Scanning Probe Lithography Patterning of Monolayer Semiconductors and Application in Quantifying Edge Recombination

Scanning probe lithography is used to directly pattern monolayer transition metal dichalcogenides (TMDs) without the use of a sacrificial resist. Using an atomic‐force microscope, a negatively biased tip is brought close to the TMD surface. By inducing a water bridge between the tip and the TMD surface, controllable oxidation is achieved at the sub‐100 nm resolution. The oxidized flake is then submerged into water for selective oxide removal which leads to controllable patterning. In addition, by changing the oxidation time, thickness tunable patterning of multilayer TMDs is demonstrated. This resist‐less process results in exposed edges, overcoming a barrier in traditional resist‐based lithography and dry etch where polymeric byproduct layers are often formed at the edges. By patterning monolayers into geometric patterns of different dimensions and measuring the effective carrier lifetime, the non‐radiative recombination velocity due to edge defects is extracted. Using this patterning technique, it is shown that selenide TMDs exhibit lower edge recombination velocity as compared to sulfide TMDs. The utility of scanning probe lithography towards understanding material‐dependent edge recombination losses without significantly normalizing edge behaviors due to heavy defect generation, while allowing for eventual exploration of edge passivation schemes is highlighted, which is of profound interest for nanoscale electronics and optoelectronics.     

Exploration of amorphous hollow FeOOH@C nanosphere on energy storage for sodium ion batteries

Sodium ion batteries (SIBs) have enjoyed a high profile in recent years and gradually been commercialized to supplement the lithium-ion batteries system. However, the large volume expansion of anode materials within discharging and low electrical conductivity hinder the application of SIBs. In this work, a FeOOH@C composite was synthesized with the use of hydrothermal method and pyrolyzing of polydopamine. The amorphous FeOOH exhibits a hollow spherical structure to offer free space for buffering the volumetric variation. Furthermore, the outer carbon served as a protective shell could maintain the sphere integrity and enhance the electrical conductivity. Hence, benefiting from the achieved synergy of the hollow architecture, amorphous structure and carbon shell, the composite presented a long cycle life (316 mA h g^?1 after 500 cycles at a current density of 100 mA g^?1 and 234.5 mA h g^?1 after 400 cycles at 2 A g^?1) and high-rate performance (180 mA h g^?1 at 5 A g^?1), revealing a potential to be a promising candidate for electrode material of SIBs.     

Design,fabrication of honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays for 2D ultrasound transducer application

As a core component of 2D ultrasound transducers, honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays have attracted enormous attention due to their unique performance and functionality. In this paper, honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays with a high aspect-ratio were designed and fabricated by means of deep X-ray lithography and powder injection molding in six steps: preparation of lost mold, powder-binder mixing, injection molding and demolding, removal of binders, and densification of powder. A polymer-based lost mold insert was generated by a synchrotron X-ray exposure and development process. The optimal volumetric ratio between the piezoelectric powder and binders was determined by torque rheology behavior, then they were homogeneously mixed with a twin extruder mixer. To fully fill in the micro-cavities of the lost mold, rheological properties of the mixture were analyzed with a capillary rheometer using different shear rates (50–5000 s⁻¹) and temperatures (140 °C, 150 °C, and 160 °C). After the mixture was completely injected, the lost mold was chemically dissolved in acetone and rinsed in methanol without bending or clustering of the micropillar arrays during evaporation. The binders in the injection molded portion were thermally decomposed using a continuous heating schedule of 200 °C, 390 °C, and 600 °C in argon gas under atmospheric conditions. Finally, the particles in the sample were densified into a coherent, solid mass by eliminating pores at 1300 °C. Based on the proposed micro-manufacturing process, defect-free honeycomb-shaped 1–3 connectivity piezoelectric micropillar arrays with a pattern dimension of 42 μm and aspect-ratio of 5 were successfully produced.     

Developing novel liquid crystal technologies for display and photonic applications

Modern liquid crystal displays (LCDs) require novel technologies, such as new alignment methods to eliminate alignment layers, fast response and long operation time. To this end, we report an overview of recent efforts in LCD technologies devoted to realize more display modes having no alignment layer, faster switching time and low battery consumption. In particular, we overview recent advances on the liquid crystals (LCs) alignment for display applications, which includes superfine nanostructures, polymeric microchannels and polymer stabilized LCs. Furthermore, we analyze the main optical and electro-optical properties of new generation LCDs displays addressing a particular attention to LCs blue phase hosting gold nanoparticles. Moreover, we focus on the progress of electrofluidic displays, which demonstrates characteristics that are similar to LCDs, with attention on various pixel designs, operation principles and possible future trends of the technology.     

X射线干涉光刻光束线关键光学元件热-结构耦合分析

为了保证上海光源X射线干涉光刻光束线的稳定性,减小热变形对实验结果的影响,对X射线干涉光刻光束线的3个关键光学元件——偏转镜、聚焦镜和精密四刀狭缝进行热-结构耦合分析。首先,计算偏转镜、聚焦镜和精密四刀狭缝所承载的功率密度;然后,建立其有限元模型;最后,获得光学元件的温度场和热变形的结果。结果表明,偏转镜和聚焦镜采用间接水冷方式可有效抑制热变形,冷却后的最大面形误差分别为7.2μrad和9.2μrad。精密四刀狭缝未冷却时,刀片组件温度介于271.56~273.27℃,刀口热变形为0.19 mm,直线导轨热变形为0.08 mm;经过铜辫子冷却后,刀片组件温度降至22.24~23.94℃,刀口热变形降至0.2μm,直线导轨热变形降至0.1μm;采用影像法和接触探头法测试后,刀口直线度、平行度和重复精度均满足技术要求。偏转镜、聚焦镜和精密四刀狭缝的热变形通过间接水冷和铜辫子的冷却方式可以得到很大程度的抑制,进而保证光斑质量。     

IC制造工艺与光刻对准特性关系的研究

主要针对光刻对准特性,从单项工艺和工艺集成的角度,分析了影响光刻对准的各个主要因素,主要包括对准标记、工艺层、隔离技术等,提出了一些改善光刻对准效果的方法.     

镝离子掺杂纳米二氧化钛空心球的合成及其光化学性能

以钛酸四丁酯为钛源,利用水热制备的纳米碳球为模板,通过超声辅助法合成了不同镝掺杂量的二氧化钛空心球。通过XRD、SEM、TEM、EDX、UV-Vis和荧光光谱对其形貌和光谱性质进行了表征,并讨论了镝掺杂前后对产物结构形貌的影响。研究结果表明,利用碳球为模板制备的镝掺杂的二氧化钛球尺寸可控且在430 nm附近发出宽而强的蓝光。