Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging

A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n ≈ 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress.     

焦磷酸盐低锡青铜合金电镀工艺及辅助配位剂的功能

为了提高焦磷酸铜．焦磷酸亚锡电镀低锡青铜合金工艺的性能,在其镀液中加入辅助配位剂柠檬酸盐。用电化学、X射线衍射、腐蚀膏试验等方法对镀液及镀层性能进行分析。结果表明：合金镀液具有良好的分散能力,可在较宽的电流密度范围内获得色泽一致、锡含量约为10％的低锡合金镀层;电镀初始过程可实现钢铁表面的电位活化,提高了镀层与铁基体的...     

内蒙古某铜锡硫化矿石选矿试验

内蒙古某铜锡多金属矿石铜品位为1.05%、锡品位为0.47%,主要杂质成分SiO2含量达62.31%。矿石中含铜矿物黄铜矿主要以不规则状存在于石英等脉石矿物中;锡石主要以自形-半自形粒状产出,粒间有黄铜矿等矿物交代。为给该矿石的开发利用提供依据,对其进行了选矿试验研究。结果表明：在磨矿细度为-0.074 mm占75%时,以Y150为铜粗选捕收剂、D300为铜扫选捕收剂、2号油为起泡剂,经1粗2扫浮选可获得铜品位为3.12%、回收率为97.06%的铜粗精矿;铜粗精矿经4次精选2次精扫选,获得的铜精矿铜品位为16.30%、回收率为92.14%;浮铜尾矿经摇床1次重选,可获得锡品位为8.67%、回收率为75.91%锡精矿。     

急冷Cu-Sn合金箔快速凝固连接工艺

应用微型电容储能焊机对厚度约40～60μm的急冷Cu-Sn合金箔带进行了快速凝固焊接,分析了焊接工艺参数对接头组织与性能的影响.结果表明,在储能电容不变的条件下,焊接电压及电极力对接头抗剪强度有着显著影响.随着锡含量增加,实现合金箔焊接所需要的电压减小,电极力增大.Cu-7%Sn,Cu-13.5%Sn合金箔比较适宜的焊接工艺参数分别为U=90 V,F=11 N及U=85 V,F=11.5 N.气孔是Cu-Sn合金箔主要焊接缺陷.随电压降低或电极力增加,接头冷却速率增大,气相形核率降低,气泡长大、合并和迁移在一定程度上受到抑制,气孔产生降低.

Abstract：

The rapid solidification welding of quenched Cu-Sn alloy foils with the thickness of 40 - 60μm was conducted by a micro-type capacitor discharge welding machine, and the effects of welding parameters on microstructural morphology and mechanical properties of joint were researched. The results indicate that welding voltage and electrode pressure have obvious influence on the shear strength of joint under fixed capacitance. With the increase of Sn content, the welding voltage needed decreases and electrode pressure rises accordingly. The favorable welding parameters are U = 90 V, F=11 N for Cu-7% Sn alloy and U = 85 V, F = 11.5 N for Cu-13.5% Sn alloy. The main welding defect is porosity. With decreasing of welding voltage and increasing of electrode pressure, the joint cooling rate increases and the pore nucleation rate decreases. Meanwhile, the growth, mergence and migration of porosities are suppressed, resulting in the decrease of porosity forming tendency.     

用电镀铜锡合金薄膜实现圆片级气密封装

开发了一种基于电镀铜锡合金薄膜的绝压气压传感器圆片级气密封装技术以降低常规的基于阳极键合气密封装技术的成本及难度。通过实验确定了铜锡合金薄膜的电镀参数,实现了结构参数为:Cr/Cu/Sn(30nm/4μm/4μm)的铜锡合金薄膜;通过共晶键合实验确定圆片级气密封装的参数,进行了基于铜锡材料的气密封装温度实验。通过比较各种不同温度下气密封装的结果,确定了完成圆片级气密封装的条件为:静态压力0.02 MPa,加热温度280°,保持20min。最后,对气密封装效果进行X-射线衍射谱(XRD)、X射线分析、剪切力以及氦气泄露分析等实验研究。XRD分析显示:在键合界面出现了Cu3Sn相,证明形成了很好的键合;X射线分析表明封装面无明显孔洞;剪切力分析给出平均键合强度为9.32 MPa,氦气泄露分析则显示泄露很小。得到的结果表明:基于电镀铜锡合金薄膜可以很好地实现绝压气压传感器的圆片级气密封装。     

Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates

In this study, the contact angles of four lead-free solders, namely, Sn-3.5Ag, Sn-3.5Ag-4.8Bi, Sn-3.8Ag-0.7Cu, and Sn-0.7Cu (wt.%), were measured on copper substrates at different temperatures. Measurements were performed using the sessile-drop method. Contact angles ranging from 30° to 40° after wetting under vacuum with no fluxes and between 10° and 30° with rosin mildly activated (RMA) and rosin activated (RA) fluxes were obtained. The Sn-3.5Ag-4.8Bi exhibited the lowest contact angles, indicating improved wettability with the addition of bismuth. For all soldering alloys, lower contact angles were observed using RMA flux. Intermetallics formed at the solder/Cu interface were identified as Cu₆Sn₅ adjacent to the solder and Cu₃Sn adjacent to the copper substrate. The Cu₃Sn intermetallic phase was generally not observed when RMA flux was used. The effect of temperature on contact angle was dependent on the type of flux used.     

Microstructural modifications and properties of Sn-Ag-Cu solder joints induced by alloying

Slow cooling (1–3°C/sec) of Sn-Ag-Cu and Sn-Ag-Cu-X (X = Fe, Co) solder-joint specimens, made by hand soldering, simulated reflow in a surface-mount assembly to achieve similar as-solidified joint microstructures for realistic shear-strength testing, using Sn-3.5Ag (wt.%) as a baseline. Consistent with predictions from a recent Sn-Ag-Cu ternary phase-diagram study, either Sn dendrites, Ag₃Sn primary phase, or Cu₆Sn₅ primary phase were formed during solidification of joint samples made from the selected near-eutectic Sn-Ag-Cu alloys. Minor substitution of Co for Cu in Sn-3.7Ag-0.9Cu refined the joint-matrix microstructure by an apparent catalysis effect on the Cu₆Sn₅ phase, whereas Fe substitution promoted extreme refinement of the Sn-dendritic phase. Ambient-temperature shear strength was reduced by Sn dendrites in the joint microstructure, especially coarse dendrites in solute poor Sn-Ag-Cu, e.g., Sn-3.0Ag-0.5Cu, while Sn-3.7Ag-0.9Cu with Co and Fe additions have increased shear strength. At elevated (150°C) temperature, no significant difference exists between the maximum shear-strength values of all of the alloys studied.     

电镀铜锡合金工艺研究进展

电镀铜锡合金具有装饰性好、可焊性优良、成本低、无毒、不使人体过敏等优点,而得到广泛的应用.介绍了电镀铜锡合金工艺的研究进展和应用、电镀铜锡合金镀液配方和工艺条件.     

急冷条件下Cu-Sn合金的快速枝晶生长

研究快速凝固Cu-xSn（x=7％，13．5％，质量分数）合金的相结构、组织形态和枝晶生长特性，将金属熔体热传导方程与Navier-Stokes方程相耦合，从理论上计算液态合金的冷却速率。结果表明：在急冷快速凝固条件下，Cu-7％Sn合金形成过饱和的单相α-Cu固溶体组织：Cu-13．5％Sn合金形成以亚稳的Cu137Sn相为主相、α-Cu为第二相的快速凝固组织：随着冷却速率的增大，溶质截留效应增强，合金相结构由复相向单相转变；沿垂直于辊面方向上合金的组织形态依次为近辊面细小等轴晶、中部柱状晶及自由面粗大等轴晶：增大冷却速率，晶体形态由柱状晶向等轴晶转变：在急冷快速凝固过程中，α-Cu和Cu137Sn相均以枝晶方式生长；随温度梯度的增大，晶体生长速率呈线性增大。     

机械合金化Cu-Sn二元形状记忆非晶态合金的XAFS研究

利用X射线吸收精细结构(XAFS)方法研究了机械合金化(Mechanical alloying，MA)方法制备的Cu-Sn二元金属合金在球磨过程中的结构变化。研究结果定量地表明，随着球磨时间的增加，Cu-Cu的键长逐渐变大，Cu第一近邻Cu-Cu配位数减小；Cu-Sn配位数逐渐增大，Cu与Sn的合金化程度和均匀性也随之增加。球磨4h后，Cu-Cu的配位数由Cu粉的12降低为7．4，键长由2．55A增加到2．63A；球磨12h后，Cu-Cu的配位数降低到6．4，Cu-Sn的配位数由O变到5．1，键长约为2．8A左右；球磨72h的结果与球磨12h的结果相近，说明Cu与Sn的互扩散过程基本达到平衡，形成组成近似于Cu6Sn5的非晶合金。