纯钛板材冷拉深成形过程中的组织与性能

纯钛板材冷拉深成形困难,组织与力学性能变化显著。文章以TA2纯钛半球形曲面件冷拉深成形为对象,研究该成形过程中材料的微观组织与力学性能变化,分析拉深变形特点与微观组织、力学性能的关系,并进一步研究改善拉深件后续塑性变形能力的热处理方法。结果表明,拉深件不同区域微观组织及力学性能存在差异:变形量越大,形变孪晶越多,组织形貌越复杂,强度越高,塑性越低。退火可以有效地改善其组织及力学性能,退火温度对微观组织均匀性和晶粒大小有显著的影响。     

合金化Ti对浸金属碳/铜复合材料热导率的影响

在基体中添加少量活性Ti,采用无压浸渗工艺制备碳纤维细编穿刺织物/铜复合材料(C/Cu),并利用XRD、SEM和EDS等检测手段对复合材料的微观组织和界面特性进行研究,并对复合材料的热导率进行测定。结果表明,在铜基体中加入有助于强碳化物形成的Ti,可有效提高铜及铜合金与碳的自发润湿性,实现了采用无压浸渗工艺制备C/Cu复合材料;随温度的升高复合材料热导率增加;当Ti含量在3%～5%时,复合材料热导率随Ti含量的增加而增大;当Ti含量超过5%时,复合材料热导率随Ti含量的增加而降低,说明Ti含量对复合材料热导率有显著影响。     

钨丝增强Zr基非晶复合材料动态力学行为及断裂特性

采用渗流铸造法制备出d6mm钨丝增强ZrTiCuNiBe非晶合金复合材料,并利用Hopkinson压杆冲击加载装置、X射线衍射仪（XRD）和扫描电镜（SEM）等手段研究其动态压缩行为及断裂特性。结果表明：随着钨丝直径减小和体积分数的增加,材料的动态压缩强度增大;当钨丝直径为0．25mm,体积分数为60％时,材料的动态压缩强度高达2600MPa,断裂模式为剪切断裂和劈裂混合破坏模式,同时有钨丝与基体发生脱粘现象。非晶基体在动态压缩条件下表现出显著的热软化和熔化特征。     

Ti对C/Cu复合材料界面润湿及浸渗组织的影响

采用含Ti的铜合金及无压反应浸渗工艺制备C／Cu复合材料,利用XRD,SEM和EDS等检测手段分析研究试样的显微组织,讨论浸渗过程中的界面反应。结果表明：在铜基体中加入强碳化物形成元素Ti,可提高铜及铜合金与碳的自发润湿性,使无压浸渗工艺制备C／Cu复合材料成为可能;复合材料中的主相为Cu、C和TiC,TiC以溶解析出的形式形成于碳纤维周围,合金中的Ti含量决定复合材料中TiC的含量,适量Tj可降低系统的润湿角并有利于浸渗进行,但Ti过量将对纤维造成损伤,使复合材料中碳纤维的体积分数下降。     

工艺参数对低压铸造薄壁件充型能力的影响

通过数值模拟方法研究了低压铸造铝合金薄板件熔体充填过程的流动形态,在此基础上,进一步探讨了充型压力、升压速率及型腔厚度因素与充填能力的关系.结果表明,在反重力场作用下,铝合金熔体从下而上逐层充填薄壁型腔,但随着壁厚增加,射流区两侧的涡流面积增大,出现较明显的反向充填特征.另外,充型压力和升压速率的增大有助于改善反重力铸造铝合金薄壁件的充填能力.     

YBCO的生长取向及定向凝固机制研究

利用定向凝固技术制备了取向良好的YBCO棒材,其a-b晶面与提拉方向的夹角小于5°.为研究YBCO生长的各向异性及其定向凝固机制,分别通过空淬及炉冷的方式获取了熔体生长的YBCO晶粒形貌及固液界面形貌.YBCO晶粒呈现片层状结构,其长厚比约为2～5.晶体生长的固液界面清晰反映出了外延生长的特征.基于上述结果,讨论了YBCO的定向凝固机制,认为YBCO的定向凝固是由择优生长及外延生长两阶段构成,这很好地解释了本文的试验结果.     

Interfacial characteristics and dynamic mechanical properties of Wf/Zr-based metallic glass matrix composites

Tungsten fiber reinforced Zr41.25Ti13.75Cu12.5Ni10Be22.5 metallic glass matrix composites were fabricated by means of melt infiltration casting. Their dynamic compressive tests were performed using a Hopkinson bar. The relationship between the interfacial characteristics and the dynamic compressive behavior was investigated. The results indicate that the interface characteristics of composites include interfacial diffusion and interfacial reaction, and the interfacial shear strength increases when the interfacial reaction is serious. The dynamic plastic performance are improved obviously if the suitable interface reaction occurs. The failure occurs by shear and the fibers split longitudinally if there is no interface reaction or a little reaction; in contrast, holistic failure occurs if there is too much interface reaction.     

Effects of 5%Ni addition on thermal stability and crystallization behavior of Mg65Cu25Tb10 bulk metallic glass

The effects of 5%Ni addition on the glass forming ability, thermal stability and crystallization behavior of Mg65Cu25Tb10 bulk metallic glass were investigated using X-ray diffractometry, differential scanning calorimetry and transmission electron microscopy. The small amount of Ni addition reduces the glass forming ability and thermal stability due to a significant decrease in the crystallization activation energy. Analyses of crystallization kinetics give evidence to the existence of quenched-in nuclei in amorphous Mg65Cu20Ni5Th10. Final crystallization products are basically same for Mg65Cu25Tb10 and Mg65Cu25Ni5Tb10.     

Microstructure and stopped growth mechanism of Y123 bulk fabricated by directional infiltration and growth

The infiltration-growth process was used as an alternative to conventional melt processing techniques for the preparation of bulk YBa2Cu3O7-x(Y123) with freely dispersed small size Y2BaCuO5(Y211) particles. Bulk YBCO superconductors with uniformly distributed particles of micron-sized Y211 were prepared by the directional infiltration and growth(DIG). The microstructure changes of the Y211 particles at various stages of processing were studied. About 70% of Y211 particles are under 1μn in the final sample. The different stopped growth mechanism of this material along the c axis and ab plane was discussed.Undercooling and viscosity lead to tanglesome thick boundary layer. So the Y123 growth along c axis is stopped. Yttrium lack in front of the ab plane is the main reason why the growth stops at this direction.     

低压辅助熔渗3D-C/Cu复合材料的组织和界面特性

以碳纤维细编穿刺织物为预制体,Cu-6Ti为基体合金,采用低压辅助熔渗工艺成功制备了3D-C/Cu复合材料,并利用XRD、OM、SEM和EDS对复合材料的微观组织和界面特性进行了研究.结果表明,添加适量的Ti能明显改善碳纤维与铜基体的润湿性,有利于熔渗的进行.熔渗过程中,合金熔体在压差作用下渗入碳纤维织物中,微观组织分析表明熔渗效果良好;复合材料的界面通过Ti与C的反应扩散形成, 扩散使反应层厚度不断增加,经过54 min后反应扩散完毕.