Metalorganic chemical vapor deposition of silver thin films for future interconnects by direct liquid injection system

Deposition of Ag films by direct liquid injection-metal organic chemical vapor deposition (DLI-MOCVD) was chosen because this preparation method allows precise control of precursor flow and prevents early decomposition of the precursor as compared to the bubbler-delivery. Silver(I)-2,2-dimethyl-6,6,7,7,8,8,8-heptafluoro-3,5-octanedionato-triethylphosphine [Ag(fod)(PEt₃)] as the precursor for Ag CVD was studied, which is liquid at 30 °C. Ag films were grown on different substrates of SiO₂/Si and TiN/Si. Argon and nitrogen/hydrogen carrier gas was used in a cold wall reactor at a pressure of 50–500 Pa with deposition temperature ranging between 220 °C and 350 °C. Ag films deposited on a TiN/Si diffusion barrier layer have favorable properties over films deposited on SiO₂/Si substrate. At lower temperature (220 °C), film growth is essentially reaction-limited on SiO₂ substrate. Significant dependence of the surface morphology on the deposition conditions exists in our experiments. According to XPS analysis pure Ag films are deposited by DLI-MOCVD at 250 °C by using argon as carrier gas.     

Barrier layer effect of tantalum on the electromigration in sputtered copper films on hydrogen silsesguioxane and SiO2

As IC devices scale down to the submicron level, the resistance-capacitance (RC) time delays are the limitation to circuit speed. A solution is to use low dielectric constant materials and low resistivity materials. In this work, the influence of underlying barrier Ta on the electromigration (EM) of Cu on hydrogen silsesquioxane (HSQ) and SiO₂ substrates was investigated. The presence of a Ta barrier not only improves the adhesion between Cu and dielectrics, but also enhances the crystallinity of Cu film and improves the Cu electromigration resistance. The activation energy obtained suggests a grain boundary migration mechanism and the current exponent calculated indicates the Joule heating effect.     

Evidence of late palaeozoic thermalwater metallization in South Yongmei Depression

This paper discusses the seafloor thermalwater spout sedimentary activity in South Yongmei Depression according to the following evidences: the Yongmei region was in an extended tectonic environment of metaplateform and locally developed intracontinental rift aulacogen in company with the activity of rich alkali, high potassium volcanics of double-peak type. Several kinds of hydrothermal sedimentary rocks and the ore-bearing sedimentary formations of copper-polymetals, iron and manganese exist in this region with a zoning feature of the seafloor thermalwater spout sedimentation. Project supported by the Science Foundation of NECC for Returns Synopsis of the first author Wu Chengjian, associated professor, born in 1957, majoring in ore deposit and mineralgraphy.     

氮气氛下LTCC基板Cu共烧金属化研究

从PMMA型LTCC素坯膜的制备和PMMA的排胶机理两方面，研究了LTCC基板Cu共烧金属化。结果表明，采用PMMA作为粘结剂的流延浆料具有剪切变稀行为，所得的流延坯膜微观组织均匀，叠压后坯体内部无分层现象。热失重、差热和傅立叶红外光谱联用分析结果表明高纯N2气氛中PMMA以解聚机理热解，热解后释放的主要产物为丙烯酸甲酯。在高纯N2气氛中LTCC与Cu共烧后Cu金属化膜平整、致密，连通良好。经测试，基板表面Cu导体方阻小于5mΩ/□。     

Protecting the infrastructure with thermal spray coatings—Technical note

Thermal sprayed aluminum and zinc provide long-term (> 20 years to first maintenance) corrosion control coatings. However, this application is usually more expensive than painting or galvanizing if thermal spraying (metallizing) is not integrated into the design and fabrication phases of new construction and repair projects. Aluminum and zinc metallized coatings are tough enough to withstand fabrication, transportation, and assembly operations. The improved capabilities and productivity of metallizing equipment for aluminum and zinc spraying are a major factor in their current cost competitiveness. The net result is that the cost difference between metallizing, paint, and galvanizing is getting closer every day. Even though the initial application cost of metallizing may be higher, the life cycle cost (LCC) and average equivalent annual costs (AEAC) are lower than paint coating systems. Metallizing LCCs, when properly engineered into the construction schedule, are equal to or less than paint coating LCCs. This article summarizes some metallizing considerations for installing improved corrosion control coating systems in new construction and in maintenance and repair of infrastructure. Editor’s Note: The following constants have been used to convert between English and Metric dimensions: 1ft²-0.0929 m²; 1lb/ft²-4.89 kg/m²; 1 mil=0.025mm. Presented at the 5th National Thermal Spray Conference (NTSC-93), Infrastructure Maintenance and Repair Session, 10 June 1993, Anaheim, CA.     

碳纤维喇叭天线制造工艺研究

喇叭天线是雷达系统中重要的功能件,碳纤维材料由于具有金属材料不具备的某些优异性能,在雷达系统中的应用越来越广泛。文中介绍了一种碳纤维喇叭天线的制造工艺过程,对喇叭天线原型结构的工艺改进设计满足碳纤维材料热压罐成型工艺和成型模具设计要求;成型模具结构设计满足零件尺寸精度、脱模以及零件批量生产要求;碳纤维喇叭天线表面金属化达到了金属层致密、均匀、光顺以及导电率指标。通过以上工艺过程研究,制造出满足指标要求的碳纤维喇叭天线,可为此类碳纤维喇叭天线制造提供工艺借鉴。     

掺(Ga,Si)银铝浆对n型TOPCon太阳能电池电性能的影响

银铝浆是新一代太阳能电池(n型TOPCon)的关键材料,但其金属化后在Si发射极表面形成很大且很深的“银铝尖钉”,尖钉易击穿p-n结造成短路,成为限制其应用的瓶颈。引入Si、Ga元素对银铝浆进行优化,分别制备了掺Si和掺Ga, Si的银铝浆,研究其对金属化区域暗态饱和电流密度J_0.metal、欧姆接触电阻R_c的影响机制。结果表明：掺入少量Si后,金属化区域未见明显“银铝尖钉”,说明掺Si后抑制了在浆料金属化时出现“银铝尖钉”的现象,对p-n结损伤较小,J_0.metal下降,开路电压V_oc上升,但是R_c增大。再掺入Ga组分后“银铝尖钉”明显变浅,数量变多,R_c下降,弥补了掺Si银铝浆欧姆接触差的弊端,有较高的电池转换效率;用扩散浓度测试仪(ECV)对发射极表层进行元素浓度分析,发现Ga分布于表层0～50 nm处,有利于改善欧姆接触。研究了Ga、Si的掺入量对银铝浆电性能的影响,电池转换效率最高达到24.68%,太阳能电池效率提升0.55%。     

电真空器件用陶瓷二次金属化镀镍层起泡现象的研究

陶瓷二次金属化镍层烧结后起泡是影响产品质量和合格率的一个主要因素,本文针对陶瓷的一次金属化和二次金属化工艺,经XPS、XRF、SEM等方法分析,得出:陶瓷的二次金属化起泡与其沉积层的基材和沉积层的厚度有关,陶瓷一次金属化烧结后钼的特殊形貌--钼颗粒较大、颗粒之间结合疏松和钼的电化学特性,决定钼上的沉积层厚度必须在合适范围内--4～9μm,才能减小沉积层中的应力,保证烧结后镍层与钼有良好的结合力.