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排序方式: 共有2189条查询结果,搜索用时 5 毫秒
1.
The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder. 相似文献
2.
The In-Sn-Ni alloys of various compositions were prepared and annealed at 160°C and 240°C. No ternary compounds were found;
however, most of the binary compounds had extensive ternary solubility. There was a continuous solid solution between the
Ni3Sn phase and Ni3In phase. The Sn-In/Ni couples, made of Sn-In alloys with various compositions, were reacted at 160°C and 240°C and formed
only one compound for all the Sn-In alloys/Ni couples reacted up to 8 h. At 240°C, Ni28In72 phase formed in the couples made with pure indium, In-10at.%Sn and In-11at.%Sn alloys, while Ni3Sn4 phase formed in the couples made of alloys with compositions varied from pure Sn to In-12at.%Sn. At 160°C, except in the
In/Ni couple, Ni3Sn4 formed by interfacial reaction. 相似文献
3.
YOSHIHARU KARIYA TADATOMO SUGA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):413-419
This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8Tm). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys. 相似文献
4.
T. YAMAMOTO M. IWATA M. SAKANE Y. TSUKADA H. NISHIMURA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):376-386
This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb. 相似文献
5.
本文介绍印制板液态感光阻焊油墨的工艺流程、工艺控制,并对生产中较常出现的几种质量问题进行讨论,进而提出解决措施。 相似文献
6.
W. J. PLUMBRIDGE Y. KARIYA 《Fatigue & Fracture of Engineering Materials & Structures》2004,27(8):723-734
With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation. 相似文献
7.
面向表面组装工艺技术的PCB焊盘设计 总被引:1,自引:1,他引:0
尽管电子设计类软件已相当先进和方便,而且更新速度也很快,但是仍然无法满足各个层次的设计人员的需求,特别是适合各种元素封装形式的焊盘设计库并不能让设计和制造者满意,为了在此方面对PCB设计有所帮助,从印制电路板焊盘的设计方法入手,针对表面组装工艺技术特点,分析了PCB焊盘对PCA可靠性的影响因素,并根据相关的质量要求提出了较为简便的设计方案。 相似文献
8.
Resilient metal spring silicone-matrix conducting composites for separable interconnections in electronics were fabricated
by the impregnation of silicone into a preform comprising randomly oriented C-shaped Cu-Be springs and a small proportion
of Sn-Pb solder, which served to connect the springs at some of their intersections. Composites containing 6.1-9.8 vol.% total
filler exhibited volume electrical resistivity 0.5-1.0 mΩ.cm and contact resistivity (with copper) 11-17 mΩ.cm2. A compressive stress of about 30 kPa was needed for the low contact resistivity to be reached. The volume 17-26% and the
contact resistivity increased by 5% after heating in air at 130-150°C for seven days. Composites containing <9 vol.% total
filler showed no stress relaxation for seven days at 6.0% strain. 相似文献
9.
Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review 总被引:5,自引:0,他引:5
Judith Glazer 《Journal of Electronic Materials》1994,23(8):693-700
Lead-free solders, including Sn-58Bi, Sn-52In, and Sn-3.5Ag, are potential replacements for Sn-37Pb solder in low-cost electronic
assembly. This paper reviews the literature on the microstructure and mechanical properties of these alloys. Because of the
processing and testing conditions, many of the data are not predictive for electronic assembly applications. However, eutectic
Sn-Bi seems to have properties approaching those of eutectic Sn-Pb under most conditions, while eutectic Sn-In seems far inferior
in most respects. Eutectic Sn-Ag has many promising characteristics, but its relatively high melting temperature may preclude
its use for this type of application. 相似文献
10.
Sungho Jin 《Journal of Electronic Materials》2003,32(12):1366-1370
In packaging of microelectromechanical systems (MEMS), optical, and electronic devices, there is a need to directly bond a
wide variety of inorganic materials, such as oxides, nitrides, and semiconductors. Such applications involve hermetic-sealing
components, three-dimensional MEMS assembly components as well as active semiconductor or optical components, dielectric layers,
diffusion barriers, waveguides, and heat sinks. These materials are known to be very difficult to wet and bond with low melting-point
solders. New Sn-Ag- or Au-Sn-based universal solders doped with a small amount of rare-earth (RE) elements have been developed,
which now allow direct and powerful bonding onto the surfaces of various MEMS, optical, or electronic device materials. The
microstructure, interface properties, and mechanical behavior of the bonds as well as the potential packaging applications
of these new solder materials for MEMS and optical fiber devices are described. Various packaging-related structural, thermal,
or electrical issues in MEMS are also discussed. 相似文献