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在不同的挤压温度和挤压比下,将AZ31B镁合金机加屑冷压后热挤压固结而再生镁合金。与铸锭挤压合金对比,从动态再结晶组织与屑间结合情况两个主要方面分析了加工工艺对再生合金力学性能的影响。随着挤压温度升高,再生合金的极限抗拉强度和延伸率先增加而后降低。随挤压温度升高,晶粒长大与屑间结合增强的相反作用共同导致了再生合金力学性能的变化。当挤压比从4:1 增加到 44:1,晶粒细化且屑间结合增强,使再生合金的抗拉强度增加。而当挤压比高于25:1时,由于显著的形变强化作用导致延伸率下降。 相似文献
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Microstructure and mechanical properties of dissimilar joint between aluminum and aluminum-coated steel by cold metal transfer process 下载免费PDF全文
Two dissimilar materials, aluminum alloy and aluminum-coated steel, were joined by cold metal transfer process using AlSi5 filler wire. To this end, the steel was coated with Al-Si. The steel did not melt and aluminum was melt to form the joint during the process, it was actually cold metal transfer welding-brazing. The macrostructure, microstructure, alloy element distribution, and inter-metallic compounds were analyzed by optical microscopy, scanning electron microscopy, and energy dispersive spectroscopy. It was found that the Al-Si coating dissolved into the weld metal. The pre-existing thin Fe-Al-Si ternary inter-metallic compounds in the interface between the Al-Si coating layer and base metal steel also partially dissolved into the weld zone, tending to reduce the thickness of inter-metallic compounds. Approximate 3 μm thick undissolved inter-metallic compound was found at the interface after welding which could guarantee sound bonding strength in dissimilar materials joining. The sample was fractured at the fusion zone near the aluminum side in the tensile test. The ultimate tensile strength was about 156 MPa, and the fracture mode is ductile failure in nature according to its morphology. 相似文献
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在不同的挤压温度和挤压比下,将AZ31B镁合金机加屑冷压后热挤压固结而再生镁合金。与铸锭挤压合金对比,从动态再结晶组织与屑间结合情况两个主要方面分析了加工工艺对再生合金力学性能的影响。随着挤压温度升高,再生合金的极限抗拉强度和延伸率先增加而后降低。随挤压温度升高,晶粒长大与屑间结合增强的相反作用共同导致了再生合金力学性能的变化。当挤压比从4:1增加到44:1,晶粒细化且屑间结合增强,使再生合金的抗拉强度增加。而当挤压比大于25:1时,由于显著的形变强化作用导致延伸率下降。 相似文献
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采用新型陶瓷先驱体聚合物-含乙烯基聚硅氮烷(PSZ)连接无压烧结SiC陶瓷.研究了PSZ的裂解过程以及连接温度、浸渍/裂解增强处理、惰性填料对连接强度的影响,并对连接区域微观结构进行了分析.结果表明,在1200~1400℃温度范围内,PSZ的裂解产物发生了由非晶态向晶态的转变.随着连接温度的升高,连接强度先升高后降低;浸渍/裂解增强处理可较大幅度提高接头强度;另外加入适量的纳米SiC填料可有效提高连接强度.当连接温度为1300℃,纳米SiC填料(质量分数)为5%时,经三次增强处理的连接件接头剪切强度达33.5 MPa.微观结构分析显示,连接层厚度约为3~4 μm,连接层与母材之间界面接合良好. 相似文献