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An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates 总被引:1,自引:0,他引:1
S. Chada W. Laub R. A. Fournelle D. Shangguan 《Journal of Electronic Materials》1999,28(11):1194-1202
An improved numerical method has been developed for calculating the thickness of intermetallic layers formed between Cu substrates
and solders during the soldering process. The improved method takes into account intermetallic dissolution during heating
and intermetallic precipitation during cooling and requires as input (1) the temperature-time profile for the soldering process,
(2) the experimentally determined isothermal growth parameters for the growth of the intermetallic layer into Cu saturated
molten solder, (3) the experimentally determined Nernst-Brunner parameters for the dissolution of Cu into molten solder, (4)
the experimentally determined solubility of Cu in molten solder and (5) assumptions about the thickness of the boundary layer
in the liquid ahead of the growing intermetallic. Calculations show that the improved method predicts intermetallic growth
between Cu substrates and 96.5Sn-3.5Ag solder during reflow soldering better than a previously developed method, which did
not take into account dissolution during heating and precipitation during cooling. Calculations further show that dissolution
has a significant effect on growth, while precipitation does not. 相似文献
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针对某铜锡多金属矿尾矿进行工艺矿物学研究,发现该尾矿含有钨、锡、铋等有价金属,含量分别为0.088%、0.082%和0.054%。研究结果表明虽然有价元素含量低,但均以矿物形式存在且粒度较粗,有价矿物集合体解离情况好,且与脉石矿物之间存在较大的相对密度差异。富集试验表明硫化物矿物通过淘洗可得到有效富集,因此选矿试验可利用矿物之间的密度差。通过重选实现有价矿物的预富集;针对淘洗富集产品的工艺矿物学研究结果表明:有价矿物磁黄铁矿、白钨矿、锡石、黑钨矿和自然铋的粒度相对较粗,一般为0.02~0.104mm,而且单体解离度都在80%以上,解离比较充分,有利于后续彼此之间的分离。根据尾矿中有用矿物嵌布关系、粒度分布和解离度等工艺矿物学结论,选厂采用"重选预富集-铋硫混浮-铋硫分离-钨锡重选富集-浮选分离"工艺,获得了铋精矿、钨精矿和锡精矿,提高了企业的经济效益。 相似文献
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Thin film combinatorial sputter deposited Cu6Sn5 + C alloys were prepared and found to be amorphous and/or nanostructured upon removal from the sample preparation chamber. Samples having approximate compositions (Cu6Sn5)1−xCx with 0.16 < x < 0.26 have been stored at room temperature and investigated over the course of about one year using X-ray diffraction (XRD). Simple models were employed to analyze the observed changes in the XRD patterns. Relatively sharp (nanocrystalline) components having Bragg angles corresponding to hexagonal Cu6Sn5 grew in intensity at the expense of broader (amorphous) components as a function of time. The grain size of the nanocrystalline components was approximately time independent, but depended on the amount of carbon present. The logarithm of the recrystallization time and the activation energy for crystallization appeared to be linearly dependent on the carbon content for the composition range that has been studied, as inferred from the Avrami-Johnson-Mehl equation. XRD patterns of samples with x > 0.26 appear to be relatively unchanged after a period of storage at room temperature for one year. 相似文献
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The decomposition and precipitation behaviors of a quenched Cu–15wt%Sn alloy as a function of aging temperature were investigated using transmission electron microscopy (TEM). Focused ion beam (FIB) was employed to assist TEM specimen preparation. At 300 °C, the decomposition of the supersaturated α′ phase occurred at grain boundaries, displaying a cellular morphology. The lamellae were found with ζ and α phases, rather than with the equilibrium ε and α phases. The ζ and α phases exhibit a well-defined orientation relationship (OR) as $ (1\bar{1}0)_{\alpha } //(0001)_{\zeta } ,\;[11\bar{2}]_{\alpha } //[\bar{1}2\bar{1}0]_{\zeta } $ . On the other hand, at 320 °C, only incipient lamellar structures of several micron meters were observed, which were composed of the δ and α phases. At the same time, abundant intragranular precipitation of the ε phase in the form of platelets was observed, and OR as $ (1\bar{1}1)_{\alpha } //(001)_{\varepsilon } , $ [110] α //[100] ε exists between ε phase and the α phase. These contrasting precipitation behaviors are discussed from the viewpoint of crystallographic coherency of these phases. 相似文献
19.
In the present work, we show that a large interfacial energy gradient is produced at a front of an electrochemical wave appearing in CuSn-alloy oscillatory electrodeposition from an aqueous solution by observing the directional lateral motion of an oil droplet put on an electrode surface. During the oscillation, the surface composition of the electrodeposit changed periodically between Cu-rich and Sn-rich alloys. The transition from the Cu-rich phase to the Sn-rich phase, or vice versa, initiated at a region of the electrode and propagated to the entire surface as an electrochemical wave. Contact angle measurements of the droplet revealed that the electrochemical interfacial energy varies largely between during Cu-rich and Sn-rich alloy electrodeposition. Repetitive approaches of the electrochemical wave front to the droplet drives the directional movement of the droplet, indicating the lateral imbalance of the interfacial energy (i.e., the interfacial tension) at the front is so large that the force produced by the imbalance can transport macroscopic objects such as an oil droplet. 相似文献
20.
Effect of electrodeposition parameters on the hydrogen permeation during Cu-Sn alloy electrodeposition 总被引:1,自引:0,他引:1
The Cu-Sn alloy coatings were synthesized on 27SiMn steel by direct current (DC), pulse current (PC) and pulse reverse current (PRC) electrodeposition techniques from pyrophosphate-based electrolyte. The hydrogen permeation behaviors during the electrodeposition by different techniques were investigated using Devanathan-Stachurski method. The results demonstrated that the hydrogen permeation amount of different electrodeposition techniques decreased in the order: DC > PC > PRC. Frequency and duty cycle have great effect on the sub-surface concentration Co of atomic hydrogen and hydrogen permeation amount. The minimum of hydrogen permeation amount was observed at the frequency of 1000 Hz or 2500 Hz and the duty cycle of 40%. It indicates that the amount of permeated hydrogen in the steel during deposition can be reduced due to the decrease of Co by PC and PRC methods. 相似文献