A novel approach for bulk micromachining of 4H-SiC by tool-based electrolytic plasma etching in HF-free aqueous solution

Bulk micromachining of single-crystal SiC has been challenging due to its extreme stability both mechanically and chemically. To address this issue, a novel tool-based electrolytic plasma etching method is proposed, with which micropatterns and micro-holes are fabricated in SiC in a hydrofluoric acid-free aqueous solution with no need for masks. The material removal is the result of the combined effects of electrolytic plasma chemistry and physics. The chemistry refers to the reaction of Si with hydroxyl radical to form various SiO_x and with H to form silanes, and the reactions of C to form volatile carbon oxides or hydrocarbons, all of which are accomplished and enhanced under the electrolytic plasma atmosphere. Besides, the local high temperature of plasma thermally promotes the evaporation or dissolution of SiO₂ in NaOH solution. The tool-based electrolytic plasma etching method provides alternative approaches for the fabrication of SiC-based MEMS and devices.     

铜基正弦波微通道内流动沸腾传热特性试验研究

基于超快激光技术加工铜基正弦波弯曲型微通道，以去离子水为流动工质，在不同质量流量和热通量条件下，对弯曲型微通道内流动沸腾特性进行试验研究。基于温度/压力数据和流动可视化结果，发现通道传热系数随出口干度增大，呈迅速增大后减小并趋于稳定趋势，正弦波微通道相较直微通道具有更好的换热性能，传热系数最大提高127.7%，压降仅增加14.4%。波状通道结构能明显抑制流动沸腾中不稳定现象发生。通过可视化试验发现，随热通量增大，流型经历泡状流-弹状流-环状流的转变，换热主导机制由核态沸腾逐渐过渡到薄液膜蒸发。     

High sensitivity nanostructure incorporated interdigital silicon based capacitive accelerometer

Interdigital structures are realized on silicon substrates with high sensitivity to acceleration. The process employs a combination of anisotropic back-side micromachining with front-side vertical deep reactive ion etching of silicon. The incorporation of silicon-based nano-structures on the vertical planes of fingers leads to a significant increase in the capacitance of the device from 0.45 for simple planes to 40 pF for the nano-structured planes. Such structures show high sensitivity to inclination and accelerations, which could be due to field emission of electrons from nano-metric features. Around 8% change in the capacitance is observed upon a tilting sensor from 0° to 90° angle, which makes it proper for possible use as an earthquake sensor. A preliminary model for the capacitance and its dependence on the measurement voltage is presented.     

扑翼微飞行器紫外激光加工技术

为了实现微米尺度扑翼微飞行器的加工,运用了加工材料范围广的紫外激光切割技术,以及碳纤维预浸料的真空袋高温高压固化工艺,通过合理安排工艺流程,实现了一种适于微米尺度复杂机械结构、可采用材料广泛且可以小批量快速加工的加工技术.并将其应用于扑翼微飞行器的加工,得到了一个翼展3 cm,最小尺寸为80 μm的飞行器样机.     

新型摇摆质量微陀螺的设计与制作(英文)

首先介绍了两种结构完全对称的高灵敏度的摇摆质量陀螺.设计并制作了一种对角驱动的新型摇摆质量微陀螺.利用硅的各向异性湿法腐蚀等MEMS体加工技术,简化了该微陀螺的制作工艺.该微结构的对称性、一致性和加工精度有很大改善,尤其是振动梁、激励部件和敏感部件等关键部件.详细阐述了该微陀螺的工作原理和结构设计,完成了微陀螺关键部件的制作和样机组装.利用NF公司的FRA 5087频率响应分析仪测试了样机大气下的振动模态,其中驱动频率为5.563 2 kHz,检测频率为5.553 4 kHz,频差为9.8 Hz,小于0.2%.利用频谱分析的方法测试了样机的哥氏力.测试结果表明这种摇摆质量微陀螺的设计与制作方法是可行的.     

Experimental study and analysis of corner compensation structures for CMOS compatible bulk micromachining using 25 wt% TMAH

In the present work, most common compensation structures (〈1 1 0〉 squares and 〈1 0 0〉 bars) have been used for convex corner compensation with 25 wt% TMAH-water solution at 90±1 °C temperature. Etch flow morphology and self-align properties of the compensating structures have been investigated. For 25 wt% TMAH water solution {3 1 1} plane is found to be responsible for corner undercutting, which is the fast etch plane. Etch-front-attack angle is measured to be 24°. Generalized empirical formulas are also discussed for these compensation structures for TMAH-water solution. 〈1 1 0〉 square structure protects mesa and convex corner and is the most space efficient compared to other compensation structures, but unable to produce perfect convex corner as 〈1 0 0〉 bar type structures. Both the 〈1 0 0〉 bar structures provide perfect convex corners, but 〈1 0 0〉 wide bar structure is more space efficient than the 〈1 0 0〉 thin bar structure. Implications of these compensation structures with realization of accelerometer structure have also been discussed. A modified quad beam accelerometer structure has been realized with these compensation structures using 25 wt% TMAH.     

p-Si薄膜在氢氟酸溶液中的电化学抛光

p-Si薄膜在氢氟酸溶液中的电化学抛光是通过阳极溶解降低薄膜表面粗糙度.本文用线性扫描研究了在不同的氢氟酸浓度下的电化学行为,发现随氢氟酸溶液浓度的增加阳极溶解速率也随之增加.当氢氟酸浓度为4％及6％时,可得到平整的表面.电化学抛光技术为制备光亮硅面提供了一种简单可行的方法.     

Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials – An adaptive calibration algorithm

Focused Ion Beam (FIB) micromachining of Solid Immersion Lenses (SILs) in substrate material offers optical analysis solutions for current and future technologies without the limitations of external SIL systems. This work presents an efficient single iteration calibration algorithm. This algorithm enables the implementation of FIB created SILs using a variety of substrate materials, process chemistries and most importantly different SIL shapes to match sample thicknesses. The successful application on silicon and silicon carbide is presented by creating a 50 μm wide refractive lens segment with a radius of curvature of 60 μm. Laser scanning microscope images of a silicon sample demonstrate the optical benefit with a measured resolution of 274 nm.     

Development Aspects of an Integrated Pyroelectric Array Incorporating a Thin PZT Film and Radiation Collectors

Work is being undertaken to produce an uncooled pyroelectric infra-red detector array which incorporates within its structure, an array of radiation collectors made by the bulk micro-machining of silicon. Development aspects of the processing route are presented here.     

一种高深宽比微细槽的电火花加工工艺

为实现高深宽比微槽的加工,提出了一种自成形和扫描加工相结合的微细扁平电极制作及微细槽加工的工艺方法.采用棒状毛坯电极在一平板试件上扫描加工出一定长度的通槽,将毛坯电极沿垂直通槽方向向左和右偏移,两侧分别进行电火花反拷加工,得到扁平微细电极.再采用该扁平电极在线进行扫描加工即可得到期望的微细槽.实验获得了深径比大于18及尺寸一致性较高的阵列微细槽.与反拷或线电极磨削得到微细电极相比,自成形电极方法降低安装精度要求.而采用扁平电极进行微深槽的微细电火花加工,相对提高电极截面面积,降低电极损耗率,有利于提高加工效率.