Stress-deformable state of isotropic double curved shell with internal cracks and a circular hole

This work is devoted to the stress–strain state of isotropic double curved shell with defect system. The construction is weakened by two non-through thickness (internal) cracks of different length and by a circular hole located between cracks. In this study we use the line-spring model. Within the framework of this model cracks are modeled as mathematical cuts of shell’s middle surface. This leads to a two-dimensional problem. The problem is reduced to a system of eight boundary integral equations. To ensure the uniqueness of solution an additional equation is added. In the numerical solution of the problem special quadrature formulas for singular integrals of Cauchy type and the finite difference method are applied. The influence of defects on each other for double curved shell has been investigated. The given theoretical results can be used for the calculation of structural elements with holes, cracks on the strength and fracture toughness in various branches of engineering.     

Fatigue in bamboo

This paper describes the results of an experimental programme to determine the fatigue behaviour of bamboo. Bamboo is subjected to cyclic loading, both in the plant itself and subsequently when the material is used in load-bearing applications in the construction industry. However, there is currently no data in the literature describing fatigue in this material. We found that sections of bamboo culm loaded parallel to the culm axis did not undergo fatigue failure: samples either failed on the first loading cycle, or not at all. By contrast, fatigue was readily apparent in samples loaded in compression across the diameter of the culm. The number of cycles to failure increased as the cyclic load range decreased in a manner similar to that found in many engineering materials: fatigue occurred at applied loads as small as 40% of the ultimate strength. Two different species of bamboo were tested and found to have different ultimate strengths but similar high-cycle fatigue strengths. Finite element analysis was used to help understand the progression of fatigue damage and the effect of stress concentration features. Some tentative design rules are proposed to define stress levels for the safe use of bamboo, taking fatigue into account.     

双转向垂向控缝技术实验研究及现场应用

针对压裂过程中缝高较难控制的问题，研制开发出新型的油溶性垂向双转向剂，并开展了室内实验研究。首次验证了转向剂对裂缝延伸的控制机理，确定了转向剂的适用浓度及控缝能力。实验表明，转向剂可以增加隔层应力3～4MPa左右。在此基础上研究了控制裂缝高度施工方案的设计方法，并利用全三维软件结合垂向应力剖面对控缝技术进行了优化。现场推广应用30井次，取得了较好的控缝效果。     

掺气减蚀保护作用的新概念

利用针式掺气流速仪测量原型和模型掺气浓度场、流速场，气泡尺寸及其概率分布的研究成果表明，原型水流韦伯数高，形成微小气泡的能力比模型强，气泡上浮慢，接近底部的小尺寸气泡概率及掺气浓度比模型大。初步研究认为：0.2mm或0.5mm以下的微小气泡在掺气减蚀中起着主要作用，可能只要很小掺气浓度即可达到掺气减蚀的效果。因此以小尺寸气泡的掺气浓度，作为判断掺气减蚀保护作用的指标将更为准确。     

Application of annexation principle of thermodynamic property of In-Pb-Sb and In-Bi-Pb melts

Based on the principle of annexation and phase diagrams, the structural units of In-Pb-Sb and In-Bi-Pb melts were determined, and their calculating models of mass action concentrations were formulated. Calculated results agree well with practical values, which in turn show that the models deduced can reflect the structural realities of corresponding melts and the principle of annexation is applicable not only to some binary metallic melts, but also to ternary metallic melts.     

多输入单输出逆高斯分布流域汇流模型

本文将逆高斯分布应用于由水库和区间组成的复杂的流域汇流系统，并建立了多输入单输出逆高斯单位线模型。讨论了模型参数的估计方法，并对沾益流域的雨洪资料进行了实例分析。     

Effects of hot-carrier stress on high performance polycrystalline silicon thin film transistor with a single perpendicular grain boundary

This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower.     

Effects of Surface Concentration on Drying Behavior of Carbohydrate Solutions

As the surface properties of the drying materials are very important not only for the drying rate but also for the quality change during drying, the effects of surface concentration on the drying behavior of liquid foods (sugar solutions) were investigated by isothermal drying experiments and by numerical calculation experiments. The isothermal drying experiments with gelled sugar solution systems (sucrose and maltodextrin) were carried out at various relative humidity (RH) values (RH = 0 to 84%). Separate experiments were carried out for determination of the desorption isotherms.

The isothermal drying curves of sugar solutions at RH = 0 to 51% were very similar. Numerical simulations also showed that the drying curves of these sugars at the surface concentration = 0 and 0.1 are almost the same, although the concentration distributions are different.

When a small amount of gelatin was added to sugar solutions, the drying rate decreased remarkably as the gelatin might form a thin film (skin) near the surface, and consequently the retention of ethanol increased.     

一种基于判决反馈的OFDM系统载波频率跟踪算法

研究了多径信道下OFDM系统的一种新的载波频率跟踪算法，这种算法以判决反馈和接收端的时域信号重构为基础。推导了估计结果的精确解，比较了使用原估计结果和新的估计结果进行频偏补偿时系统跟踪性能的不同。通过对算法的仔细分析，发现除了通常的加性噪声外，信道估计误差、子载波数目和子载波的调制方式也影响频偏的估计结果和跟踪范围，而且子载波的数目和调制方式是决定性的因素。这种频率跟踪方法的优点是即使在很低的信噪比下仍然能获得高的跟踪精度，且实现相对简单。     

Understanding and Modeling the Effect of Surfactants in Enhanced Particle Removal from Surfaces in Aqueous Media

The removal of particulate contamination is a critical issue for many manufacturing processes. It is particularly critical to the electronics industry in which small pieces of microscopic debris remaining after chemical mechanical planarization (cmp) using submicron polishing particles can cause device failure. One way to enhance particle removal following the cmp process is to utilize surfactants. Recent research has shown ways to model the effect of surfactants on enhanced particle removal. However, previous research has not demonstrated the effect of ionic strength on enhanced particle removal associated with surfactant use. Past research has also not shown the combined effects of ionic strength and surfactant concentration on enhanced particle removal using surfactants. This article summarizes the parameters affecting particle removal, and it provides data and analysis on the effect of ionic strength as well as the combined effects of ionic strength and surfactant concentration on particle removal following cmp processing.