铝锂合金焊接技术的研究现状分析

铝锂合金作为轻质金属材料,具有优良的综合性能,因此应用前景十分广阔.从铝锂合金的焊接性出发,分别对铝锂合金弧焊,高能束焊,搅拌摩擦焊,扩散焊以及钎焊的研究现状进行了讨论.结果表明,采用各种焊接技术均可实现铝锂合金的焊接.分析了采用各种焊接技术焊接铝锂合金时的优势以及不足,并对各种焊接技术所获得接头的性能以及工艺改进措施进行了研究.针对目前各种焊接技术急需解决的问题以及铝锂合金焊接的发展方向,总结出了今后铝锂合金焊接研究的重点内容,并对铝锂合金焊接前景进行了分析与展望.     

TC4/Ta-W合金异种金属电子束焊接

对TC4/Ta-W合金电子束焊接进行了研究,采用偏向钽钨合金一侧进行焊接的方式进行分析.电子束焊接接头成形良好,在一定偏束量时焊缝中Ta和W元素含量较高,焊缝组织为以β钛为基的固溶体组织,无脆性化合物生成,存在富钽区和贫钽区.焊缝中元素分布不均匀,在偏束量为0.6 mm时焊缝中含钛相对较多,约为60%,而钽钨母材熔化相...     

电子束表面合金化研究进展

阐述了电子束表面合金化的基本原理及国内外电子束合金化设备的应用和发展.介绍了强流脉冲电子束表面合金化做为一种新型表面合金化方法在研究领域的应用,并综述了近年来电子束表面合金化研究的发展动态,简述了国内外相关领域的主要研究成果及取得的进展.对电子束表面合金化技术做出了展望,指出合金层的定量控制,电子束与表层金属间的热力耦...     

Analysis of metal transfer during electron beam welding with filler wire

The metal transfer mode of electron beam welding （EBW） with filler wire was studied experimentally. The spatial position between the electron beam and the filler wire was defined. Basing on the charge coupled device （CCD） visual sensing system, the metal transfer mode of filler wire was investigated. The results showed that there were five transfer modes during EBW process due to different wire feed rates and spatial positions between beam and filler wire, such as short-circuiting mode, molten metal bridge mode, small droplet mode, big droplet mode and mixed mode. By comparing the weld appearance of different transfer modes, the molten metal bridge transfer was proved to be the best transfer mode.     

304不锈钢与QCr0.8铬青铜填加铜焊丝的电子束焊接

采用填铜焊丝对304不锈钢与QCr0.8铬青铜进行电子束焊接。采用正交试验法研究不同工艺参数对焊接接头抗拉强度的影响,并对焊接工艺参数进行优化。优化工艺参数如下：束流30 mA,焊接速度100 mm/min,送丝速度1 m/min,束偏移量-0.3 mm。对优化后接头组织的分析结果表明,焊缝主要由树枝状α相与少量球形ε相组成;仅在焊缝区的上部出现铜的混合不均匀;而在铜侧熔合线附近存在一个铜的熔化但未混合区,该区域晶粒长大严重,是接头的最薄弱区。显微硬度测试结果显示,焊缝硬度随固溶体中铜含量的增加而减小。接头的最高抗拉强度为276 MPa。     

Microstructure and mechanical properties of butt joints of QCr0.8／1Cr21NiSTi equal-thickness dissimilar materials by electron beam welding

Butt joints of QCrO. 8/1Cr2lNiSTi equal-thickness dissimilar materials were obtained by electron beam welding with fixed accelerating voltage 60 kV and focus current 1.99 A, changed electron beam current and welding velocity. Microstructure and composition of the EBW joint were investigated by means of optical micrography and EDX analysis, mechanical properties of the joint were also tested. The results show that joint‘ s macrostructure was divided into three zones : top weld zone near QCrO. 8 and bottom weld zone consisting of Cu (ss. Fe ) with a certain amount of dispersedly distributed (α ε) mixed microstructure , middle weld zone consisting of (α ε ) microstracture with a small amount of Cu (ss. Fe )particles. Morphological inhomogeneous macrostructure and uneven chemical compostion of QCrO. 8/1Cr21NiSTi joint by EBW are the most important factor to result in decreasing joining strength.     

QCr0.8/TC4薄板电子束焊接头组织及断裂路径

对QCr0.8/TC4异种材料薄板进行了电子束对接焊接试验.采用光学金相、扫描电镜、能谱分析及X射线衍射相分析等方法,对接头组织结构及相组成进行了分析.并对接头进行了性能测试及断口形貌观察,分析了断裂性质,探讨了断裂路径.结果表明,焊缝由大量的γ-CuTi相、金属间化合物CuTi2,CuTi3及少量的铜基固溶体组成,且靠近铜合金侧存在一层20 μm左右的反应层,推测其可能为Ti2Cu,CuTi,Cu4Ti3,Cu2Ti,Cu3Ti等多种金属间化合物混合层;QCr0.8/TC4的电子束对中焊接性较差,接头断裂发生在焊缝中心的粗晶区,呈明显的解理断裂特征,接头抗拉强度很低,仅为82.1 MPa.     

电弧作用下熔透型TIG熔池液面行为的数值模拟

在正面熔化半径RZ和板厚h一定的条件下,基于对有电弧作用的熔透型TIG焊接熔池三维液面行为的分析,获得了不同背面熔化半径RB的熔池三维形状模型,利用有限元分析软件surface evolver进行数值模拟,研究了电弧对熔透型TIG焊接熔池液面的影响.结果表明,电弧的作用与否对熔池下液面的大小和形状无显著的影响;在背面熔化尺寸较小时(RB≤2.5 mm附近),电弧对上液面特征量有较大作用;电弧的作用从整体上是使熔池上液面压低.在从脉冲基值过渡到脉冲峰值期间,电弧电压(或弧光光强)增加的部分是由电流增加和熔池上液面被压低两部分引起的.     

Ti3Al金属间化合物电子束深熔焊接过程数值模拟

基于有限元法，采用改进的双椭球热源模型，对电子束深熔焊接Ti3Al过程进行了移动热源条件下准稳态三维温度场的数值模拟。该模型复合了熔深与电子束参数及材料性质的关系，考虑了对流和辐射散热、相变潜热、材料热物理性能参量随温度的变化以及液态金属的对流传热。通过比较熔深、熔宽的计算值和实际测量值，验证了该模型在电子束焊接温度场模拟中的适用性。     

Effect of Al 2 O3 film on weld appearance of stationary electron beam welded aluminum

Aluminum specimens with and without chemically cleaning were welded by electron beam to investigate the effect of、Al ₂ O₃ film on weld appearance. The removal mechanism of Al ₂ O₃ film during vacuum electron beam welding of aluminum was analyzed and the effect of Al ₂ O₃ film on molten pool flow behavior and weld appearance was investigated. The results showed that the weld width of the specimen was enlarged by chemically cleaning. The solid Al ₂ O₃ film transformed into gaseous Al ₂ O via the reaction with liquid aluminum at the temperature higher than 1 350 K was the main reason for the removal of the film. The weld width was narrowed down by the oxide film due to the inhibition of outward flow driven by the surface tension gradient and the drag force between the Al ₂ O₃ film and liquid Al. The weld penetration was reduced in the initial stage and then enhanced in the metastable stage.