Metal chlorides-promoted ammonia absorption of deep eutectic solvent

Ammonia is considered as a promising hydrogen or energy carrier. Ammonia absorption or adsorption is an important aspect for both ammonia removal, storage and separation applications. To these ends, a wide range of solid and liquid sorbents have been investigated. Among these, the deep eutectic solvent (DES) is emerging as a promising class of ammonia absorbers. Herein, we report a novel type of DES, i.e., metal-containing DESs for ammonia absorption. Specifically, the NH₃ absorption capacity is enhanced by ca. 18.1–36.9% when a small amount of metal chlorides, such as MgCl₂, MnCl₂ etc., are added into a DES composed of resorcinol (Res) and ethylene glycol (EG). To our knowledge, the MgCl₂/Res/EG (0.1:1:2) DES outperforms most of the reported DESs. The excellent NH₃ absorption performances of metal–containing DESs have been attributed to the synergy of Lewis acid–base and hydrogen bonding interactions. Additionally, good reversibility and high NH₃/CO₂ selectivity are achieved over the MgCl₂/Res/EG (0.1:1:2) DES, which enables it to be a potential NH₃ absorber for further investigations.     

Adenine-functionalized conjugated polymer as an efficient photocatalyst for hydrogen evolution from water

Conjugated polymers have emerged as a promising class of organic photocatalysts for photocatalytic hydrogen evolution from water splitting due to their adjustable chemical structures and electronic properties. However, developing highly efficient organic polymer photocatalysts with high photocatalytic activity for hydrogen evolution remains a significant challenge. Herein, we present an efficient approach to enhance the photocatalytic performance of linear conjugated polymers by modifying the surface chemistry via introducing a hydrophilic adenine group into the side chain. The adenine unit with five nitrogen atoms could enhance the interaction between the surface of polymer photocatalyst and water molecules through the formation of hydrogen bonding, which improves the hydrophilicity and dispersity of the resulting polymer photocatalyst in the photocatalytic reaction solution. In addition, the strong electron-donating ability of adenine group with plentiful nitrogen atoms could promote the separation of light-induced electrons and holes. As a result, the adenine-functionalized conjugated polymer PF6A-DBTO2 shows a high photocatalytic activity with a hydrogen evolution rate (HER) of 25.21 mmol g^?1 h^?1 under UV-Vis light irradiation, which is much higher than that of its counterpart polymer PF6-DBTO2 without the adenine group (6.53 mmol g^?1 h^?1). More importantly, PF6A-DBTO2 without addition of a Pt co-catalyst also exhibits an impressive HER of 21.93 mmol g^?1 h^?1 under visible light (λ > 420 nm). This work highlights that it is an efficient strategy to improve the photocatalytic activity of conjugated polymer photocatalysts by the modification of surface chemistry.     

Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

Effect of pressure on elemental diffusion in sulfur–iron reaction

The reaction between sulfur and iron under high pressure and high temperature (HPHT) was studied. Sulfur–iron reaction models under different pressure levels were constructed. The morphology and formation mechanism of the reactants were comprehensively analyzed by scanning electron microscopy, energy-dispersive spectroscopy–line scanning, metallographic microscopy, and Raman spectroscopy. The results indicated that the pressure of the reaction could significantly affect the diffusion behavior of sulfur and iron during the reaction. With an increase in pressure, the diffusion of iron in the system was inhibited, whereas that of sulfur was enhanced. The pressure distribution gradient at the reaction interface was simulated by finite element calculation. The effect of pressure gradient as the driving force of the reaction on the diffusion behavior of elements was evaluated by thermodynamics combined with experimental results. Based on the experimental results, finite element simulation, and formula derivation, a new standpoint was proposed: the diffusion of substances in the HPHT system was affected by the pressure gradient at the interface.     

Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

Effects of the joining process on the microstructure and properties of liquid-phase-sintered SiC-SiC joints formed with Ti foil

The joining of liquid-phase sintered SiC (LPS-SiC) ceramics was conducted using spark plasma sintering (SPS), through solid state diffusion bonding, with Ti-metal foil as a joining interlayer. Samples were joined at 1400 °C, under applied pressures of either 10 or 30 MPa, and with different atmospheres (argon, Ar, vs. vacuum). It was demonstrated that the shear strength of the joints increased with an increase in the applied joining pressure. The joining atmosphere also affected on both the microstructure and shear strength of the SiC joints. The composition and microstructure of the interlayer were examined to understand the mechanism. As a result, a SiC-SiC joining with a good mechanical performance could be achieved under an Ar environment, which in turn could provide a cost-effective approach and greatly widen the applications of SiC ceramic components with complex shape.     

