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1.
2.
Studies were made on the thermally stimulated discharge currents (TSDCs) in pure (undoped) and Fe-doped polystyrene films as a function of polarizing field, polarizing temperature and dopant concentration. While undoped films exhibited a single peak, doped films showed two peaks one at low temperatures and another at high temperatures. The low temperature peak, which exhibits a shift towards lower temperatures with increasing dopant concentration, is attributed to the relaxation of the main chain, while the high temperature peak, which shows a tendency to shift towards higher temperatures with dopant concentration, is due to space charge polarization. The TSDCs were higher for low dopant concentrations than their undoped counterparts, while for high concentrations of the dopant, the TSDCs decreased. Formation of charge transfer complexes at low dopant concentrations and molecular aggregates at higher dopant concentrations are suggested as the possible reasons for this behaviour. 相似文献
3.
采用二次固相反应法制备Ba0.7Sr0.3TiO3介电陶瓷,研究了掺杂钴、钇离子对钛酸锶钡介电性能的影响。结果表明,陶瓷样品Y3+、Co3+的最佳掺杂浓度分别为0.04mol%和0.05mol%,最佳烧结温度为1340℃,样品的相对介电常数为4200,介电损耗(tanδ)为0.005。样品的结构为四方晶系,P4mm空间群。获得了高介电常数、低损耗的Ba0.7Sr0.3TiO3介电陶瓷。 相似文献
4.
5.
以氯乙酸和异辛醇为原料,用Mo 6掺杂制备SO2-4/TiO2/MoO3的固体超强酸催化剂催化合成氯乙酸异辛酯,研究了酯化反应的优化条件。当n(异辛醇):n(氯乙酸)为1.1∶1;催化剂用量为反应物料质量的2.0%时,反应时间90min,氯乙酸异辛酯的收率达到95.5%。 相似文献
6.
7.
Al掺杂对锰酸锂结构与性能的影响 总被引:2,自引:3,他引:2
采用固相法合成了Al掺杂的尖晶石LiAlxMn2-xO4(x=0~0.4).通过X射线衍射对LiAlxMn2-xO4的物相进行了研究,并探讨了Al掺杂对材料的充放电性能和电子电导率的影响.合成的LiAlxMn2-xO4均为纯尖晶石相.随着Al的掺入,LiAlxMn2-xO4的充放电循环性能得到改善,Al含量越高,循环过程中的容量衰减越小.电子电导率测试结果表明:掺杂Al后,降低了材料的电子电导率,这与Al的掺入降低了晶体中电子的离域作用有关. 相似文献
8.
P. Mitra Y. L. Tyan F. C. Case R. Starr M. B. Reine 《Journal of Electronic Materials》1996,25(8):1328-1335
Controlled and effective p-type doping is a key ingredient forin situ growth of high performance HgCdTe photodiode detectors. In this paper, we present a detailed study of p-type doping with
two arsenic precursors in metalorganic chemical vapor deposition (MOCVD) of HgCdTe. Doping results from a new precursortris-dimethylaminoarsenic (DMAAs), are reported and compared to those obtained from tertiarybutylarsine (TBAs). Excellent doping
control has been achieved using both precursors in the concentration range of 3 × 1015-5 × 1017 cm−3 which is sufficient for a wide variety of devices. Arsenic incorporation efficiency for the same growth temperature and partial
pressure is found to be higher with DMAAs than with TBAs. For doping levels up to 1 × 1017 cm−3, the alloy composition is not significantly affected by DMAAs. However, at higher doping levels, an increase in the x-value
is observed, possibly as a result of surface adduct formation of DMAAs dissociative products with dimethylcadmium. The activation
of the arsenic as acceptors is found to be in the 152–50% range for films grown with DMAAs following a stoichiometric anneal.
However, a site transfer anneal increases the acceptor activation to near 100%. Detailed temperature dependent Hall measurements
and modeling calculations show that two shallow acceptor levels are involved with ionization energies of 11.9 and 3.2 meV.
Overall, the data indicate that DMAAs results in more classically behaved acceptor doping. This is most likely because DMAAs
has a more favorable surface dissociation chemistry than TBAs. Long wavelength infrared photodiode arrays were fabricated
on P-on-n heterojunctions, grownin situ with iodine doping from ethyl iodide and arsenic from DMAAs on near lattice matched CdZnTe (100) substrates. At 77K, for
photodiodes with 10.1 and 11.1 (im cutoff wavelengths, the average (for 100 elements 60 × 60 μm2 in size) zero-bias resistance-area product, R0A are 434 and 130 ohm-cm2, respectively. Quantum efficiencies are ≥50% at 77K. These are the highest R0A data reported for MOCVDin situ grown photodiodes and are comparable to state-of-the-art LPE grown photodiodes processed and tested under identical conditions. 相似文献
9.
10.
Uniaxial tension tests and elastoplastic self-consistent (EPSC) simulations were conducted to study the effect of texture on the microyielding of highly textured AZ31 plate. The onset of microyielding is always associated with the activation of basal 〈a〉 slip irrespective of starting texture, while the value of the microyield stress does depend on the texture. The macroscopic yield stress is largely affected by the critical resolved shear stress of the deformation mode with the highest Schmid factor. An inverse relation is found between the microyield strength normalized by the macroscopic yield strength and the average Schmid factor of prism 〈a〉 slip, which is useful for a rough estimate of the microyield strength. 相似文献