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1.
《Intermetallics》2015
The site preferences of co-alloying elements (Mo–Ta, Mo–Re, Mo–Cr) in Ni3Al are studied using first-principles calculations, and the effects of these alloying elements on the elastic properties of Ni3Al are evaluated by elastic property calculations. The results show that the Mo–Ta, Mo–Re and Mo–Cr atom pairs all prefer Al–Al sites and the spatial neighbor relation of substitution sites almost has no influence on the site preference results. Furthermore, the Young's modulus of Ni3Al increases much higher by substituting Al–Al sites with co-alloying atoms, among which Mo–Re has the best strengthening effect. The enhanced chemical bondings between alloying atoms and their neighbor host atoms are considered to be the main strengthening mechanism of the alloying elements in Ni3Al. 相似文献
2.
《Intermetallics》2015
Raney-type Ni precursor alloys containing 75 at.% Al and doped with 0, 0.75, 1.5 and 3.0 at.% Ti have been produced by a gas atomization process. The resulting powders have been classified by size fraction with subsequent investigation by powder XRD, SEM and EDX analysis. The undoped powders contain, as expected, the phases Ni2Al3, NiAl3 and an Al-eutectic. The Ti-doped powders contain an additional phase with the TiAl3 DO22 crystal structure. However, quantitative analysis of the XRD results indicate a far greater fraction of the TiAl3 phase is present than could be accounted for by a simple mass balance on Ti. This appears to be a (TixNi1−x)Al3 phase in which higher cooling rates favour small x (low Ti-site occupancy by Ti atoms). SEM and EDX analysis reveal that virtually all the available Ti is contained within the TiAl3 phase, with negligible Ti dissolved in either the Ni2Al3 or NiAl3 phases. 相似文献
3.
《Intermetallics》2015
Drop-tube processing was used to rapidly solidify droplets of Ni64.7Fe10Si25.3 and Ni59.7Fe15Si25.3 alloys. In the larger droplets, and therefore at low cooling rates, only two phases, γ-Ni31Si12 and β1-Ni3Si were observed. Conversely, in the smaller droplets, and therefore at higher cooling rates, the metastable phase Ni25Si9 was also observed. The critical cooling rate for the formation of Ni25Si9 was estimated as 5 × 103 K s−1. SEM and TEM analysis reveals three typical microstructures: (I) a regular structure, comprising single-phase γ-Ni31Si12 and a eutectic structure between γ-Ni31Si12 and β1-Ni3Si; (II) a refined lamellar structure with a lamellar spacing <50 nm comprising γ-Ni31Si12 and β1-Ni3Si; (III) an anomalous structure with a matrix of Ni25Si9 and only a very small proportion of a second, and as yet unidentified, phase. These results indicate that there is an extended stability field for Ni25Si9 in the Ni-rich part of the Ni–Fe–Si ternary system in comparison to the Ni–Si binary system. With an increase of cooling rate, an increasing fraction of small droplets experience high undercoolings and, therefore, can be undercooled into the Ni25Si9 stability field forming droplets consisting of only the anomalous structure (III). The Fe atoms are found to occupy different substitutional sites in different phase, i.e. Fe substitutes for Ni in the γ phase and Si in the L12 (β1) phase respectively. 相似文献
4.
5.
Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing 总被引:11,自引:0,他引:11
Al/Cu metal joints applied for the electrical connector was joined by the friction welding method to limit the formation of intermetallic compound under optimum friction welding condition. To guarantee the reliability of the Al/Cu joints in service requirement, the effects of the intermetallic compound layer on the electrical and mechanical properties have been investigated under various annealing conditions. Two kinds of intermetallic compounds layer were formed in the joints interface and identified by AlCu and Al2Cu. The growth kinetic of these intermetallics during the annealing can be followed by volume diffusion process. The activation energy of Al2Cu, AlCu and total intermetallic compound (AlCu + Al2Cu) represented 107.5, 98.42 and 110.22 kJ/mol, respectively. A thicker intermetallic compound layers could seriously degrade the electrical resistivity and tensile strength. The electrical resistivity with 21 μm thickness of intermetallic compound was 45 μΩ cm and increased to be 85 μΩ cm with 107 μm of intermetallic compound. Tensile strength remarkably decreased from 85 MPa to near zero at the annealing condition of 773 K and 129.6 ks and fracture occurred through the intermetallic compound layers. 相似文献
6.
