双亲纳米SiO2颗粒的制备及提高渗吸采收率性能

以正辛基三乙氧基硅烷和3-巯基丙基三乙氧基硅烷为改性剂，以双氧水为氧化剂，在水基环境下对亲水纳米SiO2颗粒表面进行改性，得到具有磺酸基和辛基的双亲纳米SiO2颗粒，并通过红外和热重对其化学结构和热稳定性进行分析。将双亲纳米SiO2颗粒分散在地层水中制备纳米流体，并评价纳米流体的稳定性、界面性质和渗吸效率。利用核磁共振技术探究纳米流体渗吸过程中岩心孔隙内原油运移规律。结果表明，纳米流体储存30 d未出现分层现象，表现出良好的稳定性；经纳米流体处理的岩心亲水性增强。此外，双亲纳米SiO2颗粒将油水界面张力降低至1.7 mN/m；纳米流体渗吸采收率高达22.6%，渗吸初始阶段小孔隙中的原油被动用，而在渗吸后期阶段大孔隙中的原油才被动用。     

Effect of the particle size ratio on macro- and mesoscopic shear characteristics of the geogrid-reinforced rubber and sand mixture interface

As a new type of material for civil engineering projects, the rubber and sand mixture is widely used in roadbed fillers, offering environmental benefits over traditional tyre disposal methods. This study uses a large-scale direct shear apparatus to examine the interface shear properties of the geogrid-reinforced rubber and sand mixture, considering different particle size ratios (r), rubber contents, and normal stresses. Based on indoor tests, direct shear models of the mixture with different values of r are established in PFC^3D, revealing the meso-mechanical mechanism of the mixture in the direct shear process. The results show that when r is greater than 1, incorporating a certain amount of rubber particles can increase the shear strength of the mixture. The r values of 15.78, 7.63, and 3.98 correspond to an optimal rubber content of 30%, 10%, and 20%, respectively. When r is less than 1, mixing rubber particles can only reduce the shear strength of the mixture. When the rubber content is low, the smaller the value of r, the greater is the thickness of the shear band. Furthermore, the normal and tangential contact forces are greater. The fabric anisotropy evolution law of the mixture is consistent with the change in the contact force distribution.     

异种铁素体耐热钢接头界面组织及其影响

综述了铁素体与铁素体异种金属焊缝（dissimilar metal welds，DMWs）接头界面组织及其影响。结果表明，在焊后热处理或运行温度下的铁素体钢DMWs接头的不均匀界面组织中，通常会形成脱碳层和增碳层。在铁素体钢DMWs焊接接头界面组织影响因素中，焊缝金属的化学成分有重要影响；焊后热处理规范（温度和时间）、工作温度下运行时间的影响较为突出；焊接工艺参数的影响亦不可忽略。异种钢接头界面处近缝区裂纹的产生，以及接头的蠕变强度随Larson Miller 参数增大而下降等不利影响，均为异种钢界面碳迁移行为所导致。焊缝成分控制法是接头界面组织控制或改善的必要条件，而脱碳层部位转移法能有效防止裂纹发生，亦是接头安全运行的重要工艺措施之一。     

Multiple material domain‐based computational tools for ease assessment of modal parameter in photonic crystal fibers

We report here the development of two computational tools PCFPS (Photonic Crystal Fiber Parameter Study) and PCFPA (Photonic Crystal Fiber Parameter Analysis), equipped with graphical user interface (GUI) for modeling of photonic crystal fiber. The tools are based on different structural parameters, and they provide characteristic analysis of the modal parameters from the structural parameters. The main feature of PCFPS is that it enables the user to find out the values of each defining modal parameter that has an immense contribution towards the manufacture of photonic crystal fiber. Additionally, PCFPA allows the user to observe the variation in the modal parameters with respect to the changes in structural parameters (such as d, Λ, d/Λ, and λ/>Λ). Besides their ease of use, these two schemes have high computational precision and adaptability, giving a novel platform to optical engineers to modulate the microstructured fibers according to their requirement.     

基于MVC的校园闲置物品置换系统设计

随着经济水平的提高、移动支付的出现,国内大学快递行业飞速发展,学生网购量日益增多,二手闲置物品也在增加。目前咸鱼市场有较多不稳定因素,存在众多欺诈行为,校园内跳蚤市场缺乏有效管理。因此,笔者构建了校园闲置物品置换系统,其能够在校园范围内实现校园闲置物品的重新利用,发挥闲置物品的价值。     

单片机与接口技术项目化教学改革的实践与探索

As a comprehensive electrical and electronic course, Single Chip Microcomputer and Interface Technology is usually com- bined with automation technology, applied electronic technology, communication technology, etc., so that students can master the professional theory and application practice of single chip microcomputer. In the course teaching, teachers mainly focus on the knowledge points of single chip microcomputer system design, application programming, installation and debugging, select suitable interface circuit, application program, and organize and design the integrated circuit system and logic function of single chip micro- computer, so as to help students complete the resource allocation and function realization of different single chip microcomputer project design.     

CFD modeling of thermal contact resistance between solid contacting surfaces

Heat transfer has considerable applications in different industries such as designing of heat exchanger, nuclear reactor cooling, control system for spacecraft, and designing of microelectronics cooling. As the surfaces of two metals contact each other, this issue becomes so crucial. Thermal contact resistance (TCR) is one of the key physical parameters in heat transfer of mentioned surfaces. Measuring the experimental value of TCR in laboratory is highly expensive and difficult. As an alternative, numerical modeling methods could be engaged. In this study, inverse problem method solution is utilized as a proper method for estimation of TCR value. In this order, three different configurations (flat-flat, flat-cylinder, and cylinder-cylinder) were utilized in two steady and unsteady state conditions to predict the value of TCR. A comparison between the measured values and obtained values from the simulation show the errors for flat-flat, flat-cylinder, and cylinder-cylinder configuration after 10 min from starting the experiment are 4.6074%, 0.1662%, and 0.5622%, respectively. And in steady-state condition, the corresponding errors are 6.06e-3%, 1.506%, and 0.846%, respectively. In conclusion, the final results establish the fact that the inverse problem method solution can predict TCR values between contacting surfaces.