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Low dielectric constant materials/Cu interconnects integration technology provides the direction as well as the challenges in the fabrication of integrated circuits(IC) wafers during copper electrochemical-mechanical polishing(ECMP). These challenges arise primarily from the mechanical fragility of such dielectrics, in which the undesirable scratches are prone to produce. To mitigate this problem, a new model is proposed to predict the initiation of scratching based on the mechanical properties of passive layer and copper substrate. In order to deduce the ratio of the passive layer yield strength to the substrate yield strength and the layer thickness, the limit analysis solution of surface scratch under Berkovich indenter is used to analyze the nano-scratch experimental measurements. The modulus of the passive layer can be calculated by the nano-indentation test combined with the FEM simulation. It is found that the film modulus is about 30% of the substrate modulus. Various regimes of scratching are delineated by FEM modeling and the results are verified by experimental data.  相似文献
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The electromagnetic properties of a composite structure with metallic wires in a Lorentz medium were studied. The results show that the electromagnetic properties of the medium host influence the plasma resonance of metallic wires and the left-handed character of the composite. The plasma frequency of metallic wires reduces with the rise of permittivity or permeability of the medium host. Also, the negative permeability of the medium can destroy the wires' plasma resonance and prevent the realization of left-handed properties. The high loss of medium permittivity or permeability also inhibits the metallic plasma resonance. The negative influence of the media host on the left-handed properties of the composite structure can be effectively reduced by proper structure design, such as introducing a nonmagnetic medium in the host or using an anisotropic medium.  相似文献
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以十甲基环五硅氧烷(DMCPS)和三氟甲烷(CHF3)作为反应气体,采用电子回旋共振等离子体化学气相沉积(ECR-CVD)方法,制备了氟掺杂的SiCOH低介电常数薄膜。研究发现:随着CHF3/DMCPS流量比的增大,薄膜的沉积速率呈"N"型变化。根据薄膜结构和成分的傅立叶变换红外光谱仪(FTIR)、X射线光电子能谱(XPS)以及放电等离子体中基团分步的光强度标定的发射光谱(OES)分析可知:薄膜沉积速率的变化是由于CHF3进气量的增加导致薄膜生长从以沉积F-SiCOH薄膜为主过渡到以沉积氟化非晶碳(a-C:F:H)薄膜为主的结果。  相似文献
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