高导热电绝缘陶瓷的研究方向及应用前景

介绍了高导热电绝缘陶瓷的性能、设备，并从研究现状出发讨论了这类材料目前的一些研究方向，同时也对高导热电绝缘陶瓷的应用前景了一些讨论。  

自蔓延高温合成法制备MgSiN2粉体

以自蔓延高温合成法制备了高纯MgSiN2粉体。通过绝热燃烧温度的理论计算，提出3种可能的反应体系——Mg粉／Si粉、Mg2Si粉或者Mg粉／Si3N4粉。对3种体系的研究结果表明：Mg粉／Si粉体系很难得到纯相的MgSiN2粉体，Mg2Si粉或者Mg粉／Si3N4粉燃烧可得纯MgSiN2粉体，其氧含量最低可达到0．377％，并具有良好的抗水化性能。  

Net-shape forming of composite packages with high thermal conductivity

The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages. In recent years, several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys, such as SiCp/Al, SICp/Cu, diamond/Al and diamond/Cu. However, these materials with high content of reinforcements have not been widely used in packaging field because they are hard to be machined into complex-shaped parts due to their greater hardness and brittleness. So, it is necessary to explore a near-net shape forming technology for these composites. In this paper, a novel technology of powder injection molding-infiltration is introduced to realize the near-net shaped preparation of the composite packages with high thermal conductivity.