印制电路板废水处理工程实例

文章介绍了"分流预处理+MBR+Fenton"工艺在印制电路板废水处理上的应用,该工艺自2013年10月投产至今处理效果稳定。出水各项指标均达到相关标准。     

不同还原体系银油墨打印对聚酰亚胺基板化学镀铜制备印制电路板的影响

先在普通打印机上用活化导电银油墨将线路图打印在聚酰亚胺(PI)基板上,固化后再化学镀铜制得印制电路板(PCB)。研究了导电银油墨的还原剂对不同体系镀液化学镀铜层厚度、导电性、结合力和抗氧化性的影响。结果表明,油墨的还原剂相同时,甲醛体系化学镀铜层的综合性能优于乙醛酸镀液。导电银油墨的最佳还原剂为丙酸,即油墨的最佳配方为:丙酸0.5 mol/L,Ag NO3 0.5 mol/L,10%(质量分数)OP乳化剂适量。采用0.5 mol/L丙酸油墨–甲醛镀液体系制得厚度为3.10μm的铜镀层,其抗氧化时间为44 s,电阻率为1.00×10-7?·m,与PI基板间的结合力良好,综合性能最佳。     

多元媒复合净化技术处理印制电路板废水

根据某线路板公司废水的来源和特点,在分类收集和预处理的基础上,采用多元媒复合净化技术进行处理。应用实践表明,多元媒复合净化技术具有药剂成本低、节能高效、少渣、经济等优点,值得在印制电路板废水处理领域推广应用。     

单件小批量PCB塑料盒参数化设计及快速原型制造

以车载终端项目开发过程中遇到的单件小批量印刷电路板(PCB)塑料安装盒为研究对象。根据单件小批量PCB关键尺寸及功能端口要求,采用三坐标测量等方法获取该PCB点云数据。借助Imageware软件等,提取该PCB关键尺寸参数,确定该PCB安装盒设计参数。基于Solid Works软件完成该PCB塑料安装盒参数化设计,形成三维造型,并完成虚拟装配及干涉检查。利用3D打印技术,完成PCB塑料安装盒产品工程样机快速原型制造。对项目开发过程中单件小批量塑料安装盒的快速和经济制造具有一定的工程应用价值。     

全球挠性印制板的市场及其技术研究

介绍了2010年全球FPC发展的增长率和市场份额,分析了FPC的详细市场特点,概述了FPC的市场未来发展,同时,简述了2010年后全球FPC技术发展趋势。     

Flexible Blade‐Coated Multicolor Polymer Light‐Emitting Diodes for Optoelectronic Sensors

A method to print two materials of different functionality during the same printing step is presented. In printed electronics, devices are built layer by layer and conventionally only one type of material is deposited in one pass. Here, the challenges involving printing of two emissive materials to form polymer light‐emitting diodes (PLEDs) that emit light of different wavelengths without any significant changes in the device characteristics are described. The surface‐energy‐patterning technique is utilized to print materials in regions of interest. This technique proves beneficial in reducing the amount of ink used during blade coating and improving the reproducibility of printed films. A variety of colors (green, red, and near‐infrared) are demonstrated and characterized. This is the first known attempt to print multiple materials by blade coating. These devices are further used in conjunction with a commercially available photodiode to perform blood oxygenation measurements on the wrist, where common accessories are worn. Prior to actual application, the threshold conditions for each color are discussed, in order to acquire a stable and reproducible photoplethysmogram (PPG) signal. Finally, based on the conditions, PPG and oxygenation measurements are successfully performed on the wrist with green and red PLEDs.     

On the electrochemical migration mechanism of tin in electronics

Electrochemical migration (ECM) of tin can result in the growth of a metal deposit with a dendritic structure from cathode to anode. In electronics, such growth can lead to short circuit of biased electrodes, potentially leading to intermittent or complete failure of an electronic device. In this paper, mechanistic aspects of ECM of tin are discussed in detail, using experimental results on ECM of tin in various environments and varying potential bias. Results on the formation of local pH changes by the electrodes and experiments observations are combined with thermodynamic stability of tin species as depicted in the Pourbaix diagram.     

高速纺涤纶切片及粉屑的热分析

本文分析了高速纺涤纶生、干切片及粉屑的热性能等。发现同一工厂生产的切片，其羧基含量和热性能波动较大，与一些优质切片相比存在一定的差距。随分子量分布加宽切片的热性能变差。干切片粉屑与干切片的熔点接近，但熔融结晶峰值温度高于切片，过冷度降低，峰底宽变窄，它会在纺丝中造成纤维固化结晶时间的不同，影响ＰＥＴＰＯＹ结构的均一。     

Architectural and Basic Circuit Considerations for a Flexible 128 × 128 Mixed-Signal SIMD Vision Chip

From a system level perspective, this paper presents a 128 × 128 flexible and reconfigurable Focal-Plane Analog Programmable Array Processor, which has been designed as a single chip in a 0.35 m standard digital 1P-5M CMOS technology. The core processing array has been designed to achieve high-speed of operation and large-enough accuracy (7 bits) with low power consumption. The chip includes on-chip program memory to allow for the execution of complex, sequential and/or bifurcation flow image processing algorithms. It also includes the structures and circuits needed to guarantee its embedding into conventional digital hosting systems: external data interchange and control are completely digital. The chip contains close to four million transistors, 90% of them working in analog mode. The chip features up to 330 GOPs (Giga Operations per second), and uses the power supply (180 GOP/Joule) and the silicon area (3.8 GOPS/mm²) efficiently, and is able to maintain VGA processing throughputs of 100 Frames/s with about 10–20 basic image processing tasks on each frame.     

印制版天线用常温固化氟碳涂料的研制

介绍了印制版天线用氟碳涂料的性能要求及其组成,重点讨论了氟碳树脂、固化剂和助剂对涂膜性能的影响,并用红外光谱手段对氟碳涂料的常温固化进行了跟踪。通过对比,选用常熟中昊氟碳树脂、N-3390固化剂、二丁基二月桂酸锡促进剂、BYK-161润湿分散剂、二甲苯和醋酸丁酯混合溶剂体系制备得到的常温固化氟碳涂料具有优异的耐候性、“三防”性、物理机械性能和透波性,对天线金属贴片和介质基板保护性良好。