(1102)γ面蓝宝石生长的(1120)α面氮化镓研究

自发极化和压电极化是氮化镓制作光电器件没有解决的问题,对非极性GaN材料的研究解决了极化现象.采用低温AIN作为缓冲层,在(1102)γ面蓝宝石和(0001)с面蓝宝石上分别生长了(1120)非极性α面和(0001)极性с面GaN,用原子力显微镜和高分辨X射线衍射、光致发光谱比较了生长在γ面蓝宝石上的α面GaN和с面蓝宝石上的с面GaN,α面GaN材料质量和с面GaN相差较大,在α面GaN上发现了三角坑的表面形貌,这和传统的с面生长的极性GaN截然不同.对α面GaN的缺陷形成原因进行了讨论,并且确定了三角坑缺陷的晶向.     

fmax为30.8GHz的超薄Al2O3绝缘栅GaN MOS-HEMT器件

报道了一种利用原子层淀积(ALD)生长超薄(3.5nm)Al2O3为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT).新型AlGaN/GaN MOS-HEMT器件栅长1μm,栅宽120μm,栅压为+3.0V时最大饱和输出电流达到720mA/mm,最大跨导达到130mS/mm,开启电压保持在-5.0V,特征频率和最高振荡频率分别为10.1和30.8GHz.     

Surface morphology of [110] a-plane GaN growth by MOCVD on [1■02] r-plane sapphire

Nonpolar a-plane [110] GaN has been grown on r-plane [1■02] sapphire by MOCVD, and investigated by high resolution X-ray diffraction and atomic force microscopy. As opposed to the c-direction, this particular orientation is non-polar, and it avoids polarization charge, the associated screening charge and the consequent band bending. Both low-temperature GaN buffer and high-temperature AlN buffer are used for a-plane GaN growth on r-plane sapphire, and the triangular pits and pleat morphology come forth with different buffers, the possible reasons for which are discussed. The triangular and pleat direction are also investigated. A novel modulate buffer is used for a-plane GaN growth on r-plane sapphire, and with this technique, the crystal quality has been greatly improved.     

MOCVD法生长InAlN材料及其微结构特性研究

利用MOCVD法,在7.62cm蓝宝石衬底上生长了InAlN薄膜及InAlN/GaN异质结材料。利用XRD、AFM、Hall等测试方法对材料的组分、表面形貌、电学性质等进行了分析,InAlN薄膜中In含量随生长温度的升高明显降低,材料表面为三维岛状结构;与AlGaN/GaN异质结材料相比,InAlN/GaN异质结的高温电子输运特性更好,773K下InAlN/GaN异质结的迁移率为130cm2/(v·s),明显高于AlGaN/GaN异质结的67cm2/(v·s)。     

Si基GaN材料寄生导电层的研究

通过对Si基GaN材料的电学性能进行测量分析,确认了该材料体系所特有的寄生导电层现象。研究了寄生导电层对Si基GaN高电子迁移率晶体管(HEMT)微波功率性能和击穿性能的不良影响。通过材料生长工艺的优化,降低了寄生导电层的导电性,获得了击穿电压超过320V的Si基GaN HEMT功率电子器件。     

76.2mm Si基AlGaN/GaN HEMT

<正>南京电子器件研究所采用含有双AlGaN过渡层的材料结构在76.2 mm(3英寸)Si衬底上外延生长了厚度超过2μm的AlGaN/GaN HEMT材料(图1),材料表面光滑、无裂纹。通过外延材料结构和生长条     

fmax为30.8GHz的超薄Al2O3绝缘栅GaN MOS-HEMT器件

报道了一种利用原子层淀积(ALD)生长超薄(3.5nm)Al2O3为栅介质的高性能AlGaN/GaN金属氧化物半导体高电子迁移率晶体管(MOS-HEMT).新型AlGaN/GaN MOS-HEMT器件栅长1μm,栅宽120μm,栅压为 3.0V时最大饱和输出电流达到720mA/mm,最大跨导达到130mS/mm,开启电压保持在-5.0V,特征频率和最高振荡频率分别为10.1和30.8GHz.     

立式MOCVD反应室感应加热温度场的有限元分析*

The temperature field in the vertical metalorganic chemical vapor deposition （MOCVD） reactor chamber used for the growth of GaN materials is studied using the finite element analysis method （FEM）. The effects of the relative position between the coils and the middle section of the susceptor, the radius of the coil, and the height of the susceptor on heating condition are analyzed. All simulation results indicate that the highest heating efficiency can be obtained under the conditions that the coil distributes symmetrically in the middle section of the susceptor and the ratio of the height of the susceptor to that of the coil is three-quarters. Furthermore, the heating efficiency is inversely proportional to the radius of the coil.     

基于p-GaN结构的GaN HEMT功率电子器件和数字电路单片集成技术

基于含p-GaN帽层的Si基GaN材料,实现了增强型GaN功率电子器件与数字电路单片集成技术的开发。在同一片晶圆上实现了增强型高压GaN器件、DCFL结构反相器和17级环形振荡器。高压GaN功率电子器件阈值电压VTH达到1.2 V,击穿电压V_(BD)达到700 V,输出电流I_D达到8 A,导通电阻R_(ON)为300 mΩ。基于E/D集成技术的DCFL结构反相器低噪声和高噪声容限分别为0.63 V和0.95 V;所研制17级环形振荡器在输入6 V条件下振荡频率345 MHz,级延时为85 ps。     

用原子力显微镜和扫描电镜研究GaN外延层中的位错腐蚀坑

用原子力显微镜和扫描电镜相结合的方法表征了KOH腐蚀后的Si掺杂GaN外延层中的位错腐蚀坑.根据腐蚀坑的不同形状和在表面的特定位置可将其分成三种类型,它们的起源可由一个关于腐蚀机制的模型加以解释.纯螺位错易于沿着由它结束的表面阶梯被腐蚀,形成一个小的Ga极性面以阻止进一步的纵向腐蚀,因而其腐蚀坑是位于两个表面阶梯交结处的截底倒六棱椎.纯刃位错易于沿位错线被腐蚀,因而其腐蚀坑是沿着表面阶梯分布的尖底倒六棱椎.极性在GaN的腐蚀过程中起了重要作用.