Polyimide foams from powder: Experimental analysis of competitive diffusion phenomena

In the present study, various diffusive processes have been investigated during foaming of powdered precursors of polyimide. A detailed analysis of the powdered precursor's characteristics allows for an enhanced morphological understanding of the resulting microstructures and foam unit cell. Parameters that are central to the foaming process such as particle morphology, volatile concentration and sorption-desorption processes are evaluated. Isothermal and non-isothermal desorption experiments have been carried out by thermogravimetric analysis (TGA), and specific diffusive processes have been correlated to thermodynamic and kinetic transitions by means of modulated differential scanning calorimetry (MDSC) of the corresponding materials. It was found that two primary fluxes of volatiles, one out of the external surface of the particles (responsible for volatile desorption) and the other into the growing bubble (responsible for vapor supersaturation inside the bubble) compete against each other creating a competitive scenario that becomes the controlling factor for potential inflation within the precursor particles.     

Preparation of polyimide-epoxy composites

The formation of a three dimensional network of crosslinked epoxy leads all unmodified epoxies to have inherent brittleness and relatively low degradation temperatures. Polyimides, on the other hand, are widely used for applications that require high degrees of flexibility and thermal resistance. Here, we have focused on the preparation of epoxy systems cured with polyamic acids instead of traditional amino-group-containing hardening agents. The cure behavior and potential reaction mechanisms of EPON 828 resin and polyamic acid mixtures were evaluated by DSC and TGA. Thermal analysis showed a complex reaction sequence taking place in the mixture and also determined the extent of reaction of the polyamic acid with itself and the competitive reaction of the polyamic acid with the epoxy. The compositions of the mixtures were varied to see the dependence of the cure behavior on component concentrations. Solutions of the two components did not phase separate and also phase separation was not apparent either optically or microscopically in the cured samples. This phase behavior was attributed to a unique in situ reaction. A novel solvent system for the polyamic acid precursor was also used.     

A comparative study on the effect of VUV radiation in plasma SiOx-coated polyimide and polypropylene films

Wettability of polyimide (PI) and polypropylene (PP) films have been improved using SiO_x-like thin layers deposited from a mixture of hexamethyldisiloxane (HMDSO) and oxygen in a microwave distributed electron cyclotron resonance plasma reactor. The films wettability evolution behaviors were evaluated through the results of contact angle measurements, atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The plasma depositions of SiO_x thin layers in presence of VUV radiation induce a contact angle decrease to about 7° and 35° for PI and PP films, respectively. XPS data showed that such difference in wettability is attributed to the increase of hydrophilic group's proportion at the surface of coated PI films due to VUV irradiation. AFM images showed that the PI surface topography remains relatively smooth when coated in presence of VUV radiation. However, in the case of PP films, AFM images revealed the growth of irregular structure due to a substrate etching effect supported by VUV radiation. For polymers coated without VUV irradiation, the deconvolution of the C1s peaks showed a significant decrease of CO bonds for both PI and PP substrates.     

A comparative study of thin film insulation techniques for gold electrodes

The increasing use of microelectrodes in small sample volumes and biological environments require the use of thin film insulators. The insulating ability of the thin film insulators electrophoretic paint, polyimide, allylphenol phenol copolymer and an epoxy dip coat have been assessed using gold wires coated in the relevant film. Insulation was assessed by recording the current from the wires in a solution of known redox couple. The effect of prolonged storage in aqueous solutions was also investigated. The most successful insulating approach, with regards to insulative ability, prolonged use in aqueous environments and speed of application, was the combination of cathodic electrophoretic paint followed by polyimide.     

Intrinsic, thermal and hygroscopic residual stresses in thin gas-barrier films on polymer substrates

Intrinsic, thermal, and hygroscopic contributions to the in-plane residual stress in silicon nitride films on polyimide substrates are identified, based on iso-hygric thermal ramps and isothermal relative humidity jumps, combined with non-linear elastic modeling of the resulting dynamics of film curvature. This approach enables the thermal and hygroscopic properties of thin nitride films to be determined and provides useful input for material and process control.     

Polyimide/montmorillonite nanocomposites based on thermally stable, rigid-rod aromatic amine modifiers

The preparation and processing of most of polymer/clay nanocomposites need high temperature. This limited the application of commonly used organic modifiers of long carbon-chain alkyl ammonium salts because of their low thermal stability. In this study, we synthesized two novel thermally stable, rigid-rod aromatic amines. Montmorillonite (MMT) treated by these amines exhibited larger layer-to-layer spacing, higher thermal stability than that treated by commonly used 1-hexadecylamine and also high ion-exchange ratio (>95%). They were applied to prepare nanocomposites with polyimide (PI) by in situ polymerization. XRD, TEM were used to obtain the information on morphological structure of PI/MMT nanocomposites. DMA, TGA, DSC, universal tester were applied to characterize the mechanical and thermal properties of the nanocomposites. When the MMT content was below 3 wt%, the PI/MMT nanocomposites were strengthened and toughened at the same time. The introduction of a small amount of MMT also led to improvement in thermal stability, slight increase in glass transition temperature, marked decrease in coefficient of thermal expansion and decrease in solvent uptake. MMT treated by these aromatic amines exhibited better dispersibility and (probably) interfacial interaction with PI matrix than that treated by 1-hexadecylamine. The nanocomposites based on these MMT resultantly exhibited better mechanical, thermal and solvent resistance properties than those based on 1-hexadecylamine treated MMT.     

