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排序方式: 共有119条查询结果,搜索用时 31 毫秒
1.
Boring and Trepanning Association (BTA) deep hole drilling is used for producing holes with high aspect ratios. In this process, chatter vibration sometimes occurs, and a rifling mark is formed on the bore surface. The rifling mark generating phenomenon is considered to be a result of self-excited vibration caused by time delay. An analytical model is proposed considering the supporting condition of the boring bar in detail. In a real machine for BTA drilling, the boring bar is supported at the oil pressure head and the supporting pad, as well as at the base. The stability of the self-excited vibration is analyzed numerically, and the result is compared with the experiment. The theoretical and experimental results agree well with each other. Furthermore, the effect of an additional guide pad proposed by the authors as a countermeasure is evaluated theoretically and experimentally. 相似文献
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目前,常规紫铜无铬转化液主要由苯骈三氮唑(BTA)、配位剂和表面活性剂组成,所得转化膜的耐蚀性较差。在常规无铬转化液中加入钼酸钠和硝酸镧,并确定了一种环保型紫铜表面无铬成膜工艺:12 g/LBTA,8 g/L Na2MoO4,4 g/L La(NO3)3.6H2O,10 g/L C6H8O7,4 g/L C7H6O6S.2H2O,温度50℃,时间5 min。通过中性盐雾试验测试了所得转化膜的耐蚀性;采用极化曲线和交流阻抗谱分析了转化膜在1 mol/L HCl中的电化学行为,同时用场发射扫描电镜(FESEM)观察了转化膜的表面形貌。结果表明:本工艺无铬、环保,可在紫铜表面形成完整、致密的转化膜,缓蚀率达98.8%,耐蚀性优于铬酸盐钝化膜和常规无铬钝化膜。 相似文献
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The cleaning of copper interconnects after chemical mechanical planarization (CMP) process is a critical step in integrated circuits (ICs) fabrication. Benzotriazole (BTA), which is used as corrosion inhibitor in the copper CMP slurry, is the primary source for the formation of organic contaminants. The presence of BTA can degrade the electrical properties and reliability of ICs which needs to be removed by using an effective cleaning solution. In this paper, an alkaline cleaning solution was proposed. The alkaline cleaning solution studied in this work consists of a chelating agent and a nonionic surfactant. The removal of BTA was characterized by contact angle measurements and potentiodynamic polarization studies. The cleaning properties of the proposed cleaning solution on a 300 mm copper patterned wafer were also quantified, total defect counts after cleaning was studied, scanning electron microscopy (SEM) review was used to identify types of BTA to confirm the ability of cleaning solution for BTA removal. All the results reveal that the chelating agent can effectively remove the BTA residual, nonionic surfactant can further improve the performance. 相似文献
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苯并三氮唑与4—羟基苯并三氮唑在氯化钠溶液中对铜的缓蚀作用 总被引:8,自引:1,他引:7
用表面增强拉曼光谱技术(SERS)对在3%NaCl溶液中苯并三氮唑(BTA)及其衍生物4-羟基苯并三氮唑(4CBTA)对铜的缓蚀作用机理进行了研究,发现4CBTA对铜的缓蚀作用机理与BTA相似,在较正电位下两者都是通过三唑环与铜形成配合物覆盖在铜表面随着电位负移,铜电极表面吸附的分子形式的BTA或4CBAT数量增多;4CBT中的-COOH基团只是起到空间位阻的作用,没有参与电极表面的吸附,两者复配使用时以BTA吸附为主,其缓蚀机理没有发生改变。也没有产生协同效应。 相似文献
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针对BTA深孔加工中孔中心线容易产生偏斜的问题,用稳健优化设计理论研究了当加工条件参数变化时被加工孔直线度误差的变化情况.将稳健设计理论用于讨论BTA深孔加工时控制因素的选择,得到了控制因素的优化设计结果.通过试验证明使用稳健设计法对控制因素的分析和预测是正确的.该研究结果可为BTA深孔加工控制因素的分析和选择提供参考. 相似文献
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