滚切式双边剪剪切质量分析

分析了4种中厚板切边过程中切口缺陷的形状及其形成原因,得出防止钢板在被夹送时跑偏即可避免剪切缺陷并采取了相应对策,实施后提高了钢板成材率。     

Elastic-plastic analytical solution for centric crack loaded by two pairs of point shear forces in finite plate

1 Introduction A great number of cracks exist in metal materials. Their existence and interaction often lead to high stress concentration and become the source of weakening and failure of metal materials[1- 4]. The elastic-plastic analysis for a cracked p…     

Analysis of damage localization for ductile metal in process of shear band propagation

1 Introduction Shear localization is an important and often dominating deformation and failure mechanism for Ti and Ti alloy in dynamic loadings[1—10]. The eventual outcome of localized deformation is ductile rupture and material separation. Shear locali…     

Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes

The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,a _effs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.     

Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds

Copper wire, serving as a cost-saving alternative to gold wire, has been used in many high-end thermosonic ball bonding applications. In this paper, the bond shear force, bond shear strength, and the ball bond diameter are adopted to evaluate the bonding quality. It is concluded that the ef/~cient ultrasonic power is needed to soften the ball to form the copper bonds with high bonding strength. However, excessive ultrasonic power would serve as a fatigue loading to weaken the bonding. Excessive or less bonding force would cause cratering in the silicon.     

几何因素与摩擦耦合对高纯铝箔剪切织构的影响

采用取向分布函数 (ODF)研究了轧制几何因素、轧制摩擦条件对高纯铝箔轧制织构的影响。结果显示 ,如果轧制摩擦因数大 ,当处于均匀变形几何条件 1相似文献   

剪切变形方向特征对高纯铝箔轧制织构的影响

运用取向分布函数(ODF)研究了每个轧制道次的剪切变形特征对高纯铝箔轧制织构的影响.提出用中性角的相对大小来量化轧制剪切变形作用方向改变的位置,运用Taylor晶体塑性变形理论模拟计算了中性角的相对大小对轧制织构演变的影响.实测与模拟的轧制织构特征表明:中性角靠近轧制变形区的中心位置有利于形成{001}<110>剪切织构,从而证实了除剪切变形的程度外,剪切变形方向改变的位置也是影响高纯铝箔轧制织构的重要因素.     

滚切剪剪切力的实验研究

对直导向滚切剪的剪切力进行了实验研究，得到了计算最大剪切力的经验公式。     

高层住宅结构设计

主要介绍长沙梦泽园高层住宅从基础到上部楼层各部位的结构设计,以及在设计、施工过程中所考虑的一些问题及处理方法。     

Adhesion Mechanisms of Polyurethanes to Glass Surfaces I. Structure-Property Relationships in Polyurethanes and Their Effects on Adhesion to Glass

Polyurethanes were prepared from toluene diisocyanate (TDI), 1-4-butane diol (BDO) and polycaprolactone-based triols with varying molecular weights. Among each molecular weight triol-based urethane, hard segment content was varied from 20% to 70%. Differential scanning calorimetry, tensile testing, and Iosipescu shear testing were done on all the various urethanes prepared. Thermal characterization data revealed the dependence of phase separation on hard segment content as well as on the triol molecular weight. Tensile data and Iosipescu shear data further confirmed the observations made from the DSC data. The data further indicated that phase separation can greatly improve the modulus of cross-linked segmented urethanes. Adhesion of these urethanes to glass surface was evaluated using soda-lime float glass plate. Urethane samples were cast on the air side of the glass plates and adhesion was measured in shear mode. Adhesion data indicated that in addition to hard segment content, modulus, cross-link density, and molecular weight of the triols, phase separation seems to be a major factor in controlling adhesion. Surfaces of the failed adhesion samples were also analyzed and the failure mode was found to be cohesive, in varying degree, with the different urethane systems.