Studies on syntheses and properties of novel CeO2/polyimide nanocomposite films from Ce(Phen)3 complex

A series of cerium dioxide (CeO₂)/polyimide (PI) nanocomposites were successfully prepared from Ce(Phen)₃ and polyamic acid (PAA) via the solution direct-dispersing method, followed by a step thermal imidization process. TGA and XPS studies showed that the cerium complex decomposed to form CeO₂ during the thermal imidization process at 300 °C. SEM observation showed that the formed CeO₂ as nanoparticles was well dispersed in polyimide matrix with a size of about 50-100 nm for samples with different contents of CeO₂. Thermal analysis indicated that the introduction of CeO₂ decreased the thermal stability of nanocomposite films due to the decomposition of Ce(Phen)₃ in the imidization process, while the glass transition temperature (T_g) increased obviously, especially nanocomposite films with high loading of CeO₂ exhibited a trend of disappearance of T_g. DMTA and static tensile measurements showed that the storage modulus of nanocomposite films increased, while the elongation at break decreased with increasing CeO₂ content.     

Synthesis and characterizations of a polyimide containing a triphenylamine derivative as an interlayer in polymer light-emitting diode

Polyimide containing triphenylamine derivative (TPD-PI) was synthesized to prepare a polymer interlayer having insolubility in common nonpolar solvent for light-emitting polymers. N,N′-diphenyl-N,N′-bis(4-aminophenyl)-1,1-biphenyl-4,4′-diamine, as a new triphenylamine-containing diamine monomer, was synthesized by the palladium-catalyzed amination reaction between 4-nitrodiphenylamine and 4,4′-dibromobiphenyl and subsequent reduction of the nitro-intermediate. The TPD-PI was prepared from the synthesized diamine monomer and 4,4′-(hexafluoropropylidene)-diphthalic anhydride by the standard two-step polymerization method, which involved ring-opening polymerization and subsequent cyclodehydration. The structures and properties of the monomer and the resulting polyimide were characterized with ¹H and ¹³C NMR, elemental analysis, gel permeation chromatography, UV-visible spectroscopy, etc. The TPD-PI is readily soluble in aprotic polar solvents such as N-methyl-2-pyrrolidinone and N,N-dimethylformamide and insoluble in nonpolar solvents such as toluene and xylene. The highest occupied molecular orbital (HOMO) level of the TPD-PI was measured to be 5.5 eV by a photoelectron spectrometer in air, and the band gap was calculated as 3.1 eV from the onset of UV-vis spectrum. The polymer light-emitting diode with the thin TPD-PI layer between a hole injection layer and an emitting polymer layer was fabricated to examine the performance of the polyimide as an polymer interlayer. Although the luminous efficiency of the device is lowered by the introduction of the TPD-PI interlayer, the lifetime of the device is improved.     

Effects of titania content and plasma treatment on the interfacial adhesion mechanism of nano titania-hybridized polyimide and copper system

Nano-titania (TiO₂) incorporated into polyimide (PI) matrix can significantly enhance the adhesion strength for PI/TiO₂ hybrid film and copper system. Surface modifications by various plasma treatments (Ar, Ar/N₂ and Ar/O₂) were also applied in this study to improve the adhesion strength. The Ar/N₂ plasma treatment is regarded as the more effective way in promoting the adhesion strength. The maximum adhesion value of 9.53 N/cm was obtained for the PI/TiO₂-1 wt% hybrid film with Ar/N₂ plasma treatment. It is enhanced about 10 times as large as pristine PI. Furthermore, by Ar/O₂ plasma treatment, a weak boundary of copper oxide was formed at the interlayer between PI/TiO₂ hybrid film and copper which decreases the adhesion strength. The effects of plasma treatment and content of nanosized TiO₂ on the adhesion strength between PI/TiO₂ hybrid film and copper system were studied. Atomic force microscope and contact angle analyses were used to measure the changes in surface morphology and surface energy as a result of plasma treatment. Besides, the interfacial states of peeled-off polymer side and copper side were investigated by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). Based on the result of XPS spectra, the peeled-off failure mode between PI/TiO₂ hybrid film and copper was proposed in this study.     

Preparation and characterization of nanoporous polyimide films from triblock copolyimides

Nanoporous polyimide films were prepared from triblock copolyimides. A thermally labile polymer, poly(propylene glycol), was incorporated into polyimides based on 4,4-(hexafluoroisopropylidene)diphthalic anhydride to obtain triblock copolyimides. Nanofoams were formed by thermolysis of the labile block. The thermal properties of the copolymers were investigated by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The nanopores were characterized by scanning electron microscopy (SEM).