不同晶相结构ZrO2负载铜基催化剂用于二乙醇胺脱氢反应

通过制备不同晶相结构〔单斜相(m-ZrO_2)、四方相(t-ZrO_2)和无定型(a-ZrO_2)〕ZrO_2载体,再通过沉积沉淀法制得Cu/m-ZrO_2、Cu/t-ZrO_2和Cu/a-ZrO_2催化剂,分别用于催化二乙醇胺脱氢合成亚氨基二乙酸反应。采用XRD、氮气物理吸附脱附、XPS、H_2-TPR、CO_2-TPD对催化剂的结构进行了表征。结果表明,Cu/m-ZrO_2催化剂界面更加有利于Cu~+/Cu~0稳定存在,具有更多的碱性位点,且抗氧化性较好。在二乙醇胺脱氢反应中,Cu/m-ZrO_2催化剂性能最好,反应时间为2.5 h,亚氨基二乙酸收率为97.64%。     

Effects of interphase on tensile strength of polymer/CNT nanocomposites by Kelly–Tyson theory

The micromechanics models for composites usually underpredict the tensile strength of polymer nanocomposites. This paper establishes a simple model based on Kelly–Tyson theory for tensile strength of polymer/CNT nanocomposites assuming the effect of interphase between polymer and CNT. In addition, Pukanszky model is joined with the suggested model to calculate the interfacial shear strength (τ), interphase strength (σ_i) and critical length of CNT (L_c).The proposed approach is applied to calculate τ, σ_i and L_c for various samples from recent literature. It is revealed that the experimental data are well fitted to calculations by new model which confirm the important effect of interphase on the properties of nanocomposites. Moreover, the derived equations demonstrate that dissimilar correlations are found between τ and B (from Pukanszky model) as well as L_c and B. It is shown that a large B value obtained by strong interfacial adhesion between polymer and CNT is adequate to reduce L_c in polymer/CNT nanocomposites.     

WC/Cu复合材料制备及其高温性能

用机械合金化法结合冷变形，制备了WC／Cu复合材料，研究了冷变形后复合材料的组织特征和高温退火时韵性能变化。结果表明：烧结后的材料经冷变形，组织呈显著纤维状，WC颗粒弥散分布，密度明显提高，达到理论密度的99．2％；复合材料经600～900℃高温退火，强度和硬度略有下降，塑性则有大幅提高；900℃退火时未发生明显的再结晶，界面结合良好；所制备的WC／Cu复合材料有优良的综合性能。     

The microstructure of Cu films deposited by the self-ion assisted technique

The microstructures of Cu films deposited by the self-ion assisted, partially ionized beam (PIB) deposition technique under two different accelerating potentials, 0 KeV and 6 KeV, are compared. The 6 KeV film shows a bimodal (111) fiber and (100) fiber texture with an abundance of twin boundaries and a relatively large average grain size with a typical lognormal distribution. The 0 KeV film consists of small, mostly (111) oriented grains with islands of abnormally large (100) grains. The controlling factors for the abnormal growth of the (100) grains are discussed in relation to the observed microstructures, showing that all factors necessary for abnormal (100) growth are present in the films.     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Catalytic behavior of YBa2Cu3O7-x in the partial oxidation of methanol to formaldehyde

The partial oxidation of methanol to formaldehyde was studied over YBa₂Cu₃O_7-x catalyst in a flow reactor. The structural change of YBa₂Cu₃O_7-x before and after the reaction was measured by means of XRD and iodometric titration method. The catalytic characteristics of YBa₂Cu₃O_7-x for the partial oxidation of methanol to formaldehyde was due to copper ions. It was found that Cu⁺² was responsible for the higher selectivity for formaldehyde.     

Preparation of ultra-fine copper powder and its lead-free conductive thick film

In this paper, non-agglomerated monodispersed ultra-fine copper metallic powders have been synthesized with chemical reduction method. Fine lead-free glass powders were also prepared by solid synthesis process. Thick film paste prepared by above-mentioned copper metallic powders and lead-free glass powders was applied as conductive paste of MLCC. Mixture of glass and zinc oxide give the thick film a high adhesion strength which is attributed to the rough interface from interfacial reaction between glass and chip, and a good densification. Diffusion of metal between copper thick film and nickel thick film is clear. Ni-Cu solid solution appears under high temperature firing.     

Copper(II) removal from aqueous solutions by fly ash

The removal of Cu(II) by adsorption on fly ash has been found to be concentration, pH and temperature dependent. The kinetics of adsorption indicates the process to be diffusion controlled. The Langmuir constants have been calculated at different temperatures, and the adsorption has been found to be endothermic (ΔH = 15.652 kcal mol^?1). The maximum removal is observed at pH 8.0, and variation in adsorption with pH has been explained on the basis of surface ionisation and complexation.     

A kinetic model for the acid-oxygen pressure leaching of Ni–Cu matte

A semi-empirical mathematical model for the acid-oxygen pressure leaching of Ni–Cu matte is presented, based on data from batch leaching experiments. The primary controlling factor in the leaching process is found to be galvanic inhibition of the more highly oxidized copper and nickel sulfide species by less oxidized species, particularly Ni alloy and Ni₃S₂. The leaching rate of many species is greatly reduced by the presence of one or both of these phases, and others will not commence leaching until neither is present. The mathematical model is based on first-order chemical reaction controlled rate expressions, as the reactions occurring are electrochemical in nature. Mass transfer effects are included only empirically. Some possibly diffusion-related phenomena are noted, although the model is not extended to incorporate these effects on a fundamental level. The model is verified and extended by the inclusion of several different factors that were tested experimentally. The effects of variations in O₂ flow rate and partial pressure, initial particle size, reaction pulp density and initial acid concentration were all studied, and included in the model. Variations in O₂ flow rate and partial pressure are found to affect the reaction rates via the dissolved oxygen concentration in the solution phase.     

氮气氛下LTCC基板Cu共烧金属化研究

从PMMA型LTCC素坯膜的制备和PMMA的排胶机理两方面，研究了LTCC基板Cu共烧金属化。结果表明，采用PMMA作为粘结剂的流延浆料具有剪切变稀行为，所得的流延坯膜微观组织均匀，叠压后坯体内部无分层现象。热失重、差热和傅立叶红外光谱联用分析结果表明高纯N2气氛中PMMA以解聚机理热解，热解后释放的主要产物为丙烯酸甲酯。在高纯N2气氛中LTCC与Cu共烧后Cu金属化膜平整、致密，连通良好。经测试，基板表面Cu导体方阻小于5mΩ/□。