Fuzzy adaptive networks in machining process modeling: surface roughness prediction for turning operations

Due to the complexity of the machine tool structure and the cutting process, the dynamics of machining processes are still not completely understood. This is especially true due to the demand of high-speed machining to increase productivity. In order to model and control these complex processes, new approaches, which can represent complex phenomenon combined with learning ability, are needed. The combined neural–fuzzy approach appears to be ideally suited for this purpose. In this paper, the recently developed fuzzy adaptive network (FAN) is used to model surface roughness in turning operations. The FAN network has both the learning ability of neural network and linguistic representation of complex, not well-understood, vague phenomenon. Furthermore, it can continuously improve the initially obtained rough model based on the daily operating data. To illustrate this approach, a model representing the influences of machining parameters on surface roughness is established and then the model is verified by the use of the results of pilot experiments. Finally, a comparison with the results based on statistical regression is provided.     

Emissivity Measurements on Metallic Surfaces with Various Degrees of Roughness: A Comparison of Laser Polarimetry and Integrating Sphere Reflectometry

Both integrating sphere reflectometry (ISR) as well as laser polarimetry have their advantages and limitations in their ability to determine the normal spectral emissivity of metallic samples. Laser polarimetry has been used for years to obtain normal spectral emissivity measurements on pulse-heated materials. The method is based on the Fresnel equations, which describe reflection and refraction at an ideally smooth interface between two isotropic media. However, polarimetry is frequently used with surfaces that clearly deviate from this ideal condition. Questions arise with respect to the applicability of the simple Fresnel equations to non-specular surfaces. On the other hand, reflectometry utilizing integrating spheres provides a measurement of the hemispherical spectral reflectance, from which the normal spectral emissivity can be derived. ISR provides data on spectral-normal-hemispherical reflectance and, hence, normal spectral emissivity for a variety of surfaces. However, the resulting errors are minimal when both the sample and the reference have a similar bidirectional reflectance distribution function (BRDF). In an effort to explore the limits of polarimetry in terms of surface roughness, room temperature measurements on the same samples with various degrees of roughness were performed using both ISR and a laser polarimeter. In this paper the two methods are briefly described and the results of the comparison are discussed.     

镀锌产品表面粗糙度影响因素的研究

以马钢第四钢轧总厂1#镀锌线的产品为研究对象,通过大量的数据检测,分析了热浸镀锌产品带钢表面粗糙度的影响因素,并得出变化规律。这些规律可以运用到实际生产中来对带钢表面的粗糙度进行计算和控制。     

SURFACE ROUGHNESS OF SPUTTERED SILICON. II. MODEL VERIFICATION

Experimental verification of the mathematical surface roughness model for sputtered silicon was performed. The beam shape and its significant level of intensity were determined first by measuring the topography of craters sputtered by focused ion beam (FIB). Then the beam function was generated for various combinations of beam parameters. The material function was developed both by theoretical and experimental analysis. These two functions were then used in the model to calculate the theoretical surface roughness. Microsurface analysis was formed by FIB sputtering of a (100) silicon wafer. The surface roughness at the bottom of the sputtered features was then measured using an atomic force microscope. The theoretical surface roughness was found to be within ±1 and ±5 nm of the measured surface roughness with the measurement uncertainty (standard deviation) of about ±0.36 and ±0.85 nm for R_a and R_t, respectively.     

Contrast-based evaluation of mar resistance of thermoplastic olefins

The physical aspect of mar behavior is studied by applying a standardized progressive sliding load methodology to smooth and textured automotive-grade thermoplastic olefins. It is shown that surface texture has a strong effect on light scattering and, hence, the propensity for mar visibility. It is also shown that digital imaging via a desktop scanner can be used to quantitatively and objectively assess mar resistance using contrast as a basis. Incorporation of slip agent definitively improves the mar resistance for both types of surfaces. Relationships between contrast, gloss and surface roughness in relation to mar visibility are discussed.     

软X射线多层膜的光学性质和优化设计

一、引言 X射线多层膜是X激光和X光学的重要元件。近几年,不论在理论上还是在技术上,都得到了较快发展。 从X光晶体衍射角度出发,X射线多层膜可看作超晶格一维人工晶体。从薄膜光学出发,X射线多层膜是一类光学薄膜。这种薄膜的膜层很薄,折射率都接近1,并存在一定的吸收。X     

Characterization of surface roughness anisotropy on mismatched InAIAs/lnP heterostructures

We have studied surface roughness on mismatched In_0.65Al_0.35As epilayers of various thicknesses on (001) InP. The sample set spans the entire range from coherently strained to completely relaxed epilayers. As characterization tools, we have used atomic force microscopy (AFM), laser light scattering (LLS), and variable azimuthal angle ellipsometry (VAAE). AFM reveals that the surfaces are covered by densely packed ellipsoidal islands elongated along the [1-10] direction. The island size increases with layer thickness. Island anisotropy and the root mean square of the surface roughness increase with increasing thickness but decrease upon full lattice relaxation. LLS intensity displays a prominent azimuthal dependence that correlates well with the two-dimensional power spectrum of the surface topography, as predicted by theory. VAAE reveals a sinusoidal dependence of the ellipsometric parameter Δ on azimuthal angle. The amplitude of A correlates well with the short wavelength anisotropy of the surface power spectrum. Our work suggests that LLS and VAAE are fast, nondestructive, sensitive techniques for characterization of surface roughness in mismatched III-V heterostructures.     

Experimental Investigation of Epoxy Bonded Polymethylmethacrylate Joints

This paper presents an experimental investigation into various aspects of epoxy-bonded polymethylmethacrylate (PMMA) and PMMA-to-aluminium joints. The effects of adhesive thickness, overlap area, surface roughness, and environmental exposure on the joint strength were studied. Results indicated that the joint strength was not directly proportional to the overlap area, while sanding had a positive effect on the joint strength. A negative effect was observed when adhesive thickness was increased. The fatigue behaviour of adhesively-bonded joints under dynamic loading was found to be independent of frequency, for the range of values tested; however, it was dependent on the test temperature with greater reduction in fatigue life observed in PMMA-to-aluminium joints at higher temperature. Empirical equations from which the fatigue life of joints can be predicted were obtained by regression analysis. Intermittent fatigue testing of the joints was also performed. The epoxy adhesive tested proved to be a satisfactory choice for outdoor exposure. The rate of degradation of the adhesive was slow with the adherend itself degrading at a faster rate than the adhesive or the bondline.     

Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration

In order to achieve copper wafer bonding with good quality, surface conditions of copper films are important factors. In this work, the effects of surface conditions, such as surface roughness and oxide formation on the bond strength, were investigated under different bonding conditions. Prior to bonding, copper film surfaces were kept in the atmosphere for less than 1 min, 3 days, and 7 days, respectively, to form different thicknesses of oxide on the surface. Some copper wafers were cleaned using HCl before bonding in order to remove the surface oxide. Surface roughness of copper films with and without HCl cleaning was examined. Since surface cleaning before bonding removes oxides but creates surface roughness, it is important to study the corresponding bond strength under different bonding conditions. These results offer the required information for the process design of copper wafer bonding in three-dimensional integration applications.