Joining zirconia with nickel-based superalloys for extreme applications by using a pressure-free high-temperature resistant adhesive

In order to meet the high demand for joining ceramic/superalloy composite structure in extreme environments, a novel high-temperature resistant adhesion technique was developed for joining ZrO₂ and Inconel 625 by applying an aluminum phosphate emulsion/zirconium sol based adhesive. With increasing temperature, a series of reactions occurred in adhesive, and its high-temperature bonding was attributed to the formation of a composite structure containing various ceramics and intermetallics. The adhesive after RT curing could find direct applications in extreme environments, and provide bonding strength no less than 2.5 MPa in the temperature range of RT-1100 °C. The bonding strength was higher than 4 MPa in the temperature range of 800–1000 °C, which was further attributed to the formation of an effective CTE-gradient relationship among ZrO₂, adhesive and Inconel 625, as well as the interfacial reactions between the two substrates. The work broadened the application of adhesion technique and brought new ideas for joining dissimilar engineering materials.     

基于改进相干增强扩散与纹理能量测度和高斯混合模型的导光板表面缺陷检测方法

针对液晶屏(LCD)导光板表面缺陷检测方法存在漏检率和误检率较高,对产品表面复杂渐变的纹理结构适应性差的问题,提出一种基于改进相干增强扩散(ICED)与纹理能量测度和高斯混合模型(TEM-GMM)的LCD导光板表面缺陷检测方法。首先,构建ICED模型,基于结构张量引入平均曲率流扩散(MCF)滤波,使得相干增强扩散(CED)模型对缺陷的细线状纹理有良好的边缘保持效果,并利用相干性得到缺陷纹理增强和背景纹理抑制的滤波后图像;然后,根据Laws纹理能量测度(TEM)提取图像纹理特征,将图像的背景纹理特征作为离线阶段高斯混合模型(GMM)的训练数据,使用期望最大化(EM)算法估计GMM参数;最后,计算待检测图像各像素的后验概率,并将其作为在线检测阶段缺陷像素的判断依据。实验结果表明,该检测方法在导光颗粒随机、规则两种分布的缺陷图像测试数据组上的漏检率和误检率分别为3.27%、4.32%和3.59%、4.87%。所提检测方法适用范围广,可有效检测出LCD导光板表面划痕、异物、脏污和压伤等类型的缺陷。     

利用固液扩散偶研究Mg-40Al与Mg-20Ce的界面反应

本文主要研究了Mg-40Al与Mg-20Ce固液界面在475°C, 500°C和525°C下保温5min至30min的界面反应和扩散层的生长动力学。结果发现，在扩散层中由于Al元素和Ce元素反应生成Al₁₁Ce₃, Al₃Ce and Al₂Ce金属化合物。金属化合物的体积分数随着扩散温度的升高而增加。扩散层的生长满足抛物线生长规律，扩散层的扩散激活能为42±3.7kJ/mol。实验研究的固液扩散为理解合金熔炼过程中金属化合物的形成提供了理论基础。     

Effect of clad ratio on interfacial microstructure and properties of cladding billets via direct-chill casting process

Numerical simulation and experiments were introduced to develop AA4045/AA3003 cladding billets with different clad-ratios. The temperature fields, microstructures and mechanical properties near interface were investigated in detail. The results show that cladding billets with different clad-ratios were fabricated successfully. Si and Mn elements diffused across the bonding interface and formed diffusion layer. With the increase of clad-layer thickness, the interfacial region transforms from semisolid–solid state to liquid–solid state and the diffusion layer increased from 10 to 25 μm. The hardness at interface is higher than that of AA3003 side but lower than that of the other side. The bonding strength increased with the clad-layer thickness, attributing to solution strengthening due to elements diffusion. The cladding billets were extruded into clad pipe by indirect extrusion process after homogenization. The clad pipe remained the interfacial characteristics of as-cast cladding billet and the heredity of clad-ratio during deformation was testified.