allow trade-offs to optimize both test time and area overhead. A tool-box environment is provided, in order to automatically generate the needed component to build the chosen SoC test architecture.     

纳米碳酸钙制备过程中添加剂作用机理探讨

采用鼓泡碳化法 ,在最佳反应温度、反应物浓度的条件下 ,考察了添加剂对产物形状及粒径大小的影响 ,得到了直径为 2 0～ 30nm、长径比在 2 0左右且分散性能良好的针状纳米碳酸钙 ,并对添加剂作用机理进行了分析。     

东濮凹陷马寨滑脱断层的形成机制及地质意义

滑脱断层作为一种独特的地质现象，在国内外含油气盆地中都有发现，本文运用钻井，区域地质等资料，对东濮凹陷马寨滑脱断层的形成机制及其地质意义进行了研究，结果认为：形成滑脱断层需具备斜坡，塑性岩体和区域构造应力场3个基本条件，滑脱断层面之下油气富集程度较高，之上较差，马寨滑脱断层的发现，。不仅丰富和发展了地质构造理论，而且加深了对东濮凹陷石油地质规律的认识。     

PEG20000中试放大的工艺研究

在一定温度和催化剂作用下 ,分别利用本体聚合和溶剂聚合的方法 ,在 1L、10 0L不锈钢高压反应釜中合成了相对分子质量为 2 0 0 0 0的聚乙二醇 ,并讨论了聚合反应机理 ,研究了催化剂用量、反应温度、反应时间对聚合反应的影响。经过红外、核磁共振、凝胶色谱、化学分析等方法对产物进行了表征。     

硼酸铝晶须增强环氧树脂和双马来酰亚胺树脂体系的研究

本文以硼酸铝晶须为增强剂，以4，5-环氧环己烷-1，2-二甲酸二缩水甘油酯(TDE-85)，甲基纳狄克酸酐(MNA)、N，N’-二胺基二苯甲烷型双马来酰亚胺(BMI)/O，O′-二烯丙基双酚A(BA)体系分别作为基体制备晶须增强复合材料。研究了晶须对树脂的尺寸、表面处理方法、含量对树脂体系力学性能和热性能的影响；通过扫描电子显微镜(SEM)分析了浇注体的弯曲、冲击断口，研究晶须的增强机理。     

A continuum-based modeling of MEMS devices for estimating their resonant frequencies

A continuum-based modeling of coupled electrostatics-structure interactions is presented for the frequency computations of MEMS devices. The present general formulation of electrostatics accounting for free space is validated first by specializing it to one-dimensional uniform motion of conducting surfaces and comparing the resulting electrostatics to conventional lumped models. The general coupled electrostatics-structure interactions are then applied for the prediction of resonant frequencies of MEMS devices due to bias-voltage changes and temperature variations. Comparisons of predicted resonant frequencies obtained by the present coupled electrostatics-structure interaction models with experimental results available in the literature demonstrate that the proposed continuum-based interaction modeling yields high-confidence predictions of resonant frequencies of MEMS devices.