黑龙江省节水增粮行动(2012—2015年)实施方案

文章通过对黑龙江省高效节水现状,存在问题的分析,结合黑龙江省高效节水发展的支撑能力,阐述黑龙江省节水增粮目标、任务及总体布局,为黑龙江省2012—2015年节水增粮实施提供依据。     

生物包粒的分类与命名——兼论徐州大北望中下寒武统生物包粒特征

对于碳酸盐岩中由生物及生物化学作用形成的具有同心或放射结构的异化颗粒(生物包粒),已为人们所熟悉,但目前还没有统一的分类与命名。本文在研究徐州大北望中下寒武统生物包粒特征的基础上,结合已有研究成果,对由生物及生物化学作用形成的具有同心或放射状内部结构的碳酸盐颗粒,按其粒度和形成颗粒的生物类型不同进行分类命名,提出分类命名的原则。     

Grain Boundary Sliding in Fatigue of Pure Aluminum

The distributions of plastic strain near grain boundaries induced by fatigue loading were investigatedby the fiducial grid method in pure aluminum specimens, and the resulted grain boundary sliding(GBS) was systematically analysed. The results show that the strain field near a grain boundary isnonuniform. GBS is restricted by the junction of grain boundaries and causes discontinuities of bothdisplacement and strain. A peak value of shear strain was created in short-range area across the grainboundary. GBS plays an important role in cyclic softening and secondary hardening. The control fac-tor of GBS is the relative orientation between two grains and the macro orientation of the grainboundary rather than the ∑ value of the boundary.     

关于我国的粮食标准

本文总结了我国粮食标准的历史，将历次我国小麦标准和小麦粉标准的技术指标，分别集中列表，并据以估计我国优质小麦标准的良好发展前景。     

The microstructure of Cu films deposited by the self-ion assisted technique

The microstructures of Cu films deposited by the self-ion assisted, partially ionized beam (PIB) deposition technique under two different accelerating potentials, 0 KeV and 6 KeV, are compared. The 6 KeV film shows a bimodal (111) fiber and (100) fiber texture with an abundance of twin boundaries and a relatively large average grain size with a typical lognormal distribution. The 0 KeV film consists of small, mostly (111) oriented grains with islands of abnormally large (100) grains. The controlling factors for the abnormal growth of the (100) grains are discussed in relation to the observed microstructures, showing that all factors necessary for abnormal (100) growth are present in the films.     

Effects of hot-carrier stress on high performance polycrystalline silicon thin film transistor with a single perpendicular grain boundary

This paper is a report on the effect of a single perpendicular grain boundary on the hot-carrier and high current stability in high performance polycrystalline silicon (poly-Si) thin film transistors (TFTs). Under a hot carrier stress condition (Vg = Vth + 1 V, Vd = 12 V), the poly-Si TFT with a single grain boundary is superior to the poly-Si without any grain boundary because of the smaller free carriers available for electric conduction. The shift of transconductance in poly-Si TFT with a single grain boundary is less than 5% after hot carrier stress during a period of 1000 s. The shift of transconductance is about 25% in the case of the poly-Si TFTs without a grain boundary in the channel. On high current stress, the poly-Si TFT without the grain boundary is less degraded than the poly-Si TFT with the grain boundary because the concentrated electric field near the drain junction is lower.     

高温和低张应力引起的非平衡晶界偏聚动力学(Ⅱ)--实验结果的动力学模拟

以文献[1]建立的张应力引起的非平衡晶界偏聚动力学方程模拟了Shinoda T等的磷在钢中的应力时效实验结果和Misra R D K的硫在钢中的应力时效实验结果，模拟结果与实验结果互相吻合。通过模拟发现，张应力使磷-空位复合体以及硫-空位复合体在钢中的扩散系数均增加3个数量级，且磷原子和硫原子的扩散系数分别降低3个和5个数量级。     

降低气体悬浮焙烧炉焙烧过程中Al_2O_3粒度破损的措施

为了降低气体悬浮焙烧炉焙烧过程中Al_2O_3粒度的破损,对气体悬浮焙烧炉焙烧过程中氧化铝粒度的影响因素进行了分析,提出了降低粒度破损的一些措施。     

影响铁精矿K2O、Na2O、SiO2含量的因素分析

用统计分析方法 ,分析了影响精矿K2 O、Na2 O、SiO2 含量的因素 ,并根据分析结论提出了对生产工艺进行定向控制的条件     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.