Ni-base solid solution (γ) toughened Mo2Ni3Si metal silicide “in situ” composites were fabricated with different volume fraction of Mo2Ni3Si primary dendrite uniformly distributed in irregular Mo2Ni3Si/γ eutectic matrix. Results of room-temperature dry sliding wear tests indicated that the composite with a medium volume fraction of primary Mo2Ni3Si phase possessed the best wear resistance by optimum combination of the unique mechanical property of Laves phase Mo2Ni3Si and toughening effect of ductile γ phase. The primary wear mechanism is microplowing and soft-abrasion of the interdendritic Mo2Ni3Si/γ and subsequent brittle fracture of the hard Mo2Ni3Si primary dendrites. Ductile γ phase provided good toughening effect to Mo2Ni3Si Laves phase during dry sliding wear process. 相似文献
7.
A mechanism of formation of copper nanoparticles is proposed for alkaline etching of a sputtering-deposited Al-30 at.%Cu alloy, simulating the equilibrium θ phase of 2000 series aluminium alloys. Their formation involves enrichment of copper in the alloy beneath a thin alumina film, clustering of copper atoms, and occlusion of the clusters, due to growth of alumina around the clusters, to form nanoparticles. The proposed mechanism is supported by medium energy ion scattering, Rutherford backscattering spectroscopy, X-ray photoelectron spectroscopy, and transmission electron microscopy of the alloy following immersion in the sodium hydroxide solution, which disclose the enrichment of copper and the generation of the nanoparticles in the etching product of hydrated alumina. The generation of the nanoparticles is dependent upon the enrichment of copper in the alloy in a layer of a few nanometres thickness, with no requirement for bulk de-alloying of the alloy. 相似文献
8.
Effect of artificial aging on intergranular corrosion of extruded AlMgSi alloy with small Cu content
The effect of artificial aging parameters on the corrosion performance of air cooled AlMgSi(Cu) model alloy extrusions was investigated. Accelerated corrosion test revealed that the extrusions were highly susceptible to intergranular corrosion (IGC) in the naturally aged condition. However, IGC susceptibility was reduced, and finally eliminated, by artificial aging. Overaging introduced slight pitting susceptibility. EDS X-ray mapping in FE-TEM revealed Mg2Si and Q-phase (Al4Cu2Mg8Si7) grain boundary precipitates and a continuous Cu-enriched grain boundary film. IGC susceptibility was related to the Cu-enriched grain boundary film. Increased IGC resistance was caused by coarsening of the grain boundary film by aging. Pitting susceptibility by over aging evolved due to coarsening of the Q-phase particles in the grain bodies. 相似文献
9.
The electrochemical corrosion behaviour of a series of ZrNi5−xCox alloys with x=0-4 has been tested using potentiokinetic polarisation technique. The polarisation curves were measured in deaerated 0.5 M sulphate solutions with pH=0.2-7 and in strong alkaline solution of KOH (pH=15). It is shown that the presence of greater amounts of Co in the alloy (x?2) worsens the passivating properties of the alloy in acidified sulphate solutions. On the other hand, in strong alkaline solutions, both low- and high-cobalt alloys undergo stable passivation. The degree of Ni substitution by Co in the alloys does not generally affect the shape of cathodic polarisation curves. 相似文献
10.
Gallium activity in the B2 phase regions of both binary Co–Ga and ternary Co–Ga–Sb systems was measured by EMF method with stabilized zirconia solid electrolyte The temperature range was 1073–1273 K and Sb concentrations were 1, 2 and 3 mol fractions. Ga activity at 1173 and 1273 K increases sharply in Ga rich region and the addition of Sb to the CoGa phase increases Ga activity. Activity change corresponds to the lattice parameter change with Sb addition to the CoGa phase. 相